Kenneth E. Goodson - Publications

Affiliations: 
Mechanical Engineering Stanford University, Palo Alto, CA 
Area:
heat transfer in electronic nanostructures
Website:
https://profiles.stanford.edu/kenneth-goodson

217 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Sood A, Xiong F, Chen S, Cheaito R, Lian F, Asheghi M, Cui Y, Donadio D, Goodson KE, Pop E. Quasi-Ballistic Thermal Transport Across MoS Thin Films. Nano Letters. PMID 30808167 DOI: 10.1021/acs.nanolett.8b05174  1
2018 Sood A, Xiong F, Chen S, Wang H, Selli D, Zhang J, McClellan CJ, Sun J, Donadio D, Cui Y, Pop E, Goodson KE. An electrochemical thermal transistor. Nature Communications. 9: 4510. PMID 30375375 DOI: 10.1038/s41467-018-06760-7  1
2018 Zhang C, Palko JW, Rong G, Pringle KS, Barako MT, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring permeability of microporous copper structures through template sintering. Acs Applied Materials & Interfaces. PMID 30096232 DOI: 10.1021/acsami.8b03774  0.32
2018 Rong G, Palko JW, Oyarzun DI, Zhang C, Hämmerle J, Asheghi M, Goodson KE, Santiago JG. A method for quantifying in plane permeability of porous thin films. Journal of Colloid and Interface Science. 530: 667-674. PMID 30007196 DOI: 10.1016/j.jcis.2018.05.062  0.32
2018 Park W, Sohn J, Romano G, Kodama T, Sood A, Katz JS, Kim BSY, So H, Ahn EC, Asheghi M, Kolpak AM, Goodson KE. Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale. PMID 29873370 DOI: 10.1039/c8nr01788c  0.52
2018 Sood A, Cheaito R, Bai T, Kwon H, Wang Y, Li C, Yates L, Bougher T, Graham S, Asheghi M, Goorsky M, Goodson KE. Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano Letters. PMID 29631399 DOI: 10.1021/acs.nanolett.8b00534  0.32
2017 Agonafer DD, Lee H, Vasquez PA, Won Y, Jung KW, Lingamneni S, Ma B, Shan L, Shuai S, Du Z, Maitra T, Palko JW, Goodson KE. Porous micropillar structures for retaining low surface tension liquids. Journal of Colloid and Interface Science. 514: 316-327. PMID 29275250 DOI: 10.1016/j.jcis.2017.12.011  0.32
2017 Barako MT, Isaacson SG, Lian F, Pop E, Dauskardt RH, Goodson KE, Tice J. Dense Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials. Acs Applied Materials & Interfaces. PMID 29119783 DOI: 10.1021/acsami.7b12313  1
2017 Yalon E, Aslan ÖB, Smithe KKH, McClellan CJ, Suryavanshi SV, Xiong F, Sood A, Neumann CM, Xu X, Goodson KE, Heinz TF, Pop E. Temperature Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry. Acs Applied Materials & Interfaces. PMID 29053241 DOI: 10.1021/acsami.7b11641  1
2017 Park W, Kodama T, Park J, Cho J, Sood A, Barako MT, Asheghi M, Goodson KE. Thermal Conduction across Metal-Dielectric Sidewall Interfaces. Acs Applied Materials & Interfaces. PMID 28786284 DOI: 10.1021/acsami.7b06567  0.52
2017 Kodama T, Ohnishi M, Park W, Shiga T, Park J, Shimada T, Shinohara H, Shiomi J, Goodson KE. Modulation of thermal and thermoelectric transport in individual carbon nanotubes by fullerene encapsulation. Nature Materials. PMID 28759031 DOI: 10.1038/nmat4946  0.52
2017 Park W, Romano G, Ahn EC, Kodama T, Park J, Barako MT, Sohn J, Kim SJ, Cho J, Marconnet AM, Asheghi M, Kolpak AM, Goodson KE. Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific Reports. 7: 6233. PMID 28740212 DOI: 10.1038/s41598-017-06479-3  0.52
2016 Barako MT, Sood A, Zhang C, Wang J, Kodama T, Asheghi M, Zheng X, Braun PV, Goodson KE. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano Letters. PMID 26986050 DOI: 10.1021/acs.nanolett.6b00468  0.52
2015 Ahn C, Fong SW, Kim Y, Lee S, Sood A, Neumann CM, Asheghi M, Goodson KE, Pop E, Wong HP. Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier. Nano Letters. PMID 26308280 DOI: 10.1021/acs.nanolett.5b02661  1
2015 Barako MT, Roy-Panzer S, English TS, Kodama T, Asheghi M, Kenny TW, Goodson KE. Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. Acs Applied Materials & Interfaces. 7: 19251-9. PMID 26284489 DOI: 10.1021/acsami.5b05147  1
