| Year |
Citation |
Score |
| 2020 |
Li J, Chen S, Kim C. Low-cost and low-topography fabrication of multilayer interconnections for microfluidic devices Journal of Micromechanics and Microengineering. 30: 77001-77001. DOI: 10.1088/1361-6439/Ab8C9E |
0.337 |
|
| 2020 |
Xu M, Arihara B, Tong H, Yu N, Ujiie Y, Kim C. A low-profile wall shear comparator to mount and test surface samples Experiments in Fluids. 61: 82. DOI: 10.1007/S00348-020-2922-Z |
0.313 |
|
| 2016 |
Lee C, Choi C, Kim C. Superhydrophobic drag reduction in laminar flows: a critical review Experiments in Fluids. 57: 176. DOI: 10.1007/S00348-016-2264-Z |
0.682 |
|
| 2014 |
Warrier GR, Kim C, Sungtaek Ju Y. Microchannel cooling device with perforated side walls: Design and modeling International Journal of Heat and Mass Transfer. 68: 174-183. DOI: 10.1016/J.Ijheatmasstransfer.2013.09.022 |
0.364 |
|
| 2013 |
Choi W, Rubtsov V, Kim C. Miniature Netting System for Endoscopic Object Retrieval From Hard-to-Reach Area Journal of Microelectromechanical Systems. 22: 1158-1165. DOI: 10.1109/Jmems.2013.2255116 |
0.656 |
|
| 2013 |
Huang L, Koo B, Kim C. Sputtered–Anodized $\hbox{Ta}_{2}\hbox{O}_{5}$ as the Dielectric Layer for Electrowetting-on-Dielectric Journal of Microelectromechanical Systems. 22: 253-255. DOI: 10.1109/Jmems.2012.2233719 |
0.33 |
|
| 2012 |
Sun G, Zhao X, Kim C“. Fabrication of Very-High-Aspect-Ratio Microstructures in Complex Patterns by Photoelectrochemical Etching Journal of Microelectromechanical Systems. 21: 1504-1512. DOI: 10.1109/Jmems.2012.2211574 |
0.372 |
|
| 2012 |
Choi W, Rubtsov V, Kim C“. Miniature Flipping Disk Device for Size Measurement of Objects Through Endoscope Journal of Microelectromechanical Systems. 21: 926-933. DOI: 10.1109/Jmems.2012.2194774 |
0.665 |
|
| 2012 |
Lee C, Kim C. Wetting and Active Dewetting Processes of Hierarchically Constructed Superhydrophobic Surfaces Fully Immersed in Water Journal of Microelectromechanical Systems. 21: 712-720. DOI: 10.1109/Jmems.2012.2184081 |
0.668 |
|
| 2011 |
Sun G, Hur JI, Zhao X, Kim C“. Fabrication of Very-High-Aspect-Ratio Micro Metal Posts and Gratings by Photoelectrochemical Etching and Electroplating Journal of Microelectromechanical Systems. 20: 876-884. DOI: 10.1109/Jmems.2011.2148163 |
0.416 |
|
| 2009 |
Choi W, Akbarian M, Rubtsov V, Kim C. Microhand With Internal Visual System Ieee Transactions On Industrial Electronics. 56: 1005-1011. DOI: 10.1109/Tie.2009.2014674 |
0.636 |
|
| 2009 |
He R, Kim C. Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip Ieee\/Asme Journal of Microelectromechanical Systems. 18: 588-596. DOI: 10.1109/Jmems.2009.2017088 |
0.382 |
|
| 2009 |
Kang HW, Sung HJ, Lee T, Kim D, Kim C. Liquid transfer between two separating plates for micro-gravure-offset printing Journal of Micromechanics and Microengineering. 19: 15025. DOI: 10.1088/0960-1317/19/1/015025 |
0.357 |
|
| 2008 |
Joo Y, Yeh HT, Dieu K, Kim C. Air cooling of a microelectronic chip with diverging metal microchannels monolithically processed using a single mask Journal of Micromechanics and Microengineering. 18: 115022. DOI: 10.1088/0960-1317/18/11/115022 |
0.345 |
|
| 2007 |
Chamran F, Yeh Y, Min H, Dunn B, Kim C. Fabrication of High-Aspect-Ratio Electrode Arrays for Three-Dimensional Microbatteries Journal of Microelectromechanical Systems. 16: 844-852. DOI: 10.1109/Jmems.2007.901638 |
0.523 |
|
| 2007 |
He R, Kim C. On-Wafer Monolithic Encapsulation by Surface Micromachining With Porous Polysilicon Shell Ieee\/Asme Journal of Microelectromechanical Systems. 16: 462-472. DOI: 10.1109/Jmems.2007.892797 |
