Zhe Cheng
Affiliations: | 2015-2019 | Georgia Institute of Technology, Atlanta, GA | |
| 2020-2022 | University of Illinois, Urbana-Champaign, Urbana-Champaign, IL |
Area:
Heat transfer; semiconductorsGoogle:
"Zhe Cheng"Parents
Sign in to add mentor| Samuel Graham | grad student | ||
| David G. Cahill | post-doc | 2020-2022 | (Physics Tree) |
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Publications
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| Xiong Y, Li S, Wang R, et al. (2024) Ultralow Contact Thermal Resistance between Bismuth Selenide Nanoribbons Achieved by Current-Induced Annealing. Acs Applied Materials & Interfaces |
| Feng T, Zhou H, Cheng Z, et al. (2024) Correction to "A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces". Acs Applied Materials & Interfaces |
| Cheng Z, Huang YJ, Zahiri B, et al. (2024) Ionic Peltier effect in Li-ion electrolytes. Physical Chemistry Chemical Physics : Pccp |
| Li R, Hussain K, Liao ME, et al. (2024) Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. Acs Applied Materials & Interfaces |
| Kagawa R, Cheng Z, Kawamura K, et al. (2023) High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C-SiC/Diamond Junctions for Practical Device Processes. Small (Weinheim An Der Bergstrasse, Germany). e2305574 |
| Feng T, Zhou H, Cheng Z, et al. (2023) A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces. Acs Applied Materials & Interfaces |
| Cheng Z, Liang J, Kawamura K, et al. (2022) High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nature Communications. 13: 7201 |
| Cheng Z, Mu F, Ji X, et al. (2022) Correction to "Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance". Acs Applied Materials & Interfaces. 14: 22678 |
| Cheng Z, Li R, Yan X, et al. (2021) Experimental observation of localized interfacial phonon modes. Nature Communications. 12: 6901 |
| Hines NJ, Yates L, Foley BM, et al. (2021) Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications. The Review of Scientific Instruments. 92: 044907 |