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Sangyeop Lee, Ph.D. - Publications

Affiliations: 
2015 Mechanical Engineering Massachusetts Institute of Technology, Cambridge, MA, United States 
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13 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2021 Gong W, Garg R, Guo R, Lee S, Cohen-Karni T, Shen S. Thermal Transport in Multidimensional Silicon-Graphene Hybrid Nanostructures. Acs Applied Materials & Interfaces. 13: 50206-50212. PMID 34662104 DOI: 10.1021/acsami.1c08093  0.632
2019 Lee S, Li X, Guo R. Thermal Resistance by Transition Between Collective and Non-Collective Phonon Flows in Graphitic Materials Nanoscale and Microscale Thermophysical Engineering. 23: 247-258. DOI: 10.1080/15567265.2019.1575497  0.354
2018 Li X, Lee S. Role of hydrodynamic viscosity on phonon transport in suspended graphene Physical Review B. 97: 94309. DOI: 10.1103/Physrevb.97.094309  0.345
2016 Lee D, Sayed SY, Lee S, Kuryak CA, Zhou J, Chen G, Shao-Horn Y. Quantitative analyses of enhanced thermoelectric properties of modulation-doped PEDOT:PSS/undoped Si (001) nanoscale heterostructures. Nanoscale. PMID 27874117 DOI: 10.1039/C6Nr06950A  0.415
2015 Lee S, Broido D, Esfarjani K, Chen G. Hydrodynamic phonon transport in suspended graphene. Nature Communications. 6: 6290. PMID 25693180 DOI: 10.1038/Ncomms7290  0.478
2014 Lee S, Esfarjani K, Luo T, Zhou J, Tian Z, Chen G. Resonant bonding leads to low lattice thermal conductivity. Nature Communications. 5: 3525. PMID 24770354 DOI: 10.1038/Ncomms4525  0.636
2014 Tian Z, Lee S, Chen G. Comprehensive Review Of Heat Transfer In Thermoelectric Materials And Devices Annual Review of Heat Transfer. 17: 425-483. DOI: 10.1615/Annualrevheattransfer.2014006932  0.617
2014 Lee S, Esfarjani K, Mendoza J, Dresselhaus MS, Chen G. Lattice thermal conductivity of Bi, Sb, and Bi-Sb alloy from first principles Physical Review B - Condensed Matter and Materials Physics. 89. DOI: 10.1103/Physrevb.89.085206  0.488
2014 Liao B, Lee S, Esfarjani K, Chen G. First-principles study of thermal transport inFeSb2 Physical Review B. 89. DOI: 10.1103/Physrevb.89.035108  0.501
2013 Tian Z, Lee S, Chen G. Heat Transfer in Thermoelectric Materials and Devices Journal of Heat Transfer-Transactions of the Asme. 135: 61605. DOI: 10.1115/1.4023585  0.645
2013 Liu W, Lukas KC, McEnaney K, Lee S, Zhang Q, Opeil CP, Chen G, Ren Z. Studies on the Bi<inf>2</inf>Te<inf>3</inf>-Bi<inf>2</inf>Se <inf>3</inf>-Bi<inf>2</inf>S<inf>3</inf> system for mid-temperature thermoelectric energy conversion Energy and Environmental Science. 6: 552-560. DOI: 10.1039/C2Ee23549H  0.43
2012 Zhang Q, Wang H, Liu W, Wang H, Yu B, Zhang Q, Tian Z, Ni G, Lee S, Esfarjani K, Chen G, Ren Z. Enhancement of thermoelectric figure-of-merit by resonant states of aluminium doping in lead selenide Energy Environ. Sci.. 5: 5246-5251. DOI: 10.1039/C1Ee02465E  0.633
2011 Yan X, Joshi G, Liu W, Lan Y, Wang H, Lee S, Simonson JW, Poon SJ, Tritt TM, Chen G, Ren ZF. Enhanced thermoelectric figure of merit of p-type half-Heuslers. Nano Letters. 11: 556-60. PMID 21186782 DOI: 10.1021/Nl104138T  0.461
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