Yuan Taur
Affiliations: | Electrical Engineering (Applied Physics) | University of California, San Diego, La Jolla, CA |
Area:
Electronics and Electrical EngineeringGoogle:
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Children
Sign in to add traineeMing Cai | grad student | 2006 | UCSD |
Xiaoping Liang | grad student | 2006 | UCSD |
Huaxin Lu | grad student | 2006 | UCSD |
Minjian Liu | grad student | 2007 | UCSD |
Wei-Yuan Lu | grad student | 2007 | UCSD |
Jooyoung Song | grad student | 2010 | UCSD |
Han-Ping Chen | grad student | 2014 | UCSD |
Zhongjie Ren | grad student | 2018-2020 | UCSD |
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Publications
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Ren Z, Taur Y. (2020) Non-GCA modeling of near threshold I-V characteristics of DG MOSFETs Solid-State Electronics. 166: 107766 |
Kavrik MS, Bostwick A, Rotenberg E, et al. (2019) Understanding the Mechanism of Electronic Defects Suppression Enabled by Non-Idealities in Atomic Layer Deposition. Journal of the American Chemical Society |
Kavrik MS, Ercius P, Cheung J, et al. (2019) Engineering high-k/SiGe interface with ALD oxide for selective GeOx reduction. Acs Applied Materials & Interfaces |
Taur Y, Choi W, Zhang J, et al. (2019) A Non-GCA DG MOSFET Model Continuous into the Velocity Saturation Region Ieee Transactions On Electron Devices. 66: 1160-1166 |
Kavrik MS, Thomson E, Chagarov E, et al. (2018) Ultra-Low defect density at sub-0.5 nm HfO2/SiGe interfaces via selective oxygen scavenging. Acs Applied Materials & Interfaces |
Pandey N, Lin H, Nandi A, et al. (2018) Modeling of Short-Channel Effects in DG MOSFETs: Green’s Function Method Versus Scale Length Model Ieee Transactions On Electron Devices. 65: 3112-3119 |
Taur Y, Lin H. (2018) Modeling of DG MOSFET |
Parihar MS, Lee KH, Park HJ, et al. (2018) Insight into carrier lifetime impact on band-modulation devices Solid-State Electronics. 143: 41-48 |
Cristoloveanu S, Lee K, Parihar M, et al. (2018) A review of the Z 2 -FET 1T-DRAM memory: Operation mechanisms and key parameters Solid-State Electronics. 143: 10-19 |
Wu J, Taur Y. (2017) An All-Region I–V Model for 1-D Nanowire MOSFETs Ieee Transactions On Nanotechnology. 16: 1062-1066 |