Kenneth E. Goodson

Mechanical Engineering Stanford University, Palo Alto, CA 
heat transfer in electronic nanostructures
"Kenneth Goodson"
Goodson, Kenneth E., Thermal conduction in microelectronic circuits, thesis MIT (1993)

Cross-listing: Physics Tree


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Markus I. Flik grad student 1993 MIT (Physics Tree)
 (Thermal conduction in microelectronic circuits)


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Per G. Sverdrup grad student 2000 Stanford
Daniel A. Fletcher grad student 2001 Stanford
Maxat N. Touzelbaev grad student 2001 Stanford
William P. King grad student 2002 Stanford
Peng Zhou grad student 2002 Stanford
Xuejiao Hu grad student 2005 Stanford
Jae-Mo Koo grad student 2005 Stanford
Angela D. McConnell grad student 2005 Stanford
Eric Pop grad student 2005 Stanford
Sanjiv Sinha grad student 2005 Stanford
Sungjun Im grad student 2006 Stanford
Evelyn N. Wang grad student 2006 Stanford
Ankur Jain grad student 2007 Stanford
Eon Soo Lee grad student 2007 Stanford
Kevin D. Ness grad student 2007 Stanford
Amy Marconnet grad student 2007-2012 Stanford (E-Tree)


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Joshua A. Burrow collaborator 2017-2021 Stanford (E-Tree)
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Kwon H, Khan AI, Perez C, et al. (2021) Uncovering Thermal and Electrical Properties of SbTe/GeTe Superlattice Films. Nano Letters
Kwon H, Perez C, Kim HK, et al. (2021) Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces
Xiong F, Yalon E, McClellan C, et al. (2021) Tuning electrical and interfacial thermal properties of bilayer MoS2 via electrochemical intercalation. Nanotechnology
Park J, Bae K, Kim TR, et al. (2021) Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). 8: 2002876
Kim Y, Kwon H, Han HS, et al. (2020) Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces
Park S, Siahrostami S, Park J, et al. (2020) Effect of Adventitious Carbon on Pit Formation of Monolayer MoS. Advanced Materials (Deerfield Beach, Fla.). e2003020
Jung KW, Hazra S, Kwon H, et al. (2020) Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling Journal of Electronic Packaging. 142
Hazra S, Jung KW, Iyengar M, et al. (2020) Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Journal of Electronic Packaging. 142
Jung KW, Cho E, Lee H, et al. (2020) Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa Journal of Electronic Packaging. 142
Liu T, Palko JW, Katz JS, et al. (2020) Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation with Binary Diffusion Ieee Transactions On Components, Packaging and Manufacturing Technology. 1-1
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