Boping Wu, Ph.D.

Affiliations: 
2010 University of Washington, Seattle, Seattle, WA 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics
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Leung Tsang grad student 2010 University of Washington
 (Fast electromagnetic modeling of high speed interconnects in advanced electronic packaging.)
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Publications

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Wu B, Wang RC, Yang JH, et al. (2016) Zr and REE mineralization in sodic lujavrite from the Saima alkaline complex, northeastern China: A mineralogical study and comparison with potassic rocks Lithos. 262: 232-246
Wu B, Lo HL. (2012) Methods and Designs for Improving the Signal Integrity of Vertical Interconnects in High Performance Packaging Progress in Electromagnetics Research-Pier. 123: 1-11
Wu B, Gu X, Tsang L, et al. (2011) Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects Microwave and Optical Technology Letters. 53: 1204-1206
Wu B, Chang X, Tsang L, et al. (2010) Fast Electromagnetic Modeling of 3D Interconnects on Chip-package-board Piers Online. 6: 674-678
Wu B, Tsang L. (2010) Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics Ieee Transactions On Advanced Packaging. 33: 510-516
Bagley JQ, Wu B, Tsang L. (2009) Electromagnetic fields and modal excitations on a thin silver film. Journal of the Optical Society of America. a, Optics, Image Science, and Vision. 26: 2362-7
Wu B, Tsang L. (2009) FULL-WAVE MODELING OF MULTIPLE VIAS USING DIFFERENTIAL SIGNALING AND SHARED ANTIPAD IN MULTILAYERED HIGH SPEED VERTICAL INTERCONNECTS Progress in Electromagnetics Research. 97: 129-139
Kam DG, Ritter MB, Beukema TJ, et al. (2009) Is 25 Gb/s on-board signaling viable? Ieee Transactions On Advanced Packaging. 32: 328-344
Wu B, Tsang L. (2009) Modeling Multiple Vias With Arbitrary Shape of Antipads and Pads in High Speed Interconnect Circuits Ieee Microwave and Wireless Components Letters. 19: 12-14
Wu B, Tsang L. (2008) Fast Computation of Layered Medium Green's Functions of Multilayers and Lossy Media Using Fast All-Modes Method and Numerical Modified Steepest Descent Path Method Ieee Transactions On Microwave Theory and Techniques. 56: 1446-1454
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