| Year |
Citation |
Score |
| 2021 |
Li Y, Gong L, Xu M, Joshi Y. Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling Journal of Electronic Packaging. 143. DOI: 10.1115/1.4046756 |
0.535 |
|
| 2020 |
Li W, Joshi Y. Capillary-assisted evaporation/boiling in PDMS microchannel integrated with wicking microstructures. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 32877610 DOI: 10.1021/Acs.Langmuir.0C01711 |
0.513 |
|
| 2020 |
Kim J, Brown JM, Joshi Y, O'connor K, Diaz M, Zhang Z, Yang P. Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components Journal of Electronic Packaging. 142. DOI: 10.1115/1.4046933 |
0.415 |
|
| 2020 |
Kim J, Brown JM, O'Connor K, Diaz M, Joshi Y. Thermal Modeling of Outdoor Digital Displays Under Different Brightness Outputs Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 949-955. DOI: 10.1109/Tcpmt.2020.2993521 |
0.376 |
|
| 2020 |
Li Y, Gong L, Xu M, Joshi Y. Enhancing the performance of aluminum foam heat sinks through integrated pin fins International Journal of Heat and Mass Transfer. 151: 119376. DOI: 10.1016/J.Ijheatmasstransfer.2020.119376 |
0.573 |
|
| 2020 |
Li Y, Gong L, Xu M, Joshi Y. Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink Applied Thermal Engineering. 166: 114665. DOI: 10.1016/J.Applthermaleng.2019.114665 |
0.572 |
|
| 2019 |
Cho S, Joshi Y. Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber Journal of Heat Transfer-Transactions of the Asme. 141: 51401. DOI: 10.1115/1.4042328 |
0.373 |
|
| 2019 |
Lorenzini D, Joshi Y. Flow boiling heat transfer in silicon microgaps with multiple hotspots and variable pin fin clustering Physics of Fluids. 31: 102002. DOI: 10.1063/1.5122209 |
0.459 |
|
| 2019 |
Fulpagare Y, Bhargav A, Joshi Y. Dynamic thermal characterization of raised floor plenum data centers: Experiments and CFD Journal of Building Engineering. 25: 100783. DOI: 10.1016/J.Jobe.2019.100783 |
0.363 |
|
| 2019 |
Lorenzini D, Joshi Y. Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics International Journal of Heat and Mass Transfer. 138: 194-207. DOI: 10.1016/J.Ijheatmasstransfer.2019.04.036 |
0.524 |
|
| 2019 |
Athavale J, Yoda M, Joshi Y. Comparison of data driven modeling approaches for temperature prediction in data centers International Journal of Heat and Mass Transfer. 135: 1039-1052. DOI: 10.1016/J.Ijheatmasstransfer.2019.02.041 |
0.344 |
|
| 2018 |
Broughton J, Smet V, Tummala RR, Joshi YK. Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes Journal of Electronic Packaging. 140: 40801. DOI: 10.1115/1.4040828 |
0.316 |
|
| 2018 |
Lorenzini D, Joshi YK. Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux Journal of Heat Transfer-Transactions of the Asme. 140: 11501. DOI: 10.1115/1.4037343 |
0.463 |
|
| 2018 |
Fulpagare Y, Joshi Y, Bhargav A. Rack level transient CFD modeling of data center International Journal of Numerical Methods For Heat & Fluid Flow. 28: 381-394. DOI: 10.1108/Hff-10-2016-0426 |
0.438 |
|
| 2018 |
Asrar P, Zhang X, Green CE, Bakir M, Joshi YK. Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins International Journal of Heat and Mass Transfer. 121: 329-342. DOI: 10.1016/J.Ijheatmasstransfer.2017.12.117 |
0.517 |
|
| 2017 |
Li Y, Gong L, Xu M, Joshi Y. Thermal Performance Analysis of Biporous Metal Foam Heat Sink Journal of Heat Transfer-Transactions of the Asme. 139: 52005. DOI: 10.1115/1.4035999 |
0.487 |
|
| 2017 |
Barabadi B, Kumar S, Joshi YK. Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method Journal of Heat Transfer. 139. DOI: 10.1115/1.4035889 |
0.504 |
|
| 2017 |
Nasr MH, Green CE, Kottke PA, Zhang X, Sarvey TE, Joshi YK, Bakir MS, Fedorov AG. Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps Journal of Electronic Packaging. 139. DOI: 10.1115/1.4035387 |
0.532 |
|
| 2017 |
Yueh W, Wan Z, Xiao H, Yalamanchili S, Joshi Y, Mukhopadhyay S. Active Fluidic Cooling on Energy Constrained System-on-Chip Systems Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1813-1822. DOI: 10.1109/Tcpmt.2017.2746667 |
0.443 |
|
| 2017 |
Khalid R, Wemhoff AP, Joshi Y. Energy and Exergy Analysis of Modular Data Centers Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1440-1452. DOI: 10.1109/Tcpmt.2017.2705055 |
0.388 |
|
| 2017 |
Sarvey TE, Hu Y, Green CE, Kottke PA, Woodrum DC, Joshi YK, Fedorov AG, Sitaraman SK, Bakir MS. Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1465-1475. DOI: 10.1109/Tcpmt.2017.2704525 |
0.483 |
|
| 2017 |
Yu G, Yu B, Liang Y, Wang M, Joshi Y, Sun D. A new general model for phase-change heat transfer of waxy crude oil during the ambient-induced cooling process Numerical Heat Transfer Part a-Applications. 71: 511-527. DOI: 10.1080/10407782.2016.1277934 |
0.425 |
|
| 2017 |
Yu G, Yu B, Liang Y, Wang M, Joshi Y, Sun D. Further study on the thermal characteristic of a buried waxy crude oil pipeline during its cooling process after a shutdown Numerical Heat Transfer Part a-Applications. 71: 137-152. DOI: 10.1080/10407782.2016.1264722 |
0.404 |
|
| 2017 |
Wan Z, Joshi Y. Pressure drop and heat transfer characteristics of pin fin enhanced microgaps in single phase microfluidic cooling International Journal of Heat and Mass Transfer. 115: 115-126. DOI: 10.1016/J.Ijheatmasstransfer.2017.06.117 |
0.505 |
|
| 2017 |
Zhang J, Joshi YK, Tao W. Single phase laminar flow and heat transfer characteristics of microgaps with longitudinal vortex generator array International Journal of Heat and Mass Transfer. 111: 484-494. DOI: 10.1016/J.Ijheatmasstransfer.2017.03.036 |
