Muhannad S. Bakir, Ph.D.
Affiliations: | 2003 | Georgia Institute of Technology, Atlanta, GA |
Area:
Microelectronics/MicrosystemsGoogle:
"Muhannad Bakir"Mean distance: 20.07
Parents
Sign in to add mentor| James D. Meindl | grad student | 2003 | Georgia Tech | |
| (Sea of Leads electrical-optical polymer pillar chip I /O interconnections for gigascale integration.) | ||||
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Publications
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| Zia M, Chung B, Sober S, et al. (2020) Flexible Multielectrode Arrays With 2-D and 3-D Contacts for Electromyography Recording. Ieee Transactions On Components, Packaging, and Manufacturing Technology. 10: 197-202 |
| Hossen MO, Chava B, Van der Plas G, et al. (2020) Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and $\mu$ TSVs Ieee Transactions On Electron Devices. 67: 11-17 |
| Jo PK, Rajan SK, Gonzalez JL, et al. (2020) Polylithic Integration of 2.5-D and 3-D Chiplets Enabled by Multi-Height and Fine-Pitch CMIs Ieee Transactions On Components, Packaging and Manufacturing Technology. 1-1 |
| Oh H, Swaminathan M, May GS, et al. (2020) Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1337-1347 |
| Zhang Y, Hossen MO, Bakir MS. (2019) Power Delivery Network Modeling and Benchmarking for Emerging Heterogeneous Integration Technologies Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1825-1834 |
| Sarvey TE, Kaul A, Rajan SK, et al. (2019) Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 2393-2403 |
| Li Y, Yu H, Jin H, et al. (2019) Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1244-1252 |
| Wan C, Gonzalez JL, Fan T, et al. (2019) Fiber-Interconnect Silicon Chiplet Technology for Self-Aligned Fiber-to-Chip Assembly Ieee Photonics Technology Letters. 31: 1311-1314 |
| Oh H, Lee SW, Kim M, et al. (2018) Designing Surface Chemistry of Silver Nanocrystals for Radio-frequency Circuit Applications. Acs Applied Materials & Interfaces |
| Wan C, Gaylord TK, Bakir MS. (2018) Grating-assisted-cylindrical-resonant-cavities interlayer coupler. Applied Optics. 57: 5079-5089 |