James D. Meindl
Affiliations: | 1967-1986 | Electrical engineering | Stanford University, Palo Alto, CA |
1986-1993 | senior vice president for academic affairs and provost | Rensselaer Polytechnic Institute, Troy, NY, United States | |
1993-2013 | Electrical and Computer Engineering | Georgia Institute of Technology, Atlanta, GA |
Area:
Microelectronics/MicrosystemsWebsite:
http://ethw.org/James_D._MeindlGoogle:
"James Meindl"Bio:
(1933 - 2020)
http://www.ece.gatech.edu/faculty-staff/fac_profiles/bio.php?id=69
https://www.nae.edu/28892/Dr-James-D-Meindl
https://news.stanford.edu/2020/06/15/james-d-meindl-master-integrated-circuits-dies-87/
https://www.genealogy.math.ndsu.nodak.edu/id.php?id=78258
https://chic.caltech.edu/group/jdm-lab/
Mean distance: 18.26
Cross-listing: Computer Science Tree
Parents
Sign in to add mentorEdward R. Schatz | grad student | 1958 | Carnegie Mellon | |
(The External Electromagnetic Fields of Shielded Transmission Lines) |
Children
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Publications
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Zheng P, Bryan SE, Yang Y, et al. (2013) Hydrogenation of graphene nanoribbon edges: Improvement in carrier transport Ieee Electron Device Letters. 34: 707-709 |
Huang G, Bakir MS, Naeemi A, et al. (2012) Power delivery for 3-D chip stacks: Physical modeling and design implication Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 852-859 |
Bryan SE, Brenner K, Yang Y, et al. (2012) P-type electrical transport of chemically doped epitaxial graphene nanoribbons Ieee Electron Device Letters. 33: 866-868 |
Thacker HD, Ogunsola OO, Muler AV, et al. (2011) Wafer-testing of optoelectonic - Gigascale CMOS integrated circuits Ieee Journal On Selected Topics in Quantum Electronics. 17: 659-670 |
Dang B, Bakir MS, Sekar DC, et al. (2010) Integrated microfluidic cooling and interconnects for 2D and 3D chips Ieee Transactions On Advanced Packaging. 33: 79-87 |
Meindl J, Naeemi A, Bakir M, et al. (2010) Nanoelectronics in retrospect, prospect and principle Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 53: 31-35 |
Yang HS, Ravindran R, Bakir MS, et al. (2010) A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration 2010 Ieee International Interconnect Technology Conference, Iitc 2010 |
Rakheja S, Naeemi A, Meindl JD. (2010) Physical limitations on delay and energy dissipation of interconnects for post-CMOS devices 2010 Ieee International Interconnect Technology Conference, Iitc 2010 |
Ravindran R, Sadie JA, Scarberry KE, et al. (2010) Biochemical sensing with an arrayed silicon nanowire platform Proceedings - Electronic Components and Technology Conference. 1015-1020 |
King CR, Zaveri J, Bakir MS, et al. (2010) Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs Proceedings - Electronic Components and Technology Conference. 1674-1681 |