0.54 |
|
| 2017 |
Nasr MH, Green CE, Kottke PA, Zhang X, Sarvey TE, Joshi YK, Bakir MS, Fedorov AG. Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps International Journal of Heat and Mass Transfer. 108: 1702-1713. DOI: 10.1016/J.Ijheatmasstransfer.2016.12.056 |
0.566 |
|
| 2016 |
Narayanan S, Kottke PA, Joshi YK, Fedorov AG. GAS-ASSISTED EVAPORATION HEAT AND MASS TRANSFER Annual Review of Heat Transfer. 19: 159-198. DOI: 10.1615/Annualrevheattransfer.2016013517 |
0.431 |
|
| 2016 |
Han X, Fedorov A, Joshi Y. Flow boiling in microgaps for thermal management of high heat flux microsystems Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4034317 |
0.537 |
|
| 2016 |
Sherer TH, Joshi Y. Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage Unit Journal of Electronic Packaging. 138: 31008. DOI: 10.1115/1.4034101 |
0.352 |
|
| 2016 |
Arghode VK, Joshi Y. Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data Centers Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4033464 |
0.333 |
|
| 2016 |
Zhang X, Han X, Sarvey TE, Green CE, Kottke PA, Fedorov AG, Joshi Y, Bakir MS. Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032496 |
0.57 |
|
| 2016 |
Kottke PA, Yun TM, Green CE, Joshi YK, Fedorov AG. Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors Journal of Heat Transfer. 138. DOI: 10.1115/1.4031111 |
0.485 |
|
| 2016 |
Yueh W, Wan Z, Joshi Y, Mukhopadhyay S. Design, characterization, and application of a field-programmable thermal emulation platform Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1330-1339. DOI: 10.1109/Tcpmt.2016.2578347 |
0.389 |
|
| 2016 |
Serafy C, Yang Z, Srivastava A, Hu Y, Joshi Y. Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks Ieee Design and Test. 33: 40-48. DOI: 10.1109/Mdat.2015.2480710 |
0.372 |
|
| 2016 |
Cho S, Sundaram V, Tummala R, Joshi Y. Multi-scale thermal modeling of glass interposer for mobile electronics application International Journal of Numerical Methods For Heat & Fluid Flow. 26: 1157-1171. DOI: 10.1108/Hff-09-2015-0378 |
0.42 |
|
| 2016 |
Arghode VK, Sundaralingam V, Joshi Y. Airflow Management in a Contained Cold Aisle Using Active Fan Tiles for Energy Efficient Data-Center Operation Heat Transfer Engineering. 37: 246-256. DOI: 10.1080/01457632.2015.1051386 |
0.326 |
|
| 2016 |
Lorenzini D, Green C, Sarvey TE, Zhang X, Hu Y, Fedorov AG, Bakir MS, Joshi Y. Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering International Journal of Heat and Mass Transfer. 103: 1359-1370. DOI: 10.1016/J.Ijheatmasstransfer.2016.08.040 |
0.57 |
|
| 2015 |
Green C, Kottke P, Han X, Woodrum C, Sarvey T, Asrar P, Zhang X, Joshi Y, Fedorov A, Sitaraman S, Bakir M. A review of two-phase forced cooling in three-dimensional stacked electronics: Technology integration Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031481 |
0.552 |
|
| 2015 |
Alkharabsheh S, Fernandes J, Gebrehiwot B, Agonafer D, Ghose K, Ortega A, Joshi Y, Sammakia B. A brief overview of recent developments in thermal management in data centers Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031326 |
0.324 |
|
| 2015 |
Arghode VK, Joshi Y. Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data Center Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031079 |
0.34 |
|
| 2015 |
McNamara AJ, Joshi Y, Zhang Z, Moon KS, Lin Z, Yao Y, Wong CP, Lin W. Double-sided transferred carbon nanotube arrays for improved thermal interface materials Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4030802 |
0.35 |
|
| 2015 |
Barabadi B, Kumar S, Sukharev V, Joshi YK. Multiscale Transient Thermal Analysis of Microelectronics Journal of Electronic Packaging. 137. DOI: 10.1115/1.4029835 |
0.412 |
|
| 2015 |
Arghode VK, Joshi Y. Experimental Investigation of Air Flow Through a Perforated Tile in a Raised Floor Data Center Journal of Electronic Packaging. 137: 11011. DOI: 10.1115/1.4028835 |
0.317 |
|
| 2015 |
Han X, Joshi YK. Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap Journal of Electronic Packaging. 137: 11008. DOI: 10.1115/1.4028574 |
0.517 |
|
| 2015 |
Sundaralingam V, Arghode VK, Joshi Y, Phelps W. Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers Journal of Electronic Packaging. 137: 11007. DOI: 10.1115/1.4028520 |
0.312 |
|
| 2015 |
Cho S, Sundaram V, Tummala RR, Joshi YK. Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 1075-1084. DOI: 10.1109/Tcpmt.2015.2450731 |
0.432 |
|
| 2015 |
Sahu V, Joshi YK, Fedorov AG, Bahk JH, Wang X, Shakouri A. Experimental characterization of hybrid solid-state and fluidic cooling for thermal management of localized hotspots Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 57-64. DOI: 10.1109/Tcpmt.2014.2332516 |
0.497 |
|
| 2015 |
Joshi Y, Barabadi B, Ghosh R, Wan Z, Xiao H, Yalamanchili S, Kumar S. Thermal simulations in support of multi-scale co-design of energy efficient information technology systems International Journal of Numerical Methods For Heat and Fluid Flow. 25: 1385-1403. DOI: 10.1108/Hff-08-2014-0242 |
0.382 |
|
| 2015 |
Wan Z, Xiao H, Joshi Y, Yalamanchili S. Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs Microelectronics Journal. 45: 1814-1821. DOI: 10.1016/J.Mejo.2014.04.019 |
0.399 |
|
| 2015 |
McNamara AJ, Joshi Y, Zhang ZM. Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material International Journal of Thermal Sciences. 96: 221-226. DOI: 10.1016/J.Ijthermalsci.2015.05.006 |
