Stephan Grunow, Ph.D.
Affiliations: | 2002 | State University of New York, Albany, Albany, NY, United States |
Area:
Condensed Matter Physics, Materials Science EngineeringGoogle:
"Stephan Grunow"Parents
Sign in to add mentor| Alain E. Kaloyeros | grad student | 2002 | SUNY Albany | |
| (Electrochemical deposition of copper for gigascale interconnect technologies.) | ||||
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Publications
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| Zhang JH, Tseng WT, Chen T, et al. (2013) Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes Materials Research Society Symposium Proceedings. 1560: 79-84 |
| Shao I, Cheng T, Findeis P, et al. (2013) Optimization of Cu damascene electrodeposition process in ULSI for yield and reliability improvement Ecs Transactions. 58: 43-48 |
| Tseng WT, Devarapalli V, Steffes J, et al. (2013) Hybrid clean approach for post-copper CMP defect reduction Asmc (Advanced Semiconductor Manufacturing Conference) Proceedings. 346-351 |
| Yao S, McGahay V, Angyal MS, et al. (2012) 32nm node highly reliable Cu/low-k integration technology with CuMn alloy seed Materials Research Society Symposium Proceedings. 1335: 81-86 |
| Yao S, Tseng WT, Kapur A, et al. (2011) Formation mechanism and suppression methods of copper dendrites in BEOL integration Advanced Metallization Conference (Amc). 40-41 |
| Huang E, Oh M, Law SB, et al. (2010) CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4) Advanced Metallization Conference (Amc). 179-184 |
| Ee YC, Kioussis D, Angyal MS, et al. (2010) UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemes Advanced Metallization Conference (Amc). 185-192 |
| Simon AH, Bolom T, Tang TJ, et al. (2008) Extendibility study of a PVD Cu seed process with Ar+ Rf-Plasma enhanced coverage for 45nm interconnects Materials Research Society Symposium Proceedings. 1079: 35-40 |
| Hu CK, Gignac L, Liniger E, et al. (2007) Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners Journal of the Electrochemical Society. 154 |
| Hu CK, Gignac L, Liniger E, et al. (2007) Comparison of electromigration in Cu interconnects with ALD or PVD TaN liners Ecs Transactions. 3: 139-146 |