Robert K. Kinyanjui, Ph.D.

2005 State University of New York at Binghamton, Vestal, NY, United States 
Materials Science Engineering
"Robert Kinyanjui"


Sign in to add mentor
Eric John Cotts grad student 2005 SUNY Binghamton
 (Thermal processes and solidification kinetcs of evolution of the microstructure of tin-silver-copper solder alloys.)
BETA: Related publications


You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Lehman LP, Kinyanjui RK, Wang J, et al. (2005) Microstructure and damage evolution in Sn-Ag-Cu solder joints Proceedings - Electronic Components and Technology Conference. 1: 674-681
Lehman LP, Athavale SN, Fullem TZ, et al. (2004) Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder Journal of Electronic Materials. 33: 1429-1439
Lehman LP, Kinyanjui RK, Zavalij L, et al. (2003) Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories Proceedings - Electronic Components and Technology Conference. 1215-1221
Kinyanjui RK, Zribi A, Cotts EJ. (2002) Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate Proceedings - Electronic Components and Technology Conference. 161-167
See more...