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Guanghui Fu, Ph.D.

Affiliations: 
2002 Iowa State University, Ames, IA, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering
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"Guanghui Fu"
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Abhijit Chandra grad student 2002 Iowa State
 (Modeling of chemical mechanical polishing at multiple scales.)

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Publications

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Fu G. (2014) Effects of assumed pressure distributions on the fundamental relation used in nanoindentation data analysis International Journal of Mechanical Engineering Education. 42: 31-35
Fu G, Chandra A. (2005) The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing Thin Solid Films. 474: 217-221
Fu G, Chandra A. (2005) A theoretical study on the relationship between wafer surface pressure and wafer backside loading in CMP 2005 Proceedings - 10th International Chemical-Mechanical Planarization For Ulsi Multilevel Interconnection Conference, Cmp-Mic 2005. 183-185
Fu G, Chandra A. (2003) An analytical dishing and step height reduction model for chemical mechanical planarization (CMP) Ieee Transactions On Semiconductor Manufacturing. 16: 477-485
Fu G, Chandra A. (2002) A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation Journal of Electronic Materials. 31: 1066-1073
Fu G, Chandra A. (2002) A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation Journal of Electronic Materials. 31: 1066-1073
Fu G, Chandra A, Guha S, et al. (2001) A plasticity-based model of material removal in chemical-mechanical polishing (CMP) Ieee Transactions On Semiconductor Manufacturing. 14: 406-417
Fu G, Chandra A. (2001) A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation Journal of Electronic Materials. 30: 400-408
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