Year |
Citation |
Score |
2019 |
Yin S, Tang S, Lin X, Ouyang P, Tu F, Liu L, Zhao J, Xu C, Li S, Xie Y, Wei S. Parana: A Parallel Neural Architecture Considering Thermal Problem of 3D Stacked Memory Ieee Transactions On Parallel and Distributed Systems. 30: 146-160. DOI: 10.1109/Tpds.2018.2858230 |
0.665 |
|
2019 |
Dai G, Huang T, Chi Y, Zhao J, Sun G, Liu Y, Wang Y, Xie Y, Yang H. GraphH: A Processing-in-Memory Architecture for Large-Scale Graph Processing Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 38: 640-653. DOI: 10.1109/Tcad.2018.2821565 |
0.593 |
|
2019 |
Xie Y, Zhao J. Emerging Memory Technologies Ieee Micro. 39: 6-7. DOI: 10.1109/Mm.2019.2892165 |
0.598 |
|
2018 |
Sun G, Zhao J, Poremba M, Xu C, Xie Y. Memory that never forgets: emerging nonvolatile memory and the implication for architecture design National Science Review. 5: 577-592. DOI: 10.1093/Nsr/Nwx082 |
0.689 |
|
2017 |
Zhao J, Zou Q, Xie Y. Overview of 3-D Architecture Design Opportunities and Techniques Ieee Design & Test of Computers. 34: 60-68. DOI: 10.1109/Mdat.2015.2463282 |
0.485 |
|
2016 |
Zhan J, Ouyang J, Ge F, Zhao J, Xie Y. Hybrid Drowsy SRAM and STT-RAM Buffer Designs for Dark-Silicon-Aware NoC Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. DOI: 10.1109/Tvlsi.2016.2536747 |
0.605 |
|
2016 |
Zhao J, Xu C, Zhang T, Xie Y. BACH: A Bandwidth-Aware Hybrid Cache Hierarchy Design with Nonvolatile Memories Journal of Computer Science and Technology. 31: 20-35. DOI: 10.1007/S11390-016-1609-7 |
0.696 |
|
2015 |
Zhao J, Xu C, Chi P, Xie Y. Memory and storage system design with nonvolatile memory technologies Ipsj Transactions On System Lsi Design Methodology. 8: 2-11. DOI: 10.2197/Ipsjtsldm.8.2 |
0.68 |
|
2015 |
Zhao J, Li S, Chang J, Byrne JL, Ramirez LL, Lim K, Xie Y, Faraboschi P. Buri: Scaling Big-Memory Computing with Hardware-Based Memory Expansion Acm Transactions On Architecture and Code Optimization. 12: 31. DOI: 10.1145/2808233 |
0.642 |
|
2013 |
Zhao J, Sun G, Loh GH, Xie Y. Optimizing gpu energy efficiency with 3d die-stacking graphics memory and reconfigurable memory interface Transactions On Architecture and Code Optimization. 10. DOI: 10.1145/2541228.2541231 |
0.692 |
|
2010 |
Dong X, Zhao J, Xie Y. Fabrication Cost Analysis and Cost-Aware Design Space Exploration for 3-D ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 29: 1959-1972. DOI: 10.1109/Tcad.2010.2062811 |
0.548 |
|
Show low-probability matches. |