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Di Xu, Ph.D. - Publications

Affiliations: 
2009 University of California, Los Angeles, Los Angeles, CA 
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2010 Xu D, Sriram V, Ozolins V, Yang J, Tu KN, Stafford GR, Beauchamp C. Erratum: “In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper” [J. Appl. Phys. 105, 023521 (2009)] Journal of Applied Physics. 108: 099901. DOI: 10.1063/1.3503174  0.485
2010 Xu D, Kwan WL, Chen K, Zhang X, Ozolins V, Tu K. Erratum: “Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition” [Appl. Phys. Lett. 91, 254105 (2007)] Applied Physics Letters. 97: 129904. DOI: 10.1063/1.3489689  0.499
2009 Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR, Beauchamp C. In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper Journal of Applied Physics. 105. DOI: 10.1063/1.3068191  0.507
2008 Wang DH, Xu D, Wang Q, Hao YJ, Jin GQ, Guo XY, Tu KN. Periodically twinned SiC nanowires. Nanotechnology. 19: 215602. PMID 21730575 DOI: 10.1088/0957-4484/19/21/215602  0.457
2008 Xu L, Xu D, Tu KN, Cai Y, Wang N, Dixit P, Pang JHL, Miao J. Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper Journal of Applied Physics. 104: 113717. DOI: 10.1063/1.3035944  0.479
2008 Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR, Beauchamp C, Zienert I, Geisler H, Hofmann P, Zschech E. Nanotwin formation and its physical properties and effect on reliability of copper interconnects Microelectronic Engineering. 85: 2155-2158. DOI: 10.1016/J.Mee.2008.04.035  0.33
2007 Xu D, Kwan WL, Chen K, Zhang X, Ozoliņš V, Tu KN. Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition Applied Physics Letters. 91: 254105. DOI: 10.1063/1.2825412  0.345
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