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Eric John Cotts - Publications

Affiliations: 
Physics, Applied Physics, and Astronomy State University of New York at Binghamton, Vestal, NY, United States 
Area:
Condensed Matter Physics, Materials Science Engineering, Nanotechnology
Website:
https://www.binghamton.edu/physics/people/eric/

104 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Arfaei B, Mutuku F, Coyle R, Cotts E, Wilcox J. Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology Proceedings - Electronic Components and Technology Conference. 2015: 118-126. DOI: 10.1109/ECTC.2015.7159580  1
2015 Cotts E, Arfaei B. Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging Jom. 67: 2381-2382. DOI: 10.1007/s11837-015-1597-z  1
2014 Mutuku F, Arfaei B, Cotts EJ. Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys Proceedings - Electronic Components and Technology Conference. 1769-1775. DOI: 10.1109/ECTC.2014.6897538  1
2014 Parks G, Lu M, Perfecto E, Cotts E. Controlling the Sn grain morphology of SnAg C4 solder bumps Proceedings - Electronic Components and Technology Conference. 690-696. DOI: 10.1109/ECTC.2014.6897359  1
2014 Arfaei B, Mutuku F, Sweatman K, Lee NC, Cotts E, Coyle R. Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish Proceedings - Electronic Components and Technology Conference. 655-665. DOI: 10.1109/ECTC.2014.6897356  1
2014 Parks G, Faucett A, Fox C, Smith J, Cotts E. The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities Jom. 66: 2311-2319. DOI: 10.1007/s11837-014-1161-2  1
2014 Schoeller H, Anselm M, Khan I, Cotts E. Effect of Sn component surface finish on 92.5Pb-5Sn-2.5Ag International Conference and Exhibition On High Temperature Electronics, Hitec 2014. 144-151.  1
2013 Arfaei B, Mahin-Shirazi S, Joshi S, Anselm M, Borgesen P, Cotts E, Wilcox J, Coyle R. Reliability and failure mechanism of solder joints in thermal cycling tests Proceedings - Electronic Components and Technology Conference. 976-985. DOI: 10.1109/ECTC.2013.6575693  1
2013 Arfaei B, Benedict M, Cotts EJ. Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints Journal of Applied Physics. 114. DOI: 10.1063/1.4826437  1
2012 Arfaei B, Wentlent L, Joshi S, Alazzam A, Tashtoush T, Halaweh M, Chivukula S, Yin L, Meilunas M, Cotts E, Borgesen P. Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 392-398. DOI: 10.1109/ITHERM.2012.6231456  1
2012 Parks G, Arfaei B, Benedict M, Cotts E, Lu M, Perfecto E. The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry Proceedings - Electronic Components and Technology Conference. 703-709. DOI: 10.1109/ECTC.2012.6248909  1
2012 Arfaei B, Kim N, Cotts EJ. Dependence of Sn grain morphology of Sn-Ag-Cu solder on solidification temperature Journal of Electronic Materials. 41: 362-374. DOI: 10.1007/s11664-011-1756-0  1
2011 Arfaei B, Tashtoush T, Kim N, Wentlent L, Cotts E, Borgesen P. Dependence of SnAgCu solder joint properties on solder microstructure Proceedings - Electronic Components and Technology Conference. 125-132. DOI: 10.1109/ECTC.2011.5898502  1
2011 Rae DF, Borgesen P, Cotts EJ. The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines Jom. 63: 78-84. DOI: 10.1007/s11837-011-0180-5  1
2011 Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N. Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Journal of Applied Electrochemistry. 41: 469-480. DOI: 10.1007/s10800-011-0257-4  1
2010 Wafula F, Liu Y, Yin L, Bliznakov S, Borgesen P, Cotts EJ, Dimitrov N. Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3271129  1