0.371 |
|
| 2015 |
Cruz E, Joshi Y. Coupled inviscid-viscous solution method for bounded domains: Application to data-center thermal management International Journal of Heat and Mass Transfer. 85: 181-194. DOI: 10.1016/J.Ijheatmasstransfer.2015.01.077 |
0.31 |
|
| 2014 |
Sahu V, Fedorov AG, Joshi YK. Transient characterization of hybrid microfluidic-thermoelectric cooling scheme for dynamic thermal management of microprocessor Journal of Electronic Packaging, Transactions of the Asme. 136. DOI: 10.1115/1.4027901 |
0.344 |
|
| 2014 |
Arghode VK, Joshi Y. Room level modeling of air flow in a contained data center aisle Journal of Electronic Packaging, Transactions of the Asme. 136. DOI: 10.1115/1.4026540 |
0.345 |
|
| 2014 |
Yao Y, Tey JN, Li Z, Wei J, Bennett K, McNamara A, Joshi Y, Tan RLS, Ling SNM, Wong C. High-Quality Vertically Aligned Carbon Nanotubes for Applications as Thermal Interface Materials Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 232-239. DOI: 10.1109/Tcpmt.2013.2296370 |
0.353 |
|
| 2014 |
Ghosh R, Joshi Y. Proper orthogonal decomposition-based modeling framework for improving spatial resolution of measured temperature data Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 848-858. DOI: 10.1109/Tcpmt.2013.2291791 |
0.343 |
|
| 2014 |
Sahu V, Fedorov AG, Joshi YK. Computational and experimental investigation of thermal coupling between superlattice coolers Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 622-631. DOI: 10.1109/Tcpmt.2013.2291011 |
0.456 |
|
| 2014 |
Ghosh R, Joshi Y. Rapid temperature predictions in data centers using multi-parameter proper orthogonal decomposition Numerical Heat Transfer; Part a: Applications. 66: 41-63. DOI: 10.1080/10407782.2013.869090 |
0.394 |
|
| 2014 |
Chien A, Cho S, Joshi Y, Kumar S. Electrical conductivity and Joule heating of polyacrylonitrile/carbon nanotube composite fibers Polymer. 55: 6896-6905. DOI: 10.1016/J.Polymer.2014.10.064 |
0.352 |
|
| 2014 |
Green CE, Fedorov AG, Joshi YK. Time scale matching of dynamically operated devices using composite thermal capacitors Microelectronics Journal. 45: 1069-1078. DOI: 10.1016/J.Mejo.2014.05.013 |
0.478 |
|
| 2013 |
Arghode VK, Kumar P, Joshi Y, Weiss T, Meyer G. Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center Journal of Electronic Packaging. 135. DOI: 10.1115/1.4024994 |
0.338 |
|
| 2013 |
Cruz E, Joshi Y. Inviscid and viscous numerical models compared to experimental data in a small data center test cell Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4024944 |
0.347 |
|
| 2013 |
Kota K, Burton L, Joshi Y. Performance of an air-cooled heat sink channel with microscale dimples under transitional flow conditions Journal of Heat Transfer. 135. DOI: 10.1115/1.4024598 |
0.446 |
|
| 2013 |
Arghode VK, Sundaralingam V, Joshi Y, Phelps W. Thermal Characteristics of Open and Contained Data Center Cold Aisle Journal of Heat Transfer-Transactions of the Asme. 135: 61901. DOI: 10.1115/1.4023597 |
0.368 |
|
| 2013 |
Arghode VK, Joshi Y. Modeling strategies for air flow through perforated tiles in a data center Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 800-810. DOI: 10.1109/Tcpmt.2013.2251058 |
0.324 |
|
| 2013 |
Warrier P, Sathyanarayana A, Bazdar S, Joshi Y, Teja AS. Corrections to “Selection and Evaluation of Organosilicon Coolants for Direct Immersion Cooling of Electronic Systems” Industrial & Engineering Chemistry Research. 52: 8354-8354. DOI: 10.1021/Ie401640M |
0.309 |
|
| 2013 |
Narayanan S, Fedorov AG, Joshi YK. Heat and mass transfer during evaporation of thin liquid films confined by nanoporous membranes subjected to air jet impingement International Journal of Heat and Mass Transfer. 58: 300-311. DOI: 10.1016/J.Ijheatmasstransfer.2012.11.015 |
0.491 |
|
| 2013 |
Ghosh R, Joshi Y. Error estimation in POD-based dynamic reduced-order thermal modeling of data centers International Journal of Heat and Mass Transfer. 57: 698-707. DOI: 10.1016/J.Ijheatmasstransfer.2012.10.013 |
0.303 |
|
| 2012 |
Sathyanarayana A, Warrier P, Joshi Y, Teja AS. Saturated And Subcooled Pool Boiling Of Hfe-7200 Mixtures On A Copper Nanowire Surface Frontiers in Heat and Mass Transfer. 2. DOI: 10.5098/Hmt.V2.4.3007 |
0.479 |
|
| 2012 |
Sathyanarayana A, Warrier P, Im Y, Joshi Y, Teja AS. Pool Boiling of HFE 7200–C4H4F6O Mixture on Hybrid Micro-Nanostructured Surface Journal of Nanotechnology in Engineering and Medicine. 3: 41004. DOI: 10.1115/1.4023245 |
0.53 |
|
| 2012 |
Kim S, Kim YJ, Joshi YK, Fedorov AG, Kohl PA. Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants Journal of Electronic Packaging. 134: 31009. DOI: 10.1115/1.4007111 |
0.528 |
|
| 2012 |
Barabadi B, Joshi YK, Kumar S, Refai-Ahmed G. Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method Journal of Electronic Packaging. 134. DOI: 10.1115/1.4006137 |
0.41 |
|
| 2012 |
Joshi Y. Reduced order thermal models of multiscale microsystems Journal of Heat Transfer. 134. DOI: 10.1115/1.4005150 |
0.312 |
|
| 2012 |
Samadiani E, Joshi Y, Hamann H, Iyengar MK, Kamalsy S, Lacey J. Reduced order thermal modeling of data centers via distributed sensor data Journal of Heat Transfer. 134. DOI: 10.1115/1.4004011 |
0.358 |
|
| 2012 |
Kota K, Hidalgo P, Joshi Y, Glezer A. Hybrid liquid immersion and synthetic jet heat sink for cooling 3-D stacked electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 817-824. DOI: 10.1109/Tcpmt.2012.2186452 |
