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Shengquan Ou, Ph.D. - Publications

Affiliations: 
2005 University of California, Los Angeles, Los Angeles, CA 
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints
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3 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2008 Xu Y, Ou S, Tu K, Zeng K, Dunne R. Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester Journal of Materials Research. 23: 1482-1487. DOI: 10.1557/Jmr.2008.0186  0.42
2004 Ou S, Xu G, Xu Y, Tu K. The application of lead-free solder to optical fiber packaging Journal of Electronic Materials. 33: 1440-1444. DOI: 10.1007/S11664-004-0084-Z  0.419
1988 Zhang ZN, Tu KY, Xu YK, Zhang WM, Liu ZT, Ou SH. Treatment of longitudinal injuries in avascular area of meniscus in dogs by trephination. Arthroscopy : the Journal of Arthroscopic & Related Surgery : Official Publication of the Arthroscopy Association of North America and the International Arthroscopy Association. 4: 151-9. PMID 3166652 DOI: 10.1016/s0749-8063(88)80019-7  0.361
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