Maxat N. Touzelbaev
Affiliations: | 2001 | Stanford University, Palo Alto, CA |
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"Maxat Touzelbaev"Parents
Sign in to add mentor| Kenneth E. Goodson | grad student | 2001 | Stanford | |
| (Thermal properties of novel electronic materials.) | ||||
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Publications
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| Touzelbaev MN, Miler J, Yang Y, et al. (2013) High-efficiency transient temperature calculations for applications in dynamic thermal management of electronic devices Journal of Electronic Packaging, Transactions of the Asme. 135 |
| Yang Y, Master R, Refai-Ahmed G, et al. (2012) Transient frequency-domain thermal measurements with applications to electronic packaging Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 448-456 |
| David MP, Miler J, Steinbrenner JE, et al. (2011) Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger International Journal of Heat and Mass Transfer. 54: 5504-5516 |
| Miler JL, Flynn R, Refai-Ahmed G, et al. (2010) Effects of transient heating on two-phase flow response in microchannel heat exchangers Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 563-569 |
| Miler JL, Refai-Ahmed G, Touzelbaev MN, et al. (2010) Reduced-order fluidic model for flow instabilities in two-phase microfluidic heat exchangers Asme 2010 8th International Conference On Nanochannels, Microchannels, and Minichannels Collocated With 3rd Joint Us-European Fluids Engineering Summer Meeting, Icnmm2010. 155-161 |
| Paisner SN, Touzelbaev M, Refai-Ahmed G, et al. (2010) New developments for a no-pump-out high-performance thermal grease 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010 |
| Too SS, Touzelbaev M, Khan M, et al. (2009) Indium thermal interface material development for microprocessors Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 186-192 |
| Yang Y, Touzelbaev M. (2008) Transient thermal characterization with applications to optimized thermal packaging of multi-core microprocessors 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 450-455 |
| Yang Y, Sadeghipour SM, Liu W, et al. (2006) Thermal characterization of the high-thermal-conductivity dielectrics High Thermal Conductivity Materials. 69-118 |
| Touzelbaev M. (2004) Thermal modeling and control limits in high performance microprocessors Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2: 733 |