Dalaver H. Anjum, Ph.D.

Affiliations: 
2002 State University of New York, Albany, Albany, NY, United States 
Area:
Physical Chemistry
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"Dalaver Anjum"

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Alain E. Kaloyeros grad student 2002 SUNY Albany
 (Low temperature thermal CVD titanium silicon nitride diffusion barrier films for copper interconnect applications.)
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Publications

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Prabaswara A, Kim H, Min JW, et al. (2020) Titanium Carbide MXene Nucleation Layer for Epitaxial Growth of High-Quality GaN Nanowires on Amorphous Substrates. Acs Nano
Liang H, Cao Z, Ming F, et al. (2019) Aqueous Zinc Ion Storage in MoS2 by Tuning the Intercalation Energy. Nano Letters
Zhuo S, Shi Y, Liu L, et al. (2018) Dual-template engineering of triple-layered nanoarray electrode of metal chalcogenides sandwiched with hydrogen-substituted graphdiyne. Nature Communications. 9: 3132
Alaie S, Goettler DF, Jiang YB, et al. (2015) Thermal conductivity and nanocrystalline structure of platinum deposited by focused ion beam. Nanotechnology. 26: 085704
Ahmed B, Shahid M, Nagaraju DH, et al. (2015) Surface Passivation of MoO<inf>3</inf> Nanorods by Atomic Layer Deposition toward High Rate Durable Li Ion Battery Anodes Acs Applied Materials and Interfaces. 7: 13154-13163
Jagadamma LK, Al-Senani M, El-Labban A, et al. (2015) Polymer Solar Cells with Efficiency >10% Enabled via a Facile Solution-Processed Al-Doped ZnO Electron Transporting Layer Advanced Energy Materials. 5
Jagadamma LK, Abdelsamie M, El Labban A, et al. (2014) Efficient inverted bulk-heterojunction solar cells from low-temperature processing of amorphous ZnO buffer layers Journal of Materials Chemistry A. 2: 13321-13331
Najar A, Al-Jabr AA, Slimane AB, et al. (2013) Effective antireflection properties of porous silicon nanowires for photovoltaic applications 2013 Saudi International Electronics, Communications and Photonics Conference, Siecpc 2013
Anjum D, Dovidenko K, Oktyabrsky S, et al. (2002) Physical properties and diffusion characteristics of CVD-grown TiSiN films Materials Research Society Symposium - Proceedings. 697: 341-346
Eisenbraun E, Upham A, Dash R, et al. (2000) Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications Journal of Vacuum Science & Technology B. 18: 2011-2015
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