2010 Lehman LP, Xing Y, Bieler TR, Cotts EJ. Cyclic twin nucleation in tin-based solder alloys Acta Materialia. 58: 3546-3556. DOI: 10.1016/j.actamat.2010.01.030  1
2009 Wafula F, Liu Y, Yin L, Bliznakov S, Borgesen P, Cotts EJ, Dimitrov N. Understanding, controlling and minimizing the voiding, sporadically occurring in solder joints with electroplated copper Ecs Transactions. 19: 43-56. DOI: 10.1149/1.3246597  1
2009 Yin L, Kondos P, Borgesen P, Liu Y, Bliznakov S, Wafula F, Dimitrov N, Henderson DW, Parks C, Gao M, Therriault J, Wang J, Cotts E. Controlling Cu electroplating to prevent sporadic voiding in Cu 3Sn Proceedings - Electronic Components and Technology Conference. 406-414. DOI: 10.1109/ECTC.2009.5074046  1
2009 Venkatadri V, Yin L, Xing Y, Cotts E, Srihari K, Borgesen P. Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion Proceedings - Electronic Components and Technology Conference. 398-405. DOI: 10.1109/ECTC.2009.5074045  1
2009 Arfaei B, Cotts E. Correlations between the microstructure and fatigue life of near-eutectic Sn-Ag-Cu Pb-free solders Journal of Electronic Materials. 38: 2617-2627. DOI: 10.1007/s11664-009-0932-y  1
2009 Rae DF, Borgesen P, Cotts E. Optimizing the automated assembly process for filled-polymer based thermal bondlines Ipc Apex Expo 2009. 3: 1662-1712.  1
2008 Bieler TR, Jiang H, Lehman LP, Kirkpatrick T, Cotts EJ, Nandagopal B. Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints Ieee Transactions On Components and Packaging Technologies. 31: 370-381. DOI: 10.1109/TCAPT.2008.916835  1
2008 Fullem TZ, Rae DF, Sharma A, Wolcott JA, Cotts EJ. Thermal characterization of thermal interface material bondlines 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 174-179. DOI: 10.1109/ITHERM.2008.4544268  1
2008 Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Bliznakov S, Cotts EJ, Dimitrov N. Improving copper electrodeposition in the microelectronics industry Proceedings - Electronic Components and Technology Conference. 2105-2110. DOI: 10.1109/ECTC.2008.4550276  1
2008 Arfaei B, Xing Y, Woods J, Wolcott J, Tumne P, Borgesen P, Cotts E. The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints Proceedings - Electronic Components and Technology Conference. 459-465. DOI: 10.1109/ECTC.2008.4550012  1
2008 Davidson D, Lehmann GL, Cotts EJ. Horizontal capillary flow of a Newtonian liquid in a narrow gap between a plane wall and a sinusoidal wall Fluid Dynamics Research. 40: 779-802. DOI: 10.1016/j.fluiddyn.2008.04.003  1
2008 Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N. Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface : PPPlating in acidic copper solution with and without polyethylene glycol Journal of Applied Electrochemistry. 38: 1695-1705. DOI: 10.1007/s10800-008-9618-z  1
2008 Fullem TZ, Cotts EJ. Thermal conductivity of thermal interface materials Materials Research Society Symposium Proceedings. 1053: 17-22.  1
2007 Park S, Dhakal R, Lehman L, Cotts EJ. Grain deformation and strain in board level SnAgCu solder interconnects under deep thermal cycling Ieee Transactions On Components and Packaging Technologies. 30: 178-185. DOI: 10.1109/TCAPT.2007.892101  1
2007 Fullem TZ, Lehman LP, Cotts EJ. Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors Ieee Nuclear Science Symposium Conference Record. 2: 1325-1328. DOI: 10.1109/NSSMIC.2007.4437245  1
2007 Bogoyavlenskiy VA, Cotts EJ. Reply to "comment on 'Free surface Hele-Shaw flows around an obstacle: A random walk simulation'" Physical Review E - Statistical, Nonlinear, and Soft Matter Physics. 76. DOI: 10.1103/PhysRevE.76.038302  1