0.572 |
|
| 2012 |
Warrier P, Sathyanarayana A, Bazdar S, Joshi Y, Teja AS. Selection and Evaluation of Organosilicon Coolants for Direct Immersion Cooling of Electronic Systems Industrial & Engineering Chemistry Research. 51: 10517-10523. DOI: 10.1021/Ie300664V |
0.478 |
|
| 2012 |
McNamara AJ, Joshi Y, Zhang ZM. Characterization of nanostructured thermal interface materials - A review International Journal of Thermal Sciences. 62: 2-11. DOI: 10.1016/J.Ijthermalsci.2011.10.014 |
0.422 |
|
| 2012 |
Warrier P, Sathyanarayana A, Patil DV, France S, Joshi Y, Teja AS. Novel heat transfer fluids for direct immersion phase change cooling of electronic systems International Journal of Heat and Mass Transfer. 55: 3379-3385. DOI: 10.1016/J.Ijheatmasstransfer.2012.02.063 |
0.518 |
|
| 2012 |
Kim YJ, Kim S, Joshi YK, Fedorov AG, Kohl PA. Thermodynamic analysis of an absorption refrigeration system with ionic-liquid/refrigerant mixture as a working fluid Energy. 44: 1005-1016. DOI: 10.1016/J.Energy.2012.04.048 |
0.413 |
|
| 2011 |
Narayanan S, Fedorov AG, Joshi YK. Interfacial transport of evaporating water confined in nanopores. Langmuir : the Acs Journal of Surfaces and Colloids. 27: 10666-76. PMID 21749136 DOI: 10.1021/La201807A |
0.417 |
|
| 2011 |
Joshi Y, Samadiani E. Energy efficient thermal management of data centers via open multi-scale design: A review of research questions and approaches Journal of Enhanced Heat Transfer. 18: 15-30. DOI: 10.1615/Jenhheattransf.V18.I1.20 |
0.385 |
|
| 2011 |
Sinha A, Joshi YK. Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement Journal of Electronic Packaging. 133: 41005. DOI: 10.1115/1.4005290 |
0.502 |
|
| 2011 |
Joshi Y, Sabry MN. Thermal issues in emerging technologies Journal of Heat Transfer. 133. DOI: 10.1115/1.4003447 |
0.314 |
|
| 2011 |
Gong L, Kota K, Tao W, Joshi Y. Parametric Numerical Study Of Flow And Heat Transfer In Microchannels With Wavy Walls Journal of Heat Transfer-Transactions of the Asme. 133: 51702. DOI: 10.1115/1.4003284 |
0.51 |
|
| 2011 |
Warrier P, Sathyanarayana A, Joshi Y, Teja AS. Screening and Evaluation of Mixture Formulations for Electronics Thermal Management Using Pool Boiling Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1387-1394. DOI: 10.1109/Tcpmt.2011.2162069 |
0.523 |
|
| 2011 |
Gong L, Kota K, Tao W, Joshi Y. Thermal Performance of Microchannels With Wavy Walls for Electronics Cooling Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1029-1035. DOI: 10.1109/Tcpmt.2011.2125963 |
0.523 |
|
| 2010 |
Im Y, Joshi Y, Dietz C, Lee SS. Enhanced Boiling of a Dielectric Liquid on Copper Nanowire Surfaces International Journal of Micro-Nano Scale Transport. 1: 79-96. DOI: 10.1260/1759-3093.1.1.79 |
0.34 |
|
| 2010 |
Khiabani RH, Joshi Y, Aidun CK. Heat Transfer in Hot Pressing of Saturated Fiber Suspensions Journal of Thermal Science and Engineering Applications. 2. DOI: 10.1115/1.4003509 |
0.374 |
|
| 2010 |
Sinha A, Joshi Y. Application of thermoelectric- adsorption cooler for harsh environment electronics under varying heat load Journal of Thermal Science and Engineering Applications. 2. DOI: 10.1115/1.4002590 |
0.468 |
|
| 2010 |
Samadiani E, Amur H, Krishnan B, Joshi Y, Schwan K. Coordinated optimization of cooling and IT power in data centers Journal of Electronic Packaging, Transactions of the Asme. 132. DOI: 10.1115/1.4001858 |
0.35 |
|
| 2010 |
Samadiani E, Rambo J, Joshi Y. Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center Journal of Electronic Packaging. 132: 21002. DOI: 10.1115/1.4001589 |
0.316 |
|
| 2010 |
Samadiani E, Joshi Y. Proper orthogonal decomposition for reduced order thermal modeling of air cooled data centers Journal of Heat Transfer. 132: 1-14. DOI: 10.1115/1.4000978 |
0.484 |
|
| 2010 |
Kim YJ, Joshi YK, Fedorov AG, Lee Y, Lim S. Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux Journal of Heat Transfer-Transactions of the Asme. 132: 41009. DOI: 10.1115/1.4000885 |
0.481 |
|
| 2010 |
Khiabani RH, Joshi Y, Aidun CK. Heat transfer in microchannels with suspended solid particles: Lattice-Boltzmann based computations Journal of Heat Transfer. 132: 1-9. DOI: 10.1115/1.4000860 |
0.416 |
|
| 2010 |
Samadiani E, Joshi Y. Reduced order thermal modeling of data centers via proper orthogonal decomposition: A review International Journal of Numerical Methods For Heat and Fluid Flow. 20: 529-550. DOI: 10.1108/09615531011048231 |
0.418 |
|
| 2010 |
Narayanan S, Fedorov AG, Joshi YK. On-chip thermal management of hotspots using a perspiration nanopatch Journal of Micromechanics and Microengineering. 20: 075010. DOI: 10.1088/0960-1317/20/7/075010 |
0.533 |
|
| 2010 |
Samadiani E, Joshi Y, Allen JK, Mistree F. Adaptable robust design of multi-scale convective systems applied to energy efficient data centers Numerical Heat Transfer; Part a: Applications. 57: 69-100. DOI: 10.1080/10407780903582901 |
0.331 |
|
| 2010 |
Dietz C, Rykaczewski K, Fedorov AG, Joshi Y. Visualization of droplet departure on a superhydrophobic surface and implications to heat transfer enhancement during dropwise condensation Applied Physics Letters. 97. DOI: 10.1063/1.3460275 |
0.429 |
|
| 2010 |
Kim YJ, Joshi YK, Fedorov AG. Thermally dependent characteristics and spectral hole burning of the double-lasing, edge-emitting quantum-dot laser Journal of Applied Physics. 107: 73104. DOI: 10.1063/1.3361376 |
0.352 |
|
| 2010 |
