Year |
Citation |
Score |
2020 |
Wortman-Otto KM, Graverson CF, Linhart AN, McDonough RK, Mlynarski AL, Keleher JJ. Synergistic Effect of Pad “Macroporous-Reactors” on Passivation Mechanisms to Modulate Cu Chemical Mechanical Planarization (CMP) Performance Ecs Journal of Solid State Science and Technology. 9: 54005. DOI: 10.1149/2162-8777/Ab9B05 |
0.306 |
|
2019 |
Zubi TB, Wiencek RA, Mlynarski AL, Truffa JM, Wortman-Otto KM, Saucedo C, Salinas MG, Graverson CF, Keleher JJ. Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications Ecs Journal of Solid State Science and Technology. 8. DOI: 10.1149/2.0041905Jss |
0.303 |
|
2018 |
Rickhoff TA, Sullivan E, Werth LK, Kissel DS, Keleher JJ. A biomimetic cellulose-based composite material that incorporates the antimicrobial metal-organic framework HKUST-1 Journal of Applied Polymer Science. 136: 46978. DOI: 10.1002/App.46978 |
0.409 |
|
2012 |
Soderquist TJ, Chesniak OM, Witt MR, Paramo A, Keeling VA, Keleher JJ. Evaluation of the catalytic decomposition of H2O2 through use of organo-metallic complexes--a potential link to the luminol presumptive blood test. Forensic Science International. 219: 101-5. PMID 22227152 DOI: 10.1016/J.Forsciint.2011.12.005 |
0.393 |
|
2009 |
Stewart KL, Keleher JJ, Gewirth AA. Synergy of ammonium oxalate and hydrogen peroxide on the dissolution of copper at neutral pH Journal of the Electrochemical Society. 156: H595-H600. DOI: 10.1149/1.3129611 |
0.336 |
|
2007 |
Cheemalapati K, Keleher J, Li Y. Key Chemical Components in Metal CMP Slurries Microelectronic Applications of Chemical Mechanical Planarization. 201-247. DOI: 10.1002/9780470180907.ch7 |
0.451 |
|
2002 |
Keleher J, Bashant J, Heldt N, Johnson L, Li Y. Photo-catalytic preparation of silver-coated TiO2 particles for antibacterial applications World Journal of Microbiology & Biotechnology. 18: 133-139. DOI: 10.1023/A:1014455310342 |
0.459 |
|
2000 |
Hariharaputhiran M, Zhang J, Ramarajan S, Keleher JJ, Li Y, Babu SV. Hydroxyl radical formation in H2O2-amino acid mixtures and chemical mechanical polishing of copper Journal of the Electrochemical Society. 147: 3820-3826. DOI: 10.1149/1.1393979 |
0.469 |
|
2000 |
Keleher J, Zhang J, Waud S, Li Y. Bridging the Gap: Understanding the Chemistry of CMP The Chemical Educator. 5: 242-245. DOI: 10.1007/S00897000412A |
0.523 |
|
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