0.382 |
|
| 2006 |
Ok J, Lu Y, Kim C. Pneumatically Driven Microcage for Microbe Manipulation in a Biological Liquid Environment Ieee\/Asme Journal of Microelectromechanical Systems. 15: 1499-1505. DOI: 10.1109/Jmems.2006.883887 |
0.497 |
|
| 2006 |
Tsai JGF, Chen Z, Nelson SF, Kim C. Selective surface treatment of micro printing pin and its performance Applied Physics Letters. 89: 83901. DOI: 10.1063/1.2337882 |
0.39 |
|
| 2004 |
Yokokawa R, Paik J, Dunn B, Kitazawa N, Kotera H, Kim C. Mechanical properties of aerogel-like thin films used for MEMS Journal of Micromechanics and Microengineering. 14: 681-686. DOI: 10.1088/0960-1317/14/5/004 |
0.324 |
|
| 2004 |
Paik J, Fan S, Chang H, Kim C, Wu MC, Dunn B. Development of Spin Coated Mesoporous Oxide Films for MEMS Structures Journal of Electroceramics. 13: 423-428. DOI: 10.1007/S10832-004-5136-5 |
0.538 |
|
| 2002 |
Paik J, Fan S, Kim C, Wu MC, Dunn B. Micromachining of mesoporous oxide films for microelectromechanical system structures Journal of Materials Research. 17: 2121-2129. DOI: 10.1557/Jmr.2002.0313 |
0.551 |
|
| 2002 |
Latorre L, Kim J, Lee J, Guzman P-d, Lee HJ, Nouet P, Kim C. Electrostatic actuation of microscale liquid-metal droplets Ieee\/Asme Journal of Microelectromechanical Systems. 11: 302-308. DOI: 10.1109/Jmems.2002.800934 |
0.363 |
|
| 2000 |
Paik J, Kitazawa N, Fan S, Kim C, Wu MC, Dunn B. Preparation of Mesoporous Oxides for Mems Structures Mrs Proceedings. 657. DOI: 10.1557/Proc-657-Ee7.3 |
0.564 |
|
| 2000 |
Kim C. Microfluidics using the surface tension force in microscale Proceedings of Spie. 4177: 18-24. DOI: 10.1117/12.395667 |
0.337 |
|
| 2000 |
Lee J, Kim C. Surface-tension-driven microactuation based on continuous electrowetting Ieee\/Asme Journal of Microelectromechanical Systems. 9: 171-180. DOI: 10.1109/84.846697 |
0.419 |
|
| 2000 |
Chen Q, Yao D, Kim C, Carman GP. Journal of Materials Science. 35: 5465-5474. DOI: 10.1023/A:1004873029495 |
0.532 |
|
| 2000 |
Yi T, Li L, Kim C. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength Sensors and Actuators a-Physical. 83: 172-178. DOI: 10.1016/S0924-4247(00)00350-2 |
0.539 |
|
| 1999 |
Sherman F, Tung S, Kim C, Ho C, Woo J. Flow control by using high-aspect-ratio, in-plane microactuators Sensors and Actuators a-Physical. 73: 169-175. DOI: 10.1016/S0924-4247(98)00267-2 |
0.346 |
|
| 1998 |
Kim C. Microgasketing and adhesive wicking techniques for fabrication of microfluidic devices Proceedings of Spie. 3515: 286-291. DOI: 10.1117/12.322072 |
0.392 |
|
| 1998 |
Simon J, Saffer S, Sherman F, Kim C. Lateral polysilicon microrelays with a mercury microdrop contact Ieee Transactions On Industrial Electronics. 45: 854-860. DOI: 10.1109/41.735328 |
0.392 |
|
| 1998 |
Kim C, Kim JY, Sridharan B. Comparative evaluation of drying techniques for surface micromachining Sensors and Actuators a-Physical. 64: 17-26. DOI: 10.1016/S0924-4247(98)80053-8 |
0.361 |
|
| 1996 |
Saffer S, Simon J, Kim C, Park KH, Lee J. Mercury-contact switching with gap-closing microcantilever Proceedings of Spie. 2882: 204-209. DOI: 10.1117/12.250705 |
0.365 |
|
| 1996 |
Yee Y, Chun K, Lee JD, Kim C. Polysilicon surface-modification technique to reduce sticking of microstructures Sensors and Actuators a-Physical. 52: 145-150. DOI: 10.1016/0924-4247(96)80140-3 |
0.394 |
|
| 1993 |
Kobayashi D, Kim C, Fujita H. Photoresist-Assisted Release of Movable Microstructures Japanese Journal of Applied Physics. 32: L1642-L1644. DOI: 10.1143/Jjap.32.L1642 |
0.355 |
|
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