Eric John Cotts
Affiliations: | Physics, Applied Physics, and Astronomy | State University of New York at Binghamton, Vestal, NY, United States |
Area:
Condensed Matter Physics, Materials Science Engineering, NanotechnologyWebsite:
https://www.binghamton.edu/physics/people/eric/Google:
"Eric John Cotts"Bio:
Parents
Sign in to add mentor| Ansel "Andy" Anderson | grad student | 1983 | UIUC (Physics Tree) | |
| (Influence of Structural Relaxation Upon the Low Temperature Properties of Metallic Glasses.) | ||||
Children
Sign in to add trainee| Richard R. Chromik | grad student | 2001 | SUNY Binghamton |
| Thomas E. Driscoll | grad student | 2001 | SUNY Binghamton |
| Anis B. Zribi | grad student | 2002 | SUNY Binghamton |
| Robert K. Kinyanjui | grad student | 2005 | SUNY Binghamton |
| Travis Z. Fullem | grad student | 2008 | SUNY Binghamton |
| Babak Arfaei | grad student | 2010 | SUNY Binghamton |
| Mao Gao | grad student | 2010 | SUNY Binghamton |
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Publications
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| Hadian F, Schoeller H, Cotts E. (2020) Correlation Between the Growth of Voids and Ni 3 Sn 4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C Journal of Electronic Materials. 49: 226-240 |
| Mutuku F, Arfaei B, Cotts EJ. (2017) The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints Journal of Electronic Materials. 46: 2067-2079 |
| Arfaei B, Mutuku F, Coyle R, et al. (2015) Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology Proceedings - Electronic Components and Technology Conference. 2015: 118-126 |
| Cotts E, Arfaei B. (2015) Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging Jom. 67: 2381-2382 |
| Mutuku F, Arfaei B, Cotts EJ. (2014) Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys Proceedings - Electronic Components and Technology Conference. 1769-1775 |
| Parks G, Lu M, Perfecto E, et al. (2014) Controlling the Sn grain morphology of SnAg C4 solder bumps Proceedings - Electronic Components and Technology Conference. 690-696 |
| Arfaei B, Mutuku F, Sweatman K, et al. (2014) Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish Proceedings - Electronic Components and Technology Conference. 655-665 |
| Parks G, Faucett A, Fox C, et al. (2014) The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities Jom. 66: 2311-2319 |
| Schoeller H, Anselm M, Khan I, et al. (2014) Effect of Sn component surface finish on 92.5Pb-5Sn-2.5Ag International Conference and Exhibition On High Temperature Electronics, Hitec 2014. 144-151 |
| Arfaei B, Mahin-Shirazi S, Joshi S, et al. (2013) Reliability and failure mechanism of solder joints in thermal cycling tests Proceedings - Electronic Components and Technology Conference. 976-985 |