Xinyan Yan, Ph.D.
Affiliations: | 2001 | University of Wisconsin, Madison, Madison, WI |
Area:
Metallurgy Engineering, Materials Science EngineeringGoogle:
"Xinyan Yan"Parents
Sign in to add mentor| Austin Y. Chang | grad student | 2001 | UW Madison | |
| (Thermodynamic and solidification modeling coupled with experimental investigation of the multicomponent aluminum alloys.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Yan X, Lin JC. (2006) Prediction of Hot Tearing Tendency for Multicomponent Aluminum Alloys Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science. 37: 913-918 |
| Chang YA, Chen S, Zhang F, et al. (2004) Phase diagram calculation: past, present and future Progress in Materials Science. 49: 313-345 |
| Xie F, Yan X, Ding L, et al. (2003) A study of microstructure and microsegregation of aluminum 7050 alloy Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 355: 144-153 |
| Ding L, Ladwig PF, Yan X, et al. (2002) Thermodynamic stability and diffusivity of near-equiatomic Ni–Mn alloys Applied Physics Letters. 80: 1186-1188 |
| Yan X, Chen S, Xie F, et al. (2002) Computational and experimental investigation of microsegregation in an Al-rich Al–Cu–Mg–Si quaternary alloy Acta Materialia. 50: 2199-2207 |
| Huang M, Xie F, Yan X, et al. (2001) Vacancy concentrations in the B2 intermetallic phase PdIn at 900°C Intermetallics. 9: 457-460 |
| Yan X, Xie F, Chu M, et al. (2001) Microsegregation in Al–4.5Cu wt.% alloy: experimental investigation and numerical modeling Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 302: 268-274 |
| Yan X, Chang YA, Zhang F. (2000) A thermodynamic analysis of the Mg-Si system Journal of Phase Equilibria. 21: 379-384 |
| Yan X, Chang YA. (2000) A thermodynamic analysis of the Cu–Si system Journal of Alloys and Compounds. 308: 221-229 |