Hong Shi, Ph.D. - Publications
Affiliations: | 2012 | Chemical Engineering | University of Utah, Salt Lake City, UT |
Area:
Chemical Engineering, General Engineering, Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2010 | Shi H, Ring TA. CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect Microelectronic Engineering. 87: 2368-2375. DOI: 10.1016/J.Mee.2010.04.010 | 0.493 | |||
2010 | Shi H, Ring TA. Analytical solution for polish-rate decay in chemical-mechanical polishing Journal of Engineering Mathematics. 68: 207-211. DOI: 10.1007/S10665-010-9369-9 | 0.489 | |||
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