Gang Huang, Ph.D. - Publications
Affiliations: | 2008 | Georgia Institute of Technology, Atlanta, GA |
Area:
Microelectronics/MicrosystemsYear | Citation | Score | |||
---|---|---|---|---|---|
2014 | Zheng L, Zhang Y, Huang G, Bakir MS. Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 777-785. DOI: 10.1109/Tcpmt.2014.2309680 | 0.601 | |||
2012 | Huang G, Bakir MS, Naeemi A, Meindl JD. Power delivery for 3-D chip stacks: Physical modeling and design implication Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 852-859. DOI: 10.1109/Tcpmt.2012.2185047 | 0.656 | |||
2009 | Bakir M, Huang G, Sekar D, King C. 3D integrated circuits: Liquid cooling and power delivery Iete Technical Review (Institution of Electronics and Telecommunication Engineers, India). 26: 407-416. DOI: 10.4103/0256-4602.57826 | 0.586 | |||
2009 | Bakir MS, Huang G. Power delivery, signaling and cooling for 3D integrated systems Materials Research Society Symposium Proceedings. 1156: 169-179. DOI: 10.1557/Proc-1156-D08-06-F06-06 | 0.691 | |||
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