Year |
Citation |
Score |
2010 |
Petrofsky JS, McLellan K, Prowse M, Bains G, Berk L, Lee S. The effect of body fat, aging, and diabetes on vertical and shear pressure in and under a waist belt and its effect on skin blood flow. Diabetes Technology & Therapeutics. 12: 153-60. PMID 20105046 DOI: 10.1089/Dia.2009.0123 |
0.614 |
|
2009 |
McLellan K, Petrofsky JS, Zimmerman G, Lohman E, Prowse M, Schwab E, Lee S. The influence of environmental temperature on the response of the skin to local pressure: the impact of aging and diabetes. Diabetes Technology & Therapeutics. 11: 791-8. PMID 20001680 DOI: 10.1089/Dia.2009.0097 |
0.667 |
|
2009 |
McLellan K, Petrofsky JS, Zimmerman G, Prowse M, Bains G, Lee S. Multiple stressors and the response of vascular endothelial cells: the effect of aging and diabetes. Diabetes Technology & Therapeutics. 11: 73-9. PMID 19848572 DOI: 10.1089/Dia.2008.0026 |
0.65 |
|
2009 |
Petrofsky JS, McLellan K. Galvanic skin resistance--a marker for endothelial damage in diabetes. Diabetes Technology & Therapeutics. 11: 461-7. PMID 19580361 DOI: 10.1089/Dia.2008.0096 |
0.648 |
|
2009 |
Petrofsky JS, McLellan K, Bains GS, Prowse M, Ethiraju G, Lee S, Gunda S, Lohman E, Schwab E. The influence of ageing on the ability of the skin to dissipate heat. Medical Science Monitor : International Medical Journal of Experimental and Clinical Research. 15: CR261-8. PMID 19478695 |
0.664 |
|
2009 |
McLellan K, Petrofsky JS, Bains G, Zimmerman G, Prowse M, Lee S. The effects of skin moisture and subcutaneous fat thickness on the ability of the skin to dissipate heat in young and old subjects, with and without diabetes, at three environmental room temperatures. Medical Engineering & Physics. 31: 165-72. PMID 18945635 DOI: 10.1016/J.Medengphy.2008.08.004 |
0.637 |
|
2008 |
Petrofsky JS, McLellan K, Bains GS, Prowse M, Ethiraju G, Lee S, Gunda S, Lohman E, Schwab E. Skin heat dissipation: the influence of diabetes, skin thickness, and subcutaneous fat thickness. Diabetes Technology & Therapeutics. 10: 487-93. PMID 19049378 DOI: 10.1089/Dia.2008.0009 |
0.692 |
|
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