Gregory A. Ten Eyck, Ph.D.
Affiliations: | 2007 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Electronics and Electrical Engineering, Materials Science EngineeringGoogle:
"Gregory Ten Eyck"Mean distance: (not calculated yet)
Parents
Sign in to add mentor| Toh-Ming Lu | grad student | 2007 | RPI | |
| (Atomic layer deposition of metals on dielectric substrates.) | ||||
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Publications
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| Lay NE, Ten Eyck GA, Duquette DJ, et al. (2007) Direct plating of Cu on Pd plasma enhanced atomic layer deposition coated TaN Barrier Electrochemical and Solid-State Letters. 10 |
| Gedelian CA, Ten Eyck GA, Lu TM. (2007) Onset of thermal degradation in poly(p-phenylene vinylene) films deposited by chemical vapor deposition Synthetic Metals. 157: 48-52 |
| Ten Eyck GA, Pimanpang S, Juneja JS, et al. (2007) Plasma-enhanced atomic layer deposition of palladium on a polymer substrate Chemical Vapor Deposition. 13: 307-311 |
| Karabacak T, Deluca JS, Wang PI, et al. (2006) Low temperature melting of copper nanorod arrays Journal of Applied Physics. 99 |
| Kim YS, Shin J, Cho JH, et al. (2006) Surface characterization of copper electroless deposition on atomic layer deposited palladium on iridium and tungsten Surface and Coatings Technology. 200: 5760-5766 |
| Kim YS, Kim HI, Cho JH, et al. (2006) Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer Electrochimica Acta. 51: 2400-2406 |
| Ten Eyck GA, Pimanpang S, Bakhru H, et al. (2006) Atomic layer deposition of Pd on an oxidized metal substrate Chemical Vapor Deposition. 12: 290-294 |
| Kim YS, Ten Eyck GA, Ye D, et al. (2005) Atomic layer deposition of Pd on TaN for Cu electroless plating Journal of the Electrochemical Society. 152 |