2007 Park S, Dhakal R, Lehman L, Cotts E. Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading Acta Materialia. 55: 3253-3260. DOI: 10.1016/j.actamat.2007.01.028  1
2007 Arfaei B, Benedict M, Cotts E. The nucleation kinetics of Sn in Sn-Ag-Cu solder joints: Relation to microstructure Materials Science and Technology Conference and Exhibition, Ms and T'07 - "Exploring Structure, Processing, and Applications Across Multiple Materials Systems". 5: 3358-3364.  1
2007 Borgesen P, Bieler T, Lehman LP, Cotts EJ. Pb-free solder: New materials considerations for microelectronics processing Mrs Bulletin. 32: 360-365.  1
2005 Kinyanjui R, Lehman LP, Zavalij L, Cotts E. Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys Journal of Materials Research. 20: 2914-2918. DOI: 10.1557/JMR.2005.0361  1
2005 Park S, Dhakal R, Lehman L, Cotts E. Grain formation and intergrain stresses in a Sn-Ag-Cu solder ball Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1095-1100.  1
2005 Lehman LP, Kinyanjui RK, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Microstructure and damage evolution in Sn-Ag-Cu solder joints Proceedings - Electronic Components and Technology Conference. 1: 674-681.  1
2004 Bogoyavlenskiy VA, Cotts EJ. Free surface Hele-Shaw flows around an obstacle: A random walk simulation. Physical Review. E, Statistical, Nonlinear, and Soft Matter Physics. 69: 016310. PMID 14995715 DOI: 10.1103/PhysRevE.69.016310  1
2004 Henderson DW, Woods JJ, Gosselin TA, Bartelo J, King DE, Korhonen TM, Korhonen MA, Lehman LP, Cotts EJ, Kang SK, Lauro P, Shih DY, Goldsmith C, Puttlitz KJ. The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue Journal of Materials Research. 19: 1608-1612. DOI: 10.1557/JMR.2004.0222  1
2004 Pitely S, Zavalij L, Zarembo S, Cotts EJ. Linear coefficients of thermal expansion of Au0.5Ni 0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4 Scripta Materialia. 51: 745-749. DOI: 10.1016/j.scriptamat.2004.02.023  1
2004 Bogoyavlenskiy VA, Giamis AC, Cotts EJ. Mean-field dynamics of free surface flows through obstacle arrays in a narrow passage: Amendments of the Washburn model Fluid Dynamics Research. 35: 23-25. DOI: 10.1016/j.fluiddyn.2004.04.001  1
2004 Telang AU, Bieler TR, Lucas JP, Subramanian KN, Lehman LP, Xing Y, Cotts EJ. Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys Journal of Electronic Materials. 33: 1412-1423.  1
2004 Lehman LP, Athavale SN, Fullem TZ, Giamis AC, Kinyanjui RK, Lowenstein M, Mather K, Patel R, Rae D, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder Journal of Electronic Materials. 33: 1429-1439.  1
2003 Lehman LP, Kinyanjui RK, Zavalij L, Zribi A, Cotts EJ. Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories Proceedings - Electronic Components and Technology Conference. 1215-1221.  1
2002 Davidson D, Lehmann GL, Cotts EJ. Effect of geometric surface features on void formation: Application to the underfill process Proceedings - Electronic Components and Technology Conference. 1411-1418. DOI: 10.1109/ECTC.2002.1008291  1
2002 Chromik RR, Zavalij L, Johnson MD, Cotts EJ. Calorimetric investigation of the formation of metastable silicides in Au/a-Si thin film multilayers Journal of Applied Physics. 91: 8992-8998. DOI: 10.1063/1.1432774  1
2002 Zavalij L, Zribi A, Chromik RR, Pitely S, Zavalij PY, Cotts EJ. Crystal structure of Au1-xNixSn4 intermetallic alloys Journal of Alloys and Compounds. 334: 79-85. DOI: 10.1016/S0925-8388(01)01780-7  1
