Jae-Yong Ihm, Ph.D.
Affiliations: | 2005 | University of Illinois, Urbana-Champaign, Urbana-Champaign, IL |
Area:
Electronics and Electrical EngineeringGoogle:
"Jae-Yong Ihm"Parents
Sign in to add mentorAndreas C. Cangellaris | grad student | 2005 | UIUC | |
(Comprehensive electromagnetic approach for modeling of on-chip power grid switching.) |
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Publications
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Ihm JY, Chung IJ, Manetas G, et al. (2008) Comprehensive electromagnetic modeling of on-chip switching noise generation and coupling Ieee Transactions On Advanced Packaging. 31: 841-854 |
Hwang KP, Ihm JY. (2006) A stable fourth-order FDTD method for modeling electrically long dielectric waveguides Journal of Lightwave Technology. 24: 1048-1055 |
Ihm JY, Cangellaris AC. (2006) Stability of a hybrid FDTD-circuit model for on-chip power-grid switching analysis Microwave and Optical Technology Letters. 48: 644-649 |
Ihm JY, Chung IJ, Manetas G, et al. (2005) Comprehensive models for the investigation of on-chip switching noise generation and coupling Ieee International Symposium On Electromagnetic Compatibility. 2: 666-671 |
Ihm JY, Chung IJ, Manetas G, et al. (2005) Comprehensive model for on-chip power grid transient analysis and power grid-induced noise prediction Proceedings - Electronic Components and Technology Conference. 1: 716-721 |
Ihm JY, Chung IJ, Manetas G, et al. (2005) A comprehensive electromagnetic model for transient analysis of on-chip noise generation and coupling Iceaa 2005 - 9th International Conference On Electromagnetics in Advanced Applications and Eesc 2005 - 11th European Electromagnetic Structures Conference. 987-990 |
Ihm JY, Cangellaris AC. (2004) Modeling of semiconductor substrate on on-chip power grid switching Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 265-268 |
Ihm JY, Cangellaris AC. (2003) Distributed on-chip power grid modeling: An electromagnetic alternative to RLC extraction-based models Electrical Performance of Electronic Packaging. 37-40 |