Igor Volov, Ph.D.
Affiliations: | 2013 | Chemical Engineering | Columbia University, New York, NY |
Area:
Chemical EngineeringGoogle:
"Igor Volov"Parents
Sign in to add mentor| Alan C. West | grad student | 2013 | Columbia | |
| (Copper and Copper Alloys: Studies of Additives.) | ||||
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Publications
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| Volov I, Sun X, Gadikota G, et al. (2013) Electrodeposition of copper-tin film alloys for interconnect applications Electrochimica Acta. 89: 792-797 |
| Volov I, Swanson E, O'Brien B, et al. (2012) Pulse-Plating of Copper-Silver Alloys for Interconnect Applications Journal of the Electrochemical Society. 159: D677-D683 |
| Volov I, Mann O, Hoenersch Y, et al. (2011) Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection Journal of Separation Science. 34: 2385-2390 |
| Volov I, West AC. (2011) Interaction between SPS and MPS in the presence of ferrous and ferric ions Journal of the Electrochemical Society. 158 |
| Volov I, Saito T, West AC. (2011) Investigation of copper plating and additive interactions in the presence of Fe3+/Fe2+ redox couple Journal of the Electrochemical Society. 158 |