Andreas Weisshaar

Affiliations: 
Oregon State University, Corvallis, OR 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics, Optics Physics
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Publications

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Zheng L, Weisshaar A. (2018) Parameterised equivalent circuit model of frequency-dependent resistance and inductance for on-chip coplanar waveguides up to 110 GHz Electronics Letters. 54: 986-988
Gaskill SG, Weisshaar A. (2016) Compact equivalent circuit modeling of microfluxgate devices with thin-film magnetic cores Ieee Transactions On Magnetics. 52
Zheng L, Ferrara AR, Weisshaar A. (2016) Scalable modeling of resistive losses 1n on-chip interconnects at mm-wave frequencies Ieee Mtt-S International Microwave Symposium Digest. 2016
Zheng L, Gaskill SG, Weisshaar A. (2015) A scalable wideband equivalent circuit model for on-chip microstrips up to 110 GHz 2014 Ieee 23rd Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2014. 141-144
Gaskill SG, Papou A, Mohan A, et al. (2014) Modeling microinductors with thin-film alloy magnetic cores Ieee Transactions On Power Electronics. 29: 4901-4910
Gaskill S, Papou A, Mohan A, et al. (2013) Nonlinear frequency-dependent model for microinductors with magnetic core Ieee Electron Device Letters. 34: 304-306
Orhanovic I, Crinon RJ, Chaplen FW, et al. (2007) Signal transduction pathway modeling using sequences of chromatophore images. Ieee Transactions On Nanobioscience. 6: 210-8
Mayevskiy Y, Watson A, Francis P, et al. (2005) A new compact model for monolithic transformers in silicon-based RFICs Ieee Microwave and Wireless Components Letters. 15: 419-421
Watson AC, Melendy D, Francis P, et al. (2004) A comprehensive compact-modeling methodology for spiral inductors in silicon-based RFICs Ieee Transactions On Microwave Theory and Techniques. 52: 849-857
Kolstad J, Blevins C, Dunn J, et al. (2004) A new modeling methodology for passive components based on black-box augmentation combined with equivalent circuit perturbation Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 259-262
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