Oluwafemi O. Ogunsola, Ph.D.
Affiliations: | 2006 | Georgia Institute of Technology, Atlanta, GA |
Area:
Microelectronics/MicrosystemsGoogle:
"Oluwafemi Ogunsola"Mean distance: 20.07
Parents
Sign in to add mentor| James D. Meindl | grad student | 2006 | Georgia Tech | |
| (Prospects for mirror -enabled polymer pillar I/O optical interconnects for gigascale integration.) | ||||
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Publications
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| Thacker HD, Ogunsola OO, Muler AV, et al. (2011) Wafer-testing of optoelectonic - Gigascale CMOS integrated circuits Ieee Journal On Selected Topics in Quantum Electronics. 17: 659-670 |
| Thacker H, Ogunsola O, Carson A, et al. (2007) Optical through-wafer interconnects for 3D hyper-integration Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 28-29 |
| Bakir MS, Dang B, Ogunsola OO, et al. (2007) 'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects Proceedings - Electronic Components and Technology Conference. 585-592 |
| Ogunsola OO, Thacker HD, Bachim BL, et al. (2006) Chip-level waveguide-mirror-pillar optical interconnect structure Ieee Photonics Technology Letters. 18: 1672-1674 |
| Ogunsola OO, Thacker HD, Bachim BL, et al. (2006) Polymer pillars as optical I/O for gigascale chips using mirror-terminated waveguides 2006 International Interconnect Technology Conference, Iitc. 170-172 |
| Bakir MS, Dang B, Thacker HD, et al. (2006) Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing Proceedings - Electronic Components and Technology Conference. 2006: 768-775 |
| Bachim BL, Ogunsola OO, Gaylord TK. (2005) Optical-fiber-to-waveguide coupling using carbon-dioxide-laser-induced long-period fiber gratings. Optics Letters. 30: 2080-2 |
| Thacker HD, Ogunsola OO, Bakir MS, et al. (2005) High-density probe substrate for testing optical interconnects Proceedings of the Ieee 2005 International Interconnect Technology Conference, Iitc. 159-161 |
| Thacker H, Ogunsola O, Bakir M, et al. (2005) Probe module for wafer-level testing of gigascale chips with electrical and optical I/O interconnects Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1593-1599 |
| Ogunsola OO, Dang B, Bakir MS, et al. (2004) Polymer pillar optical transmittance analysis Frontiers in Optics |