2002 Kinyanjui RK, Zribi A, Cotts EJ. Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate Proceedings - Electronic Components and Technology Conference. 161-167.  1
2002 Zribi A, Kinyanjui R, Borgesen P, Zavalij L, Cotts EJ. Aspects of the structural evolution of lead-free solder joints Jom. 54: 38-40.  1
2001 Zarembo SN, Myers CE, Kematick RJ, Zavalij PY, Whittingham MS, Cotts EJ. Vaporization thermodynamics and heat capacities of Cr3Ge and Cr5Ge3 Journal of Alloys and Compounds. 329: 97-107. DOI: 10.1016/S0925-8388(01)01551-1  1
2001 Agarwal S, Cotts EJ, Zarembo S, Kematick R, Myers C. Heat capacities of titanium silicides Ti5Si3, TiSi and TiSi2 Journal of Alloys and Compounds. 314: 99-102. DOI: 10.1016/S0925-8388(00)01223-8  1
2001 Driscoll TE, Lehmann GL, Cotts EJ. Underfill encapsulant flow measured using capacitance measurement techniques Materials Research Society Symposium Proceedings. 682: 21-25.  1
2001 Zribi A, Borgesen P, Zavalij L, Cotts EJ. Growth of Cu-Ni-Sn alloys in Pb free CuSnAg solder/Au-Ni metallization reactions Materials Research Society Symposium - Proceedings. 652.  1
2001 Zribi A, Clark A, Zavalij L, Borgesen P, Cotts EJ. The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure Journal of Electronic Materials. 30: 1157-1164.  1
2001 Zribi A, Zavalij L, Borgesen P, Primavera A, Westby G, Cotts EJ. The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronics joints Proceedings - Electronic Components and Technology Conference. 687-692.  1
2000 Zribi A, Chromik RR, Presthus R, Teed K, Zavalij L, De Vita J, To Va J, Cotts EJ, Clum JA, Erich R, Primavera A, Westby G, Coyle RJ, Wenger GM. Solder metallization interdiffusion in microelectronic interconnects Ieee Transactions On Components and Packaging Technologies. 23: 383-387. DOI: 10.1109/6144.846778  1
2000 Zarembo S, Kematick RJ, Myers CE, Cotts EJ. Vaporization thermodynamics and heat capacities of Ti5Ge3 and Ti6Ge5 Journal of Alloys and Compounds. 306: 78-86. DOI: 10.1016/S0925-8388(00)00759-3  1
1999 Archer DG, Kematick RJ, Myers CE, Agarwal S, Cotts EJ. Enthalpy increment measurements from 4.5 K to 350 K and the thermodynamic properties of the titanium silicide TiSi(cr) Journal of Chemical and Engineering Data. 44: 167-172. DOI: 10.1021/je9802120  1
1999 Chromik RR, Neils WK, Cotts EJ. Thermodynamic and kinetic study of solid state reactions in the Cu-Si system Journal of Applied Physics. 86: 4273-4281.  1
1999 Guo Y, Lehmann GL, Driscoll T, Cotts EJ. Model of the underfill flow process: particle distribution effects Proceedings - Electronic Components and Technology Conference. 71-76.  1
1999 Zribi A, Chromik RR, Presthus R, Clum J, Zavalij L, Cotts EJ. Effect of Au-intermetallic compounds on mechanical reliability of Sn-Pb/Au-Ni-Cu joints American Society of Mechanical Engineers, Eep. 26.  1
1999 Li P, Driscoll T, Guydosh N, Cascio J, Huang Y, Cotts EJ, Gao Y, Lehmann G. Metrics for the underfill flow process American Society of Mechanical Engineers, Eep. 26.  1
1999 Zribi A, Chromik RR, Presthus R, Clum J, Teed K, Zavalij L, De Vita J, Tova J, Cotts EJ. Solder metalization interdiffusion in microelectronic interconnects Proceedings - Electronic Components and Technology Conference. 451-457.  1
1998 Chromik RR, Neils WK, Cotts EJ. Formation of Cu3Si from Cu/a-Si multilayers Materials Research Society Symposium - Proceedings. 481: 581-586. DOI: 10.1557/PROC-481-581  1
1998 Lehmann GL, Driscoll T, Guydosh NR, Li PC, Cotts EJ. Underflow process for direct-chip-attachment packaging Ieee Transactions On Components Packaging and Manufacturing Technology Part A. 21: 266-274. DOI: 10.1109/95.705474  1
