Seok-Hee Lee, Ph.D.

Affiliations: 
2001 Stanford University, Palo Alto, CA 
Area:
Materials Science Engineering
Google:
"Seok-Hee Lee"
Mean distance: (not calculated yet)
 

Parents

Sign in to add mentor
John C. Bravman grad student 2001 Stanford
 (Effects of processing on void nucleation in aluminum and copper interconnects.)
BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Jeong H, Lee J, Bok C, et al. (2017) Fabrication of Vertical Silicon Nanotube Array Using Spacer Patterning Technique and Metal-Assisted Chemical Etching Ieee Transactions On Nanotechnology. 16: 130-134
Seo Y, Lee S, Baek SHC, et al. (2015) The Mechanism of Schottky Barrier Modulation of Tantalum Nitride/Ge Contacts Ieee Electron Device Letters. 36: 997-1000
Jeong WJ, Kim TK, Moon JM, et al. (2015) Germanium electron-hole bilayer tunnel field-effect transistors with a symmetrically arranged double gate Semiconductor Science and Technology. 30
Kim CK, Ahn HJ, Moon JM, et al. (2015) Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition Solid-State Electronics. 114: 90-93
Na S, Kang JG, Choi J, et al. (2015) Silicidation of mo-alloyed ytterbium: Mo alloying effects on microstructure evolution and contact properties Acta Materialia. 92: 1-7
Kim DH, Kim TK, Yoon YG, et al. (2014) First demonstration of ultra-thin SiGe-channel junctionless accumulation-mode (JAM) bulk FinFETs on Si substrate with PN junction-isolation scheme Ieee Journal of the Electron Devices Society. 2: 123-127
Baek SC, Seo Y, Oh JG, et al. (2014) Alleviation of fermi-level pinning effect at metal/germanium interface by the insertion of graphene layers Applied Physics Letters. 105: 73508
Choi J, Choi S, Kim J, et al. (2013) Silicide formation process of Er films with Ta and TaN capping layers. Acs Applied Materials & Interfaces. 5: 12744-50
Kim TK, Kim DH, Yoon YG, et al. (2013) First demonstration of junctionless accumulation-mode bulk FinFETs with robust junction isolation Ieee Electron Device Letters. 34: 1479-1481
Lee SH, Choi R, Choi C. (2013) Effects of composition and thickness of TiN metal gate on the equivalent oxide thickness and flat-band voltage in metal oxide semiconductor devices Microelectronic Engineering. 109: 160-162
See more...