Khiabani RH, Joshi Y, Aidun CK. Thermal properties of particulate TIMs in squeeze flow International Journal of Heat and Mass Transfer. 53: 4039-4046. DOI: 10.1016/J.Ijheatmasstransfer.2010.05.023 |
0.375 |
|
| 2010 |
Samadiani E, Joshi Y. Multi-parameter model reduction in multi-scale convective systems International Journal of Heat and Mass Transfer. 53: 2193-2205. DOI: 10.1016/J.Ijheatmasstransfer.2009.12.013 |
0.388 |
|
| 2009 |
Pal A, Joshi Y. Boiling at subatmospheric pressures with enhanced structures Journal of Thermophysics and Heat Transfer. 23: 139-147. DOI: 10.2514/1.31416 |
0.441 |
|
| 2009 |
Green C, Fedorov AG, Joshi YK. Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management Journal of Electronic Packaging. 131. DOI: 10.1115/1.3104029 |
0.557 |
|
| 2009 |
Green CE, Fedorov AG, Joshi YK. Scaling analysis of performance tradeoffs in electronics cooling Ieee Transactions On Components and Packaging Technologies. 32: 868-875. DOI: 10.1109/Tcapt.2009.2013720 |
0.47 |
|
| 2009 |
Gerlach DW, Gerty D, Mahalingam R, Joshi YK, Glezer A. A modular stackable concept for heat removal from 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets Ieee Transactions On Advanced Packaging. 32: 431-439. DOI: 10.1109/Tadvp.2008.2003349 |
0.579 |
|
| 2009 |
Sahu V, Joshi YK, Fedorov AG. Hybrid solid state/fluidic cooling for hot spot removal Nanoscale and Microscale Thermophysical Engineering. 13: 135-150. DOI: 10.1080/15567260903058033 |
0.435 |
|
| 2009 |
Narayanan S, Fedorov AG, Joshi YK. Gas-Assisted Thin-Film Evaporation from Confined Spaces for Dissipation of High Heat Fluxes Nanoscale and Microscale Thermophysical Engineering. 13: 30-53. DOI: 10.1080/15567260802625908 |
0.425 |
|
| 2009 |
Moores KA, Kim J, Joshi YK. Heat transfer and fluid flow in shrouded pin fin arrays with and without tip clearance International Journal of Heat and Mass Transfer. 52: 5978-5989. DOI: 10.1016/J.Ijheatmasstransfer.2009.08.005 |
0.788 |
|
| 2008 |
Samadiani E, Joshi Y, Mistree F. The thermal design of a next generation data center: A conceptual exposition Journal of Electronic Packaging, Transactions of the Asme. 130: 0411041-0411048. DOI: 10.1115/1.2993151 |
0.413 |
|
| 2008 |
Gurrum SP, Joshi YK, King WP, Ramakrishna K, Gall M. A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method Journal of Electronic Packaging. 130. DOI: 10.1115/1.2957318 |
0.434 |
|
| 2008 |
Gurrum SP, King WP, Joshi YK, Ramakrishna K. Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy Journal of Heat Transfer. 130. DOI: 10.1115/1.2928014 |
0.398 |
|
| 2008 |
Pal A, Joshi Y. Boiling of water at subatmospheric conditions with enhanced structures: Effect of liquid fill volume Journal of Electronic Packaging, Transactions of the Asme. 130: 0110101-01101010. DOI: 10.1115/1.2837523 |
0.46 |
|
| 2008 |
Garimella SV, Fleischer AS, Murthy JY, Keshavarzi A, Prasher R, Patel C, Bhavnani SH, Venkatasubramanian R, Mahajan R, Joshi Y, Sammakia B, Myers BA, Chorosinski L, Baelmans M, Sathyamurthy P, et al. Thermal challenges in next-generation electronic systems Ieee Transactions On Components and Packaging Technologies. 31: 801-815. DOI: 10.1109/Tcapt.2008.2001197 |
0.404 |
|
| 2008 |
Dietz CR, Joshi YK. Single-Phase Forced Convection in Microchannels with Carbon Nanotubes for Electronics Cooling Applications Nanoscale and Microscale Thermophysical Engineering. 12: 251-271. DOI: 10.1080/15567260802171937 |
0.446 |
|
| 2008 |
Nie Q, Joshi Y. Multiscale thermal modeling methodology for thermoelectrically cooled electronic cabinets Numerical Heat Transfer; Part a: Applications. 53: 225-248. DOI: 10.1080/10407780701564101 |
0.396 |
|
| 2008 |
Haider SI, Burton L, Joshi Y. A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics Cabinets Heat Transfer Engineering. 29: 198-215. DOI: 10.1080/01457630701686743 |
0.507 |
|
| 2008 |
Gurrum SP, King WP, Joshi YK. A semianalytical solution for the 3ω method including the effect of heater thermal conduction Journal of Applied Physics. 103: 113517. DOI: 10.1063/1.2937254 |
0.435 |
|
| 2008 |
Whelan A, Joshi Y, King W. Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics Microelectronics Journal. 39: 1016-1022. DOI: 10.1016/J.Mejo.2007.06.006 |
0.388 |
|
| 2008 |
Kim YJ, Joshi YK, Fedorov AG. An absorption based miniature heat pump system for electronics cooling International Journal of Refrigeration-Revue Internationale Du Froid. 31: 23-33. DOI: 10.1016/J.Ijrefrig.2007.07.003 |
0.496 |
|
| 2008 |
Nie Q, Joshi Y. Reduced order modeling and experimental validation of steady turbulent convection in connected domains International Journal of Heat and Mass Transfer. 51: 6063-6076. DOI: 10.1016/J.Ijheatmasstransfer.2008.04.068 |
0.352 |
|
| 2008 |
Kim YJ, Joshi YK, Fedorov AG. Performance analysis of air-cooled microchannel absorber in absorptionbased miniature electronics cooling system Journal of Mechanical Science and Technology. 22: 338-349. DOI: 10.1007/S12206-007-1034-5 |
0.517 |
|
| 2007 |
Wei X, Joshi Y, Patterson MK. Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices Journal of Heat Transfer-Transactions of the Asme. 129: 1432-1444. DOI: 10.1115/1.2754781 |
0.562 |
|
| 2007 |
Wadell R, Joshi YK, Fedorov AG. Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors Journal of Electronic Packaging. 129: 291-299. DOI: 10.1115/1.2753919 |
0.555 |
|
| 2007 |
