Liqun Han, Ph.D.
Affiliations: | 2001 | Stanford University, Palo Alto, CA |
Area:
Electronics and Electrical EngineeringGoogle:
"Liqun Han"Mean distance: (not calculated yet)
Parents
Sign in to add mentorR Fabian W. Pease | grad student | 2001 | Stanford | |
(Physical limitations to throughput of electron beam systems for next generation lithography.) |
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Publications
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Crane T, Campbell C, Pickard D, et al. (2002) Correcting for global space charge by positive ion generation Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 2709-2712 |
Takahashi K, Han L, Pease RF, et al. (2001) Stochastic Coulomb interaction effect in ion-neutralized electron-beam projection optics Journal of Vacuum Science & Technology B. 19: 2572-2580 |
Takahashi K, Han L, Pease RF, et al. (2001) Simulation of space charge neutralization using ions in electron beam projection optics Microelectronic Engineering. 57: 231-238 |
Han L, Pease RF, Meisburger WD, et al. (2000) Scaled measurements of global space-charge induced image blur in electron beam projection system Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 18: 2999-3003 |
Pease RF, Han L, Winograd GI, et al. (2000) Prospects for charged particle lithography as a manufacturing technology Microelectronic Engineering. 53: 55-60 |
Han L, Pease RFW, Meisburger WD, et al. (1999) Field size versus column shortness in high throughput electron beam lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 17: 2830-2835 |
Han L, McCord MA, Winograd GI, et al. (1998) Performance investigation of Coulomb interaction-limited high throughput electron beam lithography based on empirical modeling Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 16: 3215-3220 |
Winograd GI, Han L, McCord MA, et al. (1998) Multiplexed blanker array for parallel electron beam lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 16: 3174-3176 |