Ho Gyoung Kim

Affiliations: 
2007 Purdue University, West Lafayette, IN, United States 
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"Ho Kim"

Parents

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Timothy D. Sands grad student 2007 Purdue
 (Effect of interface characteristics on electrical properties of metal-gallium nitride heterostructures.)

Children

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Choon Y. Kim grad student 2011 Purdue
Chih-Yu Chen grad student 2013 Purdue
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Publications

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Kim H, Choi S, Choi BJ. (2020) Influence of AlN and GaN Pulse Ratios in Thermal Atomic Layer Deposited AlGaN on the Electrical Properties of AlGaN/GaN Schottky Diodes The Coatings. 10: 489
Kim H, Choi S, Choi BJ. (2020) Forward Current Transport Properties of AlGaN/GaN Schottky Diodes Prepared by Atomic Layer Deposition The Coatings. 10: 194
Kim H, Yun HJ, Choi S, et al. (2020) Atomic Layer Deposition of AlGaN on GaN and Current Transport Mechanism in AlGaN/GaN Schottky Diodes Materials Transactions. 61: 88-93
Kim H, Yun HJ, Choi S, et al. (2020) Interfacial and electrical properties of nanolaminated HfO2/Al2O3 dielectrics on GaN with an AlN interlayer Semiconductor Science and Technology. 35: 15012
Kim H, Jung MJ, Choi S, et al. (2020) ALD growth of ZnO on p-Si and electrical characterization of ZnO/p-Si heterojunctions Materials Today Communications. 25: 101265
Choi S, Ansari AS, Yun HJ, et al. (2020) Growth of Al-rich AlGaN thin films by purely thermal atomic layer deposition Journal of Alloys and Compounds. 157186
Yun HJ, Kim H, Choi BJ. (2020) Nucleation and growth behavior of aluminum nitride film using thermal atomic layer deposition Ceramics International. 46: 13372-13376
Kim H, Yun HJ, Choi S, et al. (2020) Atomic Layer Deposition of AlN Thin Films on GaN and Electrical Properties in AlN/GaN Heterojunction Diodes Transactions On Electrical and Electronic Materials
Kim H, Yun HJ, Choi S, et al. (2020) Comparison of electrical and interfacial characteristics between atomic-layer-deposited AlN and AlGaN on a GaN substrate Applied Physics A. 126: 1-7
윤희주, 김호경, 최병준, et al. (2019) Growth of Aluminum Nitride Thin Films by Atomic Layer Deposition and Their Applications: A Review Korean Journal of Materials Research. 29: 567-577
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