1997 Chromik RR, Cotts EJ. Thermodynamic and kinetic study of phase transformations in solder/metal systems Materials Research Society Symposium - Proceedings. 445: 31-36.  1
1997 Kasica RJ, Cotts EJ. The enthalpy of formation of thin film titanium disilicide Journal of Applied Physics. 82: 1488-1490.  1
1997 Clum J, Cotts E, Jiang N. Summary of recent studies of the effect of processing on microstructure of some solder alloys Tms Annual Meeting. 137-143.  1
1997 Driscoll TE, Li PC, Lehmann GL, Cotts EJ. Investigation of the flow behavior of particulate filled fluids Materials Research Society Symposium - Proceedings. 445: 69-74.  1
1997 Jiang N, Clum JA, Chromik RR, Cotts EJ. Thermal expansion of several Sn-based intermetallic compounds Scripta Materialia. 37: 1851-1854.  1
1996 Chromik RR, Cotts EJ. Study of the kinetics and energetics of solid state reactions in Pd/Sn diffusion couples Materials Research Society Symposium - Proceedings. 398: 307-312.  1
1996 Archer DG, Filor D, Oakley E, Cotts EJ. Enthalpy increment measurements from 4.5 K to 350 K and the thermodynamic properties of the titanium silicide Ti5Si3(cr) Journal of Chemical and Engineering Data. 41: 571-575.  1
1996 Kasica RJ, Cotts EJ, Ahrens RG. Kinetics and thermodynamics of the formation of thin film titanium disilicide Materials Research Society Symposium - Proceedings. 398: 301-305.  1
1996 Neils WK, Chromik RR, Dreyer KF, Grosman D, Cotts EJ. Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin film diffusion couples Materials Research Society Symposium - Proceedings. 398: 313-318.  1
1995 Dreyer KF, Neils WK, Chromik RR, Grosman D, Cotts EJ. Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin-film diffusion couples Applied Physics Letters. 67: 2795. DOI: 10.1063/1.114596  1
1995 Archer DG, Sabella MS, Stillman SE, Cotts EJ. Enthalpy increment measurements from 4.5 to 350 K and the thermodynamic properties of titanium disilicide(cr) to 1700 K Journal of Chemical &Amp; Engineering Data. 40: 1237-1241.  1
1994 Sylla WK, Stillman SE, Sabella MS, Cotts EJ. The heat capacity of titanium disilicide Journal of Applied Physics. 76: 2752-2755. DOI: 10.1063/1.358507  1
1993 Feder K, Gance K, Cotts EJ. Calorimetric study of solid state reactions Pure and Applied Chemistry. 65: 895-900. DOI: 10.1351/pac199365050895  1
1993 Grosman D, Cotts EJ. Averaged interdiffusion coefficient during solid-state amorphization reactions between metal layers Physical Review B. 48: 5579-5584. DOI: 10.1103/PhysRevB.48.5579  1
1992 Patt ME, White BE, Stein B, Cotts EJ. Thermal time constants in differential scanning calorimetry Thermochimica Acta. 197: 413-424. DOI: 10.1016/0040-6031(92)85042-T  1
1992 White BE, Cotts EJ, Myers CE, McCreary JC, Kematick RJ. The heat capacities of V3P and V3Si The Journal of Chemical Physics. 96: 9243-9344.  1
1991 Suzuki M, Santodonato LJ, Suzuki IS, White BE, Cotts EJ. Structural phase transition of high-stage MoCl5 graphite intercalation compounds Physical Review B. 43: 5805-5814. DOI: 10.1103/PhysRevB.43.5805  1
1990 White BE, Patt ME, Cotts EJ. Comparison of solid-state amorphization reactions in deformed Ni-Ti and Ni-Zr multilayered composites Physical Review B. 42: 11017-11026. DOI: 10.1103/PhysRevB.42.11017  1
1990 White BE, Patt ME, Cotts EJ. A comparison by means of calorimetry of solid state interdiffusion reactions in Ni/Zr and Ni/Ti composites Journal of Applied Physics. 68: 1910-1913. DOI: 10.1063/1.346581  1
