Dalaver H. Anjum, Ph.D.
Affiliations: | 2002 | State University of New York, Albany, Albany, NY, United States |
Area:
Physical ChemistryGoogle:
"Dalaver Anjum"Parents
Sign in to add mentorAlain E. Kaloyeros | grad student | 2002 | SUNY Albany | |
(Low temperature thermal CVD titanium silicon nitride diffusion barrier films for copper interconnect applications.) |
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Publications
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Prabaswara A, Kim H, Min JW, et al. (2020) Titanium Carbide MXene Nucleation Layer for Epitaxial Growth of High-Quality GaN Nanowires on Amorphous Substrates. Acs Nano |
Liang H, Cao Z, Ming F, et al. (2019) Aqueous Zinc Ion Storage in MoS2 by Tuning the Intercalation Energy. Nano Letters |
Zhuo S, Shi Y, Liu L, et al. (2018) Dual-template engineering of triple-layered nanoarray electrode of metal chalcogenides sandwiched with hydrogen-substituted graphdiyne. Nature Communications. 9: 3132 |
Alaie S, Goettler DF, Jiang YB, et al. (2015) Thermal conductivity and nanocrystalline structure of platinum deposited by focused ion beam. Nanotechnology. 26: 085704 |
Ahmed B, Shahid M, Nagaraju DH, et al. (2015) Surface Passivation of MoO<inf>3</inf> Nanorods by Atomic Layer Deposition toward High Rate Durable Li Ion Battery Anodes Acs Applied Materials and Interfaces. 7: 13154-13163 |
Jagadamma LK, Al-Senani M, El-Labban A, et al. (2015) Polymer Solar Cells with Efficiency >10% Enabled via a Facile Solution-Processed Al-Doped ZnO Electron Transporting Layer Advanced Energy Materials. 5 |
Jagadamma LK, Abdelsamie M, El Labban A, et al. (2014) Efficient inverted bulk-heterojunction solar cells from low-temperature processing of amorphous ZnO buffer layers Journal of Materials Chemistry A. 2: 13321-13331 |
Najar A, Al-Jabr AA, Slimane AB, et al. (2013) Effective antireflection properties of porous silicon nanowires for photovoltaic applications 2013 Saudi International Electronics, Communications and Photonics Conference, Siecpc 2013 |
Anjum D, Dovidenko K, Oktyabrsky S, et al. (2002) Physical properties and diffusion characteristics of CVD-grown TiSiN films Materials Research Society Symposium - Proceedings. 697: 341-346 |
Eisenbraun E, Upham A, Dash R, et al. (2000) Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications Journal of Vacuum Science & Technology B. 18: 2011-2015 |