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Ki Jin Han, Ph.D. - Publications

Affiliations: 
2009 Georgia Institute of Technology, Atlanta, GA 
 2017- Dongguk University, Seoul, South Korea 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics
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18 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Bae B, Kim J, Han KJ. Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array Ieee Access. 8: 117997-118004. DOI: 10.1109/Access.2020.3003231  0.303
2019 Cho M, Noguchi S, Bang J, Kim J, Bong U, Lee JT, An SB, Bhattarai KR, Kim K, Kim K, Im C, Han KJ, Hahn S. Combined Circuit Model to Simulate Post-Quench Behaviors of No-Insulation HTS Coil Ieee Transactions On Applied Superconductivity. 29: 1-5. DOI: 10.1109/Tasc.2019.2899501  0.308
2019 Yea M, Park J, Lee S, Choi J, Han KJ. Optimization of Lead Insulations for HVDC Converter Transformers Journal of Electrical Engineering & Technology. 14: 2057-2063. DOI: 10.1007/S42835-019-00195-W  0.304
2018 Yea M, Han KJ, Park J, Lee S, Choi J. Design optimization for the insulation of HVDC converter transformers under composite electric stresses Ieee Transactions On Dielectrics and Electrical Insulation. 25: 253-262. DOI: 10.1109/Tdei.2018.006629  0.334
2018 Han KJ, Ahn S. Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2) Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 3-4. DOI: 10.1109/Tcpmt.2017.2787938  0.346
2016 Park HP, Ryu Y, Han KJ, Jung JH. Design considerations of resonant network and transformer magnetics for high frequency LLC resonant converter Journal of Electrical Engineering and Technology. 11: 383-392. DOI: 10.5370/Jeet.2016.11.2.383  0.333
2016 Kim S, Kang S, Han KJ, Kim Y. Novel adaptive power-gating strategy and tapered TSV structure in multilayer 3D IC Acm Transactions On Design Automation of Electronic Systems. 21. DOI: 10.1145/2894752  0.328
2016 Jeong J, Kim J, Kang N, Han KJ. High-Frequency Testing of Vertical Interconnection Array Using Indirect Contact Probing Method With an Improved Calibration Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1638-1647. DOI: 10.1109/Tcpmt.2016.2613823  0.361
2015 Ryu Y, Park BR, Han KJ. Estimation of high-frequency parameters of AC machine from transmission line model Ieee Transactions On Magnetics. 51. DOI: 10.1109/Tmag.2014.2355718  0.361
2015 Xie B, Swaminathan M, Han KJ. FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2405014  0.486
2015 Jeong J, Kim J, Kang N, Han KJ. Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging Ieee Microwave and Wireless Components Letters. 25: 70-72. DOI: 10.1109/Lmwc.2014.2369951  0.302
2014 Han KJ, Lim Y, Kim Y. A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameter Journal of Semiconductor Technology and Science. 14: 649-657. DOI: 10.5573/Jsts.2014.14.5.649  0.389
2014 Han KJ, Swaminathan M, Jeong J. Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2014.2372771  0.545
2013 Orlandi A, Swaminathan M, Han KJ. Book review: Design and modeling for 3D ICs and interposers Ieee Electromagnetic Compatibility Magazine. 2: 48-49. DOI: 10.1109/Memc.2013.6714696  0.495
2011 Bandyopadhyay T, Han KJ, Chung D, Chatterjee R, Swaminathan M, Tummala R. Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 893-903. DOI: 10.1109/Tcpmt.2011.2120607  0.62
2010 Han KJ, Swaminathan M, Bandyopadhyay T. Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions Ieee Transactions On Advanced Packaging. 33: 804-817. DOI: 10.1109/Tadvp.2010.2050769  0.621
2009 Han KJ, Swaminathan M. Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 28: 846-859. DOI: 10.1109/Tcad.2009.2016642  0.544
2008 Han KJ, Takeuchi H, Swaminathan M. Eye-pattern design for high-peed differential links using extended passive equalization Ieee Transactions On Advanced Packaging. 31: 246-257. DOI: 10.1109/Tadvp.2008.915849  0.476
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