Robert K. Kinyanjui, Ph.D.

Affiliations: 
2005 State University of New York at Binghamton, Vestal, NY, United States 
Area:
Materials Science Engineering
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"Robert Kinyanjui"

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Eric John Cotts grad student 2005 SUNY Binghamton
 (Thermal processes and solidification kinetcs of evolution of the microstructure of tin-silver-copper solder alloys.)
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Publications

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Lehman LP, Kinyanjui RK, Wang J, et al. (2005) Microstructure and damage evolution in Sn-Ag-Cu solder joints Proceedings - Electronic Components and Technology Conference. 1: 674-681
Lehman LP, Athavale SN, Fullem TZ, et al. (2004) Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder Journal of Electronic Materials. 33: 1429-1439
Lehman LP, Kinyanjui RK, Zavalij L, et al. (2003) Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories Proceedings - Electronic Components and Technology Conference. 1215-1221
Kinyanjui RK, Zribi A, Cotts EJ. (2002) Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate Proceedings - Electronic Components and Technology Conference. 161-167
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