Xiaoxiong Gu, Ph.D.
Affiliations: | 2006 | University of Washington, Seattle, Seattle, WA |
Area:
Electronics and Electrical EngineeringGoogle:
"Xiaoxiong Gu"Mean distance: (not calculated yet)
Parents
Sign in to add mentorLeung Tsang | grad student | 2006 | University of Washington | |
(Modeling effects of random rough surface on conductor loss at microwave frequencies.) |
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Publications
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Sadhu B, Valdes-Garcia A, Plouchart J, et al. (2020) A 250-mW 60-GHz CMOS Transceiver SoC Integrated With a Four-Element AiP Providing Broad Angular Link Coverage Ieee Journal of Solid-State Circuits. 55: 1516-1529 |
Gu X, Liu D, Baks C, et al. (2019) Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications Ieee Transactions On Microwave Theory and Techniques. 67: 2975-2984 |
Wu B, Wang RC, Yang JH, et al. (2016) Zr and REE mineralization in sodic lujavrite from the Saima alkaline complex, northeastern China: A mineralogical study and comparison with potassic rocks Lithos. 262: 232-246 |
Gu X, Silberman JA, Young AM, et al. (2013) Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1917-1925 |
Kotzev M, Rimolo-Donadio R, Kwark YH, et al. (2012) Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures Ieee Transactions On Instrumentation and Measurement. 61: 3198-3206 |
Müller S, Duan X, Kotzev M, et al. (2012) Accuracy of physics-based via models for simulation of dense via arrays Ieee Transactions On Electromagnetic Compatibility. 54: 1125-1136 |
Rimolo-Donadio R, Selli G, De Paulis F, et al. (2012) Signal integrity: Efficient, physics-based via modeling: Integration of striplines Ieee Electromagnetic Compatibility Magazine. 1: 74-81 |
Gordin R, Goren D, Shlafman S, et al. (2011) Design and modeling methodology of vertical interconnects for 3DI applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 163-167 |
Wu B, Gu X, Tsang L, et al. (2011) Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects Microwave and Optical Technology Letters. 53: 1204-1206 |
Tsang L, Braunisch H, Ding R, et al. (2010) Random Rough Surface Effects on Wave Propagation in Interconnects Ieee Transactions On Advanced Packaging. 33: 839-856 |