Wei XJ, Joshi YK, Ligrani PM. Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface Journal of Electronic Packaging. 129: 63-70. DOI: 10.1115/1.2429711 |
0.472 |
|
| 2007 |
Zhang HY, Pinjala D, Joshi YK, Wong TN, Toh KC. Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems Heat Transfer Engineering. 28: 997-1007. DOI: 10.1080/01457630701483620 |
0.513 |
|
| 2007 |
Wei X, Joshi Y. Experimental and numerical study of sidewall profile effects on flow and heat transfer inside microchannels International Journal of Heat and Mass Transfer. 50: 4640-4651. DOI: 10.1016/J.Ijheatmasstransfer.2007.03.020 |
0.479 |
|
| 2007 |
Rambo J, Joshi Y. Reduced-order modeling of turbulent forced convection with parametric conditions International Journal of Heat and Mass Transfer. 50: 539-551. DOI: 10.1016/J.Ijheatmasstransfer.2006.07.029 |
0.382 |
|
| 2007 |
Rambo J, Joshi Y. Modeling of data center airflow and heat transfer: State of the art and future trends Distributed and Parallel Databases. 21: 193-225. DOI: 10.1007/S10619-006-7007-3 |
0.452 |
|
| 2006 |
Ghiu C, Joshi YK. Pool Boiling Using Thin Enhanced Structures Under Top-Confined Conditions Journal of Heat Transfer-Transactions of the Asme. 128: 1302-1311. DOI: 10.1115/1.2349503 |
0.473 |
|
| 2006 |
Moores KA, Joshi YK. Closure to "discussion of 'effect of tip clearance on the thermal and hydrodynamic performance of a shrouded pin fin array'" (2006, ASME J. Heat Transfer, 128, pp. 855-856) Journal of Heat Transfer. 128: 857. DOI: 10.1115/1.2227055 |
0.804 |
|
| 2006 |
Rolander N, Rambo J, Joshi Y, Allen JK, Mistree F. An approach to robust design of turbulent convective systems Journal of Mechanical Design, Transactions of the Asme. 128: 844-855. DOI: 10.1115/1.2202882 |
0.462 |
|
| 2006 |
Wang Q, Joshi Y. Algebraic multigrid preconditioned Krylov subspace methods for fluid flow and heat transfer on unstructured meshes Numerical Heat Transfer, Part B: Fundamentals. 49: 197-221. DOI: 10.1080/10407790500290725 |
0.406 |
|
| 2006 |
Rambo J, Joshi Y. Convective transport processes in data centers Numerical Heat Transfer; Part a: Applications. 49: 923-945. DOI: 10.1080/10407780500496562 |
0.389 |
|
| 2006 |
Launay S, Fedorov AG, Joshi Y, Cao A, Ajayan PM. Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement Microelectronics Journal. 37: 1158-1164. DOI: 10.1016/J.Mejo.2005.07.016 |
0.506 |
|
| 2006 |
Murthy S, Joshi Y, Gurrum S, Nakayama W. Enhanced boiling heat transfer simulation from structured surfaces : Semi-analytical model International Journal of Heat and Mass Transfer. 49: 1885-1895. DOI: 10.1016/J.Ijheatmasstransfer.2005.10.035 |
0.521 |
|
| 2005 |
Rambo J, Joshi Y. Thermal performance metrics for arranging forced air cooled servers in a data processing cabinet Journal of Electronic Packaging, Transactions of the Asme. 127: 452-459. DOI: 10.1115/1.2056575 |
0.527 |
|
| 2005 |
Ghiu C, Joshi YK. Boiling performance of single-layered enhanced structures Journal of Heat Transfer-Transactions of the Asme. 127: 675-683. DOI: 10.1115/1.1924568 |
0.385 |
|
| 2005 |
Tang L, Joshi YK. A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating Journal of Heat Transfer-Transactions of the Asme. 127: 18-26. DOI: 10.1115/1.1852495 |
0.477 |
|
| 2005 |
Ramakrishna K, Sammakia BG, Culham JR, Joshi YK. Foreword Special Issue of Components and Packaging Technologies With Contributions From ITherm 2004 Thermal Management Track Ieee Transactions On Components and Packaging Technologies. 28: 179-181. DOI: 10.1109/Tcapt.2005.848625 |
0.308 |
|
| 2005 |
Suman S, Gaitan M, Joshi Y, Harman GG. Wire-bonding process monitoring using thermopile temperature sensor Ieee Transactions On Advanced Packaging. 28: 685-693. DOI: 10.1109/Tadvp.2005.848696 |
0.312 |
|
| 2005 |
Ghiu C, Joshi YK. Visualization study of pool boiling from thin confined enhanced structures International Journal of Heat and Mass Transfer. 48: 4287-4299. DOI: 10.1016/J.Ijheatmasstransfer.2005.05.024 |
0.481 |
|
| 2005 |
Zhang HY, Pinjala D, Wong TN, Toh KC, Joshi YK. Single-phase liquid cooled microchannel heat sink for electronic packages Applied Thermal Engineering. 25: 1472-1487. DOI: 10.1016/J.Applthermaleng.2004.09.014 |
0.542 |
|
| 2004 |
Yoo D, Joshi YK. Energy efficient thermal management of electronic components using solid-liquid phase change materials Ieee Transactions On Device and Materials Reliability. 4: 641-649. DOI: 10.1109/Tdmr.2004.840854 |
0.538 |
|
| 2004 |
Gurrum SP, Suman SK, Joshi YK, Fedorov AG. Thermal issues in next-generation integrated circuits Ieee Transactions On Device and Materials Reliability. 4: 709-714. DOI: 10.1109/Tdmr.2004.840160 |
0.558 |
|
| 2004 |
Murthy S, Joshi Y, Nakayama W. Two-Phase Heat Spreaders Utilizing Microfabricated Boiling Enhancement Structures Heat Transfer Engineering. 25: 26-36. DOI: 10.1080/01457630490262218 |
0.738 |
|
| 2003 |
Moores KA, Joshi YK. Effect of tip clearance on the thermal and hydrodynamic performance of a shrouded pin fin array Journal of Heat Transfer. 125: 999-1006. DOI: 10.1115/1.1621897 |
0.801 |
|
| 2003 |
Ramaswamy C, Joshi Y, Nakayama W, Johnson WB. Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures Journal of Heat Transfer-Transactions of the Asme. 125: 103-109. DOI: 10.1115/1.1513575 |
0.452 |
|
| 2003 |
Wei X, Joshi Y. Optimization study of stacked micro-channel heat sinks for micro-electronic cooling Ieee Transactions On Components and Packaging Technologies. 26: 55-61. DOI: 10.1109/Tcapt.2003.811473 |
