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Myung Jun Kim - Publications

Affiliations: 
2013 Chemical Engineering Seoul National University, Seoul, South Korea 
 2016-2020 Duke University, Durham, NC 
 2020- Applied Chemistry Kyung Hee University, Seoul, South Korea 
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2021 Fichthorn KA, Chen Z, Chen Z, Rioux RM, Kim MJ, Wiley BJ. Understanding the Solution-Phase Growth of Cu and Ag Nanowires and Nanocubes from First Principles. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 33834786 DOI: 10.1021/acs.langmuir.1c00384  0.556
2021 Kim BK, Kim MJ, Kim JJ. Impact of Surface Hydrophilicity on Electrochemical Water Splitting. Acs Applied Materials & Interfaces. PMID 33650852 DOI: 10.1021/acsami.0c22409  0.42
2019 Kim MJ, Brown M, Wiley BJ. Electrochemical investigations of metal nanostructure growth with single crystals. Nanoscale. PMID 31714552 DOI: 10.1039/C9Nr05782J  0.551
2019 Kim MJ, Seo Y, Cruz MA, Wiley BJ. Metal Nanowire Felt as a Flow-Through Electrode for High-Productivity Electrochemistry. Acs Nano. PMID 31084021 DOI: 10.1021/Acsnano.9B02058  0.514
2019 Huo D, Kim MJ, Lyu Z, Shi Y, Wiley BJ, Xia Y. One-Dimensional Metal Nanostructures: From Colloidal Syntheses to Applications. Chemical Reviews. PMID 30854849 DOI: 10.1021/Acs.Chemrev.8B00745  0.533
2018 Kim MJ, Alvarez S, Chen Z, Fichthorn KA, Wiley BJ. Single-Crystal Electrochemistry Reveals Why Metal Nanowires Grow. Journal of the American Chemical Society. PMID 30351013 DOI: 10.1021/Jacs.8B08053  0.583
2016 Stewart IE, Kim MJ, Wiley BJ. The Effect of Morphology on the Electrical Resistivity of Silver Nanostructure Films. Acs Applied Materials & Interfaces. PMID 27981831 DOI: 10.1021/Acsami.6B12289  0.457
2016 Kim MJ, Flowers PF, Stewart IE, Ye S, Baek S, Kim JJ, Wiley BJ. Ethylenediamine Promotes Cu Nanowire Growth by Inhibiting Oxidation of Cu (111). Journal of the American Chemical Society. PMID 27976885 DOI: 10.1021/Jacs.6B10653  0.597
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