Xian Tang, Ph.D.

Affiliations: 
2013 The Chinese University of Hong Kong, Hong Kong, Hong Kong 
Area:
Electronics and Electrical Engineering
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"Xian Tang"

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Kong-Pang Pun grad student 2013 Chinese University of Hong Kong
 (Design Techniques for Power-efficient Data Converters in Deep Sub-micron CMOS Technologies.)
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Publications

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Cheng Q, Li W, Tang X, et al. (2019) Design and Analysis of Three-Stage Amplifier for Driving pF-to-nF Capacitive Load Based on Local Q-Factor Control and Cascode Miller Compensation Techniques Electronics. 8: 572
Peng K, Tang X, Mai S, et al. (2019) A Simultaneous Power and Downlink Data Transfer System With Pulse Phase Modulation Ieee Transactions On Circuits and Systems Ii-Express Briefs. 66: 808-812
Tang X, Zeng J, Pun KP, et al. (2018) Low-Cost Maximum Efficiency Tracking Method For Wireless Power Transfer Systems Ieee Transactions On Power Electronics. 33: 5317-5329
Tang X, Pun KP. (2017) A Self-Clocked Resistive CMOS Smart Temperature Sensor for Wireless Sensor Networks Journal of Circuits, Systems, and Computers. 27: 1850091
Tang X, Zeng J, Zheng Y, et al. (2017) Limit-cycle oscillation reduction in high-efficiency wireless power receiver Electronics Letters. 53: 1152-1154
Fu Z, Tang X, Pun K. (2017) Use DAS algorithm to break through the device limitations of switched-capacitor-based DAC in an ADC consisting of pipelined SAR and TDC Solid-State Electronics. 138: 119-125
Ho M, Guo J, Mak KH, et al. (2016) A CMOS Low-Dropout Regulator with Dominant-Pole Substitution Ieee Transactions On Power Electronics. 31: 6362-6371
Wang H, Tang X, Choy CS, et al. (2015) Cascaded Network Body Channel Model for Intra-Body Communication. Ieee Journal of Biomedical and Health Informatics
Wang H, Tang X, Choy CS, et al. (2015) A 5.4-mW 180-cm Transmission Distance 2.5-Mb/s Advanced Techniques-Based Novel Intrabody Communication Receiver Analog Front End Ieee Transactions On Very Large Scale Integration Systems. 23: 2829-2841
Tang X, Ng WT, Pun KP. (2015) A resistor-based sub-1-V CMOS smart temperature sensor for VLSI thermal management Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 23: 1651-1660
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