0.457 |
|
| 2003 |
Yuan L, Joshi YK, Nakayama W. Effect Of Condenser Location And Imposed Circulation On The Performance Of A Compact Two-Phase Thermosyphon Microscale Thermophysical Engineering. 7: 163-179. DOI: 10.1080/10893950390203341 |
0.463 |
|
| 2003 |
Murthy S, Joshi YK, Nakayama W. Orientation independent two-phase heat spreaders for space constrained applications Microelectronics Journal. 34: 1187-1193. DOI: 10.1016/S0026-2692(03)00209-X |
0.724 |
|
| 2003 |
Joshi Y, Azar K, Blackburn DL, Lasance CJM, Mahajan R, Rantala J. How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002 Microelectronics Journal. 34: 1195-1201. DOI: 10.1016/S0026-2692(03)00200-3 |
0.37 |
|
| 2003 |
Moghaddam S, Rada M, Shooshtari A, Ohadi M, Joshi Y. Evaluation of analytical models for thermal analysis and design of electronic packages Microelectronics Journal. 34: 223-230. DOI: 10.1016/S0026-2692(02)00192-1 |
0.503 |
|
| 2003 |
Suzuki O, Joshi YK, Nakayama W. Dynamics of a liquid plug in a capillary duct powered by vapor explosion Microelectronics Journal. 34: 195-200. DOI: 10.1016/S0026-2692(02)00188-X |
0.396 |
|
| 2003 |
Joshi YK, Garimella SV. Thermal challenges in next generation electronic systems Microelectronics Journal. 34: 169. DOI: 10.1016/S0026-2692(02)00184-2 |
0.325 |
|
| 2003 |
Ramaswamy C, Joshi Y, Nakayama W, Johnson WB. Semi-analytical model for boiling from enhanced structures International Journal of Heat and Mass Transfer. 46: 4257-4269. DOI: 10.1016/S0017-9310(03)00216-3 |
0.441 |
|
| 2002 |
Haider SI, Joshi YK, Nakayama W. A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling Journal of Heat Transfer-Transactions of the Asme. 124: 881-890. DOI: 10.1115/1.1482404 |
0.497 |
|
| 2002 |
Garimella SV, Joshi YK, Bar-Cohen A, Mahajan R, Toh KC, Carey VP, Baelmans M, Lohan J, Sammakia B, Andros F. Thermal challenges in next generation electronic systems- Summary of panel presentations and discussions Ieee Transactions On Components and Packaging Technologies. 25: 569-575. DOI: 10.1109/Tcapt.2003.809113 |
0.358 |
|
| 2002 |
Kalahasti S, Joshi YK. Performance characterization of a novel flat plate micro heat pipe spreader Ieee Transactions On Components and Packaging Technologies. 25: 554-560. DOI: 10.1109/Tcapt.2002.808006 |
0.562 |
|
| 2002 |
Pal A, Joshi YK, Beitelmal MH, Patel CD, Wenger TM. Design and performance evaluation of a compact thermosyphon Ieee Transactions On Components and Packaging Technologies. 25: 601-607. DOI: 10.1109/Tcapt.2002.807997 |
0.496 |
|
| 2002 |
Gurrum SP, Joshi YK, Kim J. Thermal Management Of High Temperature Pulsed Electronics Using Metallic Phase Change Materials Numerical Heat Transfer Part a-Applications. 42: 777-790. DOI: 10.1080/10407780290059800 |
0.386 |
|
| 2002 |
Yu E, Joshi Y. Heat transfer enhancement from enclosed discrete components using pin-fin heat sinks International Journal of Heat and Mass Transfer. 45: 4957-4966. DOI: 10.1016/S0017-9310(02)00200-4 |
0.553 |
|
| 2002 |
Ramaswamy C, Joshi Y, Nakayama W, Johnson WB. High-speed visualization of boiling from an enhanced structure International Journal of Heat and Mass Transfer. 45: 4761-4771. DOI: 10.1016/S0017-9310(02)00196-5 |
0.381 |
|
| 2001 |
Joshi Y. Heat Out of Small Packages Mechanical Engineering. 123: 56-58. DOI: 10.1115/1.2001-Dec-5 |
0.521 |
|
| 2001 |
Joshi Y, Baelmans A, Copeland D, Lasance CJM, Parry J, Rantala J. Challenges in thermal modeling of electronics at the system level: summary of panel held at the Therminic 2000 Ieee Transactions On Components and Packaging Technologies. 32: 797-800. DOI: 10.1016/S0026-2692(01)00065-9 |
0.424 |
|
| 2001 |
Joshi Y. Liquid Cooling of Electronic Devices by Single-Phase Convection; Frank P. Incropera International Journal of Heat and Mass Transfer. 44: 1637-1638. DOI: 10.1016/S0017-9310(00)00189-7 |
0.324 |
|
| 2001 |
Pal D, Joshi YK. Melting in a side heated tall enclosure by a uniformly dissipating heat source International Journal of Heat and Mass Transfer. 44: 375-387. DOI: 10.1016/S0017-9310(00)00116-2 |
0.554 |
|
| 2000 |
Wei X, Joshi Y. Stacked microchannel heat sinks for liquid cooling of microelectronic components American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 366: 329-337. DOI: 10.1115/1.1647124 |
0.533 |
|
| 2000 |
Ramaswamy C, Joshi YK, Nakayama W, Johnson WB. Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermosyphon Ieee Transactions On Components and Packaging Technologies. 23: 61-69. DOI: 10.1109/6144.833043 |
0.503 |
|
| 2000 |
Yu E, Joshi YK. Natural convection air cooling of electronic components in partially open compact horizontal enclosures Ieee Transactions On Components and Packaging Technologies. 23: 14-22. DOI: 10.1109/6144.833037 |
0.552 |
|
| 1999 |
Ramaswamy C, Joshi Y, Nakayama W, Johnson WB. Thermal Performance of a Compact Two-phase Thermosyphon: Response to Evaporator Confinement and Transient Loads Journal of Enhanced Heat Transfer. 6: 279-288. DOI: 10.1615/Jenhheattransf.V6.I2-4.150 |
0.341 |
|
| 1999 |
Adams VH, Joshi Y, Blackburn DL. Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection From Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure Journal of Heat Transfer-Transactions of the Asme. 121: 992-1001. DOI: 10.1115/1.2826091 |
0.555 |
|
| 1999 |
Yu E, Joshi YK. Heat Transfer in Discretely Heated Side-Vented Compact Enclosures by Combined Conduction, Natural Convection, and Radiation Journal of Heat Transfer. 121: 1002-1010. DOI: 10.1115/1.2826050 |