1990 Wong GC, Johnson WL, Cotts EJ. Solid state amorphization reactions in deformed Ni-Zr multilayered composites Journal of Materials Research. 5: 488-497.  1
1989 Yang IS, Anderson AC, Kim YS, Cotts EJ. Phonon-dislocation interaction in deformed lithium fluoride Physical Review B. 40: 1297-1300. DOI: 10.1103/PhysRevB.40.1297  1
1988 Anlage SM, Johnson WL, Cotts EJ, Follstaedt DM, Knapp JA. Electrical transport properties of the aluminum-ruthenium icosahedral phase. Physical Review. B, Condensed Matter. 38: 7802-7805. PMID 9945511 DOI: 10.1103/PhysRevB.38.7802  1
1988 Cotts EJ, Wong GC, Johnson WL. Calorimetric observations of amorphous and crystalline Ni-Zr alloy formation by solid-state reaction Physical Review B. 37: 9049-9052. DOI: 10.1103/PhysRevB.37.9049  1
1988 Markert JT, Cotts EJ, Cotts RM. Hydrogen diffusion in the metallic glass a-Zr3RhH3.5 Physical Review B. 37: 6446-6452. DOI: 10.1103/PhysRevB.37.6446  1
1987 Yeh XL, Cotts EJ. A study of the thermodynamics of the crystalline-to-amorphous transformation in zr-based hydrides by means of thermal analysis Journal of Materials Research. 2: 173-177. DOI: 10.1557/JMR.1987.0173  1
1986 Cotts EJ, Meng WJ, Johnson WL. Calorimetric study of amorphization in planar, binary, multilayer, thin-film diffusion couples of Ni and Zr Physical Review Letters. 57: 2295-2298. DOI: 10.1103/PhysRevLett.57.2295  1
1984 Wong KM, Cotts EJ, Poon SJ. Upper critical fields in liquid-quenched metastable superconductors Physical Review B. 30: 1253-1259. DOI: 10.1103/PhysRevB.30.1253  1
1984 Ackerman DA, Anderson AC, Cotts EJ, Dobbs JN, MacDonald WM, Walker FJ. Low-temperature thermal expansion of disordered solids Physical Review B. 29: 966-975. DOI: 10.1103/PhysRevB.29.966  1
1984 Cotts EJ, Anderson AC. Measurement of thermal conductivities of glassy-metallic ribbons at low temperatures Review of Scientific Instruments. 55: 255-256. DOI: 10.1063/1.1137736  1
1984 Poon SJ, Cotts EJ, Wong KM. Magnetoresistance of amorphous d-band metals with high electrical resistivity Solid State Communications. 52: 519-523. DOI: 10.1016/0038-1098(84)90868-8  1
1983 MacDonald WM, Cotts EJ, Anderson AC. Thermal expansion of amorphous Pd0.775Si0.165Cu0.06 [1] Physical Review Letters. 51: 939. DOI: 10.1103/PhysRevLett.51.939  1
1983 Cotts EJ, Anderson AC, Poon SJ. Influence of structural relaxation on the low-temperature properties of glassy metals Physical Review B. 28: 6127-6129. DOI: 10.1103/PhysRevB.28.6127  1
1983 Northrop GA, Cotts EJ, Anderson AC, Wolfe JP. Anisotropic phonon-dislocation scattering in deformed LiF Physical Review B. 27: 6395-6408. DOI: 10.1103/PhysRevB.27.6395  1
1983 Cotts EJ, Shore SE, Anderson AC. Thermal transport in heavily deformed and γ -irradiated LiF at temperatures near 1 k Journal of Physics and Chemistry of Solids. 44: 865-868. DOI: 10.1016/0022-3697(83)90123-3  1
1982 Northrop GA, Cotts EJ, Anderson AC, Wolfe JP. Phonon imaging of highly dislocated LiF Physical Review Letters. 49: 54-57. DOI: 10.1103/PhysRevLett.49.54  1
1981 Cotts EJ, Miliotis DM, Anderson AC. Thermal transport in deformed lithium fluoride Physical Review B. 24: 7336-7341. DOI: 10.1103/PhysRevB.24.7336  1
1981 Cotts EJ, Anderson AC. Low-temperature specific heat of deformed lithium fluoride crystals Physical Review B. 24: 7329-7335. DOI: 10.1103/PhysRevB.24.7329  1
1981 Cotts EJ, Anderson AC. The specific heat of copper at temperatures below 0.2 K Journal of Low Temperature Physics. 43: 437-443. DOI: 10.1007/BF00115606  1
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