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Christoph Steinbruchel

Affiliations: 
1975- Materials Science Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Materials Science Engineering, Electronics and Electrical Engineering, Fluid and Plasma Physics
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Parents

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Lanny D. Schmidt grad student 1970-1974 UMN (Chemistry Tree)

Children

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Bradley Howard grad student 1989-1993 RPI (Chemistry Tree)
Lyndon W. Graham grad student 2000 RPI
Arun Karamcheti grad student 2000 RPI
Gusung Kim grad student 2000 RPI
Huseyin Kizil grad student 2002 RPI

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Publications

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Kizil H, Steinbrüchel C. (2004) TiN, TaN and WxN as diffusion barriers for Cu on SiO 2: Capacitance-voltage, leakage current, and triangular-voltage-sweep tests after bias temperature stress Thin Solid Films. 449: 158-165
Graham L, Steinbrüchel C, Duquette DJ. (2002) Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu ­ NH 3 Bath Journal of the Electrochemical Society. 149
Karamcheti A, Watt VHC, Al-Shareef HN, et al. (2002) Characterization of ultrathin gate dielectrics formed by in-situ steam generation with Nitrogen postprocessing Journal of Electronic Materials. 31: 124-128
Kizil H, Kim G, Steinbrüchel C, et al. (2001) TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology Journal of Electronic Materials. 30: 345-348
Mallikarjunan A, Murarka SP, Steinbruchel C, et al. (2000) Electrical behavior of Cu thin fluorinated PECVD oxide MIS capacitors Journal of the Electrochemical Society. 147: 3502-3507
Kim SE, Steinbrüchel C. (1999) The interaction of metals and barrier layers with fluorinated silicon oxides Solid-State Electronics. 43: 1019-1023
Tacito RD, Steinbrüchel C. (1996) Patterning of Benzocyclobutene by Reactive Ion Etching Journal of the Electrochemical Society. 143: 2695-2697
Tacito RD, Steinbrüchel C. (1996) Fine‐Line Patterning of Parylene‐n by Reactive Ion Etching for Application as an Interlayer Dielectric Journal of the Electrochemical Society. 143: 1974-1977
Steinbrüchel C. (1995) Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing Applied Surface Science. 91: 139-146
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