0.506 |
|
| 1999 |
Tang L, Joshi YK. Integrated thermal analysis of natural convection air cooled electronic enclosure Journal of Electronic Packaging. 121: 108-115. DOI: 10.1115/1.2792664 |
0.518 |
|
| 1999 |
Ramaswamy C, Joshi Y, Nakayama W, Johnson WB. Compact Thermosyphons Employing Microfabricated Components Microscale Thermophysical Engineering. 3: 273-282. DOI: 10.1080/108939599199693 |
0.419 |
|
| 1999 |
Tang L, Joshi YK. Application Of Block-Implicit Multigrid Approach To Three-Dimensional Heat Transfer Problems Involving Discrete Heating Numerical Heat Transfer Part a-Applications. 35: 717-734. DOI: 10.1080/104077899274994 |
0.525 |
|
| 1998 |
Pal D, Joshi YK. Thermal Management of an Avionics Module Using Solid-Liquid Phase-Change Materials Journal of Thermophysics and Heat Transfer. 12: 256-262. DOI: 10.2514/2.6329 |
0.443 |
|
| 1997 |
Pal D, Joshi YK. Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study Journal of Electronic Packaging. 119: 40-50. DOI: 10.1115/1.2792199 |
0.307 |
|
| 1997 |
Yu E, Joshi Y. Effects Of Orthotropic Thermal Conductivity Of Substrates In Natural Convection Cooling Of Discrete Heat Sources Numerical Heat Transfer Part a-Applications. 32: 575-593. DOI: 10.1080/10407789708913907 |
0.554 |
|
| 1996 |
Argento CW, Joshi YK, Osterman MD. Forced convection air-cooling of a commercial electronic chassis: an experimental and computational case study Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part A. 19: 248-257. DOI: 10.1109/95.506111 |
0.421 |
|
| 1995 |
Dutta P, Joshi Y, Janaswamy R. Thermal modeling of gas tungsten arc welding process with nonaxisymmetric boundary conditions Numerical Heat Transfer; Part a: Applications. 27: 499-518. DOI: 10.1080/10407789508913715 |
0.426 |
|
| 1994 |
Wroblewski DE, Joshi Y. Liquid Immersion Cooling of a Substrate-Mounted Protrusion in a Three-Dimensional Enclosure: The Effects of Geometry and Boundary Conditions Journal of Heat Transfer-Transactions of the Asme. 116: 112-119. DOI: 10.1115/1.2910844 |
0.384 |
|
| 1994 |
Joshi Y, Kelleher MD, Powell M, Torres EI. Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid Journal of Electronic Packaging. 116: 138-147. DOI: 10.1115/1.2905502 |
0.526 |
|
| 1993 |
Wroblewsk DE, Joshi Y. Computations of liquid immersion cooling for a protruding heat source in a cubical enclosure International Journal of Heat and Mass Transfer. 36: 1201-1218. DOI: 10.1016/S0017-9310(05)80090-0 |
0.516 |
|
| 1993 |
Joshi Y, Larsen S, Akdeniz EM. Effects of power pulsations on natural convection from discrete heat sources. Experimental Thermal and Fluid Science. 7: 143. DOI: 10.1016/0894-1777(93)90174-H |
0.36 |
|
| 1993 |
Joshi Y, Haukenes LO, Sathe SB. Natural convection liquid immersion cooling of a heat source flush mounted on a conducting substrate in a square enclosure International Journal of Heat and Mass Transfer. 36: 249-263. DOI: 10.1016/0017-9310(93)80001-B |
0.555 |
|
| 1992 |
Sathe SB, Joshi Y. Natural Convection Liquid Cooling of a Substrate-Mounted Protrusion in a Square Enclosure: A Parametric Study Journal of Heat Transfer-Transactions of the Asme. 114: 401-409. DOI: 10.1115/1.2911288 |
0.504 |
|
| 1992 |
Wroblewski D, Joshi Y. Transient Natural Convection From a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study Journal of Electronic Packaging. 114: 271-279. DOI: 10.1115/1.2905451 |
0.359 |
|
| 1991 |
Joshi Y, Paje RA. Natural convection cooling of a ceramic substrate mounted leadless chip carrier in dielectric liquids International Communications in Heat and Mass Transfer. 18: 39-47. DOI: 10.1016/0735-1933(91)90006-P |
0.475 |
|
| 1991 |
Sathe SB, Joshi Y. Natural convection arising from a heat generating substrate-mounted protrusion in a liquid-filled two-dimensional enclosure International Journal of Heat and Mass Transfer. 34: 2149-2163. DOI: 10.1016/0017-9310(91)90224-3 |
0.57 |
|
| 1990 |
Joshi Y, Knight DL. Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water Journal of Electronic Packaging. 112: 367-374. DOI: 10.1115/1.2904391 |
0.414 |
|
| 1989 |
Joshi Y, Willson T, Hazard SJ. Erratum: “An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water” (Journal of Electronic Packaging, 1989, 111, pp. 33–40) Journal of Electronic Packaging. 111: 142-142. DOI: 10.1115/1.3226519 |
0.475 |
|
| 1989 |
Joshi Y, Willson T, Hazard SJ. An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water Journal of Electronic Packaging. 111: 121-128. DOI: 10.1115/1.3226516 |
0.457 |
|
| 1989 |
Joshi Y, Willson T, Hazard SJ. An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water Journal of Electronic Packaging. 111: 33-40. DOI: 10.1115/1.3226506 |
0.459 |
|
| 1988 |
Joshi Y, Gebhart B. Transient response of a steady vertical flow subject to a change in surface heating rate International Journal of Heat and Mass Transfer. 31: 743-757. DOI: 10.1016/0017-9310(88)90132-9 |
0.502 |
|
| 1987 |
Joshi Y, Gebhart B. Transition of transient vertical natural-convection flows in water Journal of Fluid Mechanics. 179: 407-438. DOI: 10.1017/S0022112087001599 |
0.411 |
|
| 1986 |
Joshi Y, Gebhart B. Measurements and visualizations of transient and steady-state vertical natural convection flow in cold water International Journal of Heat and Mass Transfer. 29: 1723-1740. DOI: 10.1016/0017-9310(86)90112-2 |
0.489 |
|
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