Yiming Deng, Ph.D.

Affiliations: 
2009 Electrical and Computer Engineering Michigan State University, East Lansing, MI 
Area:
Nondestructive Evaluation
Website:
https://www.egr.msu.edu/deng
Google:
"Yiming Deng"
Bio:

Yiming Deng is an Associate Professor in the Nondestructive Evaluation Laboratory of Electrical and Computer Engineering department of the College of Engineering, Michigan State University, USA. He is also an Associate Editor of IEEE Transactions on Reliability (IEEE TREL), Materials Evaluation (ME), Journal of Prognstics and Health Management (JPHM), and RAMS Proceedings. He serves as panelist and reviewer for National Science Foundation (NSF), US Department of Energy (DOE), US Department of Transportation (DOT), NDSEG Program (US DoD and ASEE) and over 40 scientific journals. He is a Senior Member of IEEE and a Member of ASNT. He is a Fellow of AGE.

Cross-listing: E-Tree

Parents

Sign in to add mentor
Satish Udpa grad student Michigan State (E-Tree)
Lalita Udpa grad student 2009 Michigan State
 (Forward and inverse problems in noninvasive imaging techniques.)

Children

Sign in to add trainee
Fares T. Alharbi grad student Michigan State (E-Tree)
Mohand Alzuhiri grad student Michigan State
Xuhui Huang grad student Michigan State (E-Tree)
Subrata Mukherjee grad student Michigan State (E-Tree)
Rajendra P. Ralanisamy grad student Michigan State (E-Tree)
Bharath Shenoy grad student Michigan State (E-Tree)
Xiaodong Shi grad student Michigan State
Shuo Zhang grad student Michigan State (E-Tree)
Deepak Kumar grad student 2014- Michigan State
Obaid Elshafiey grad student 2020- Michigan State
Yamini Kotriwar grad student 2020- Michigan State
Lei Peng grad student 2020- Michigan State
Portia Banerjee grad student 2018 Michigan State
Mohammad Rawashdeh grad student 2018 Michigan State
Karthik Gopalakrishnan grad student 2019-2021 Michigan State
Feipeng Jiang grad student 2019-2021 Michigan State
Paul Probst grad student 2019-2021 Michigan State
Zi Li grad student 2019-2023 Michigan State
Ciaron Hamilton grad student 2019-2024 Michigan State
Jiaoyang Li post-doc Michigan State
Vivek Rathod post-doc 2017-2020 Michigan State
Zhenning Wu post-doc 2019-2021 Michigan State
Guanyu Piao post-doc 2019-2022 Michigan State
BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Hamilton C, Karpenko O, Udpa L, et al. (2024) Efficient data acquisition and reconstruction for air-coupled ultrasonic robotic NDE. Scientific Reports. 14: 14021
Hu S, Wang B, Zhang A, et al. (2022) Genetic Algorithm and Greedy Strategy-Based Multi-Mission-Point Route Planning for Heavy-Duty Semi-Rigid Airship. Sensors (Basel, Switzerland). 22
Shi X, Li J, Mukherjee S, et al. (2022) Ultra-Wideband Microwave Imaging System for Root Phenotyping. Sensors (Basel, Switzerland). 22
Datta S, Mukherjee S, Shi X, et al. (2021) Negative Index Metamaterial Lens for Subwavelength Microwave Detection. Sensors (Basel, Switzerland). 21
Wu Z, Deng Y, Wang L. (2021) A Pinning Actor-Critic Structure-Based Algorithm for Sizing Complex-Shaped Depth Profiles in MFL Inspection with High Degree of Freedom Complexity. 2021: 1-12
Li Z, Shenoy BB, Udpa L, et al. (2021) Magnetic Barkhausen Noise Technique for Early-Stage Fatigue Prediction in Martensitic Stainless-Steel Samples Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems. 4
Piao G, Li J, Udpa L, et al. (2021) The Effect of Motion-Induced Eddy Currents on Three-Axis MFL Signals for High-Speed Rail Inspection Ieee Transactions On Magnetics. 57: 1-11
Wu Z, Deng Y, Liu J, et al. (2021) A Reinforcement Learning-Based Reconstruction Method for Complex Defect Profiles in MFL Inspection Ieee Transactions On Instrumentation and Measurement. 70: 1-10
Kumar D, Mondal S, Deng Y, et al. (2020) Wireless Battery-Free Harmonic Communication System for Pressure Sensing. Micromachines. 11
Huang X, Hamilton C, Li Z, et al. (2020) Capacitive imaging for adhesive bonds and quality evaluation. Philosophical Transactions. Series a, Mathematical, Physical, and Engineering Sciences. 378: 20190590
See more...