2015 Agonafer DD, Lopez K, Palko JW, Won Y, Santiago JG, Goodson KE. Burst behavior at a capillary tip: Effect of low and high surface tension. Journal of Colloid and Interface Science. 455: 1-5. PMID 26046980 DOI: 10.1016/j.jcis.2015.05.033  1
2015 Roy-Panzer S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Thermal characterization and analysis of microliter liquid volumes using the three-omega method. The Review of Scientific Instruments. 86: 024901. PMID 25725871 DOI: 10.1063/1.4907353  1
2015 Cho J, Goodson KE. Thermal transport: Cool electronics. Nature Materials. 14: 136-7. PMID 25613710 DOI: 10.1038/nmat4194  1
2015 Houshmand F, Lee H, Asheghi M, Goodson KE. High heat flux subcooled flow boiling of methanol in microtubes Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48734  1
2015 Sridhar A, Ong CL, Paredes S, Michel B, Brunschwiler T, Parida P, Colgan E, Chainer T, Gorle C, Goodson KE. Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48690  1
2015 Lee H, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Computational modeling of extreme heat flux microcooler for GaN-based HEMT Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48670  1
2015 Liu T, Houshmand F, Gorle C, Scholl S, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H, Vanhille K. Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density gan-SiC chip Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48592  1
2015 Dowling KM, Suria AJ, Won Y, Shankar A, Lee H, Asheghi M, Goodson KE, Senesky DG. Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48409  1
2015 Zhang C, Rong G, Palko JW, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring of permeability in copper inverse opal for electronic cooling applications Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48262  1
2015 Gorlé C, Lee H, Houshmand F, Asheghi M, Goodson K, Parida PR. Validation study for VOF simulations of boiling in a microchannel Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48129  1
2015 Scholl S, Gorle C, Houshmand F, Asheghi M, Goodson K, Verstraete T. Numerical optimization of advanced monolithic micro coolers for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48123  1
2015 Scholl S, Gorle C, Houshmand F, Liu T, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H. Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48122  1
2015 Cho J, Francis D, Chao PC, Asheghi M, Goodson KE. Cross-plane phonon conduction in polycrystalline silicon films Journal of Heat Transfer. 137. DOI: 10.1115/1.4029820  1
2015 Ahn CH, Hong VA, Park W, Yang Y, Chen Y, Ng EJ, Huynh J, Challoner AD, Goodson KE, Kenny TW. On-chip ovenization of encapsulated Disk Resonator Gyroscope (drg) 2015 Transducers - 2015 18th International Conference On Solid-State Sensors, Actuators and Microsystems, Transducers 2015. 39-42. DOI: 10.1109/TRANSDUCERS.2015.7180855  1
2015 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2433132  1
2015 Won Y, Gao Y, Guzman De Villoria R, Wardle BL, Xiang R, Maruyama S, Kenny TW, Goodson KE. Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films Journal of Micromechanics and Microengineering. 25. DOI: 10.1088/0960-1317/25/11/115023  1
2015 Shi L, Dames C, Lukes JR, Reddy P, Duda J, Cahill DG, Lee J, Marconnet A, Goodson KE, Bahk JH, Shakouri A, Prasher RS, Felts J, King WP, Han B, et al. Evaluating broader impacts of nanoscale thermal transport research Nanoscale and Microscale Thermophysical Engineering. 19: 127-165. DOI: 10.1080/15567265.2015.1031857  1
2015 Palko JW, Zhang C, Wilbur JD, Dusseault TJ, Asheghi M, Goodson KE, Santiago JG. Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat Applied Physics Letters. 107. DOI: 10.1063/1.4938202  1
2015 Bernardin J, Chiaramonte F, Dhir V, Galloway J, Goodson K, Incropera F, Kabov O, Kaviany M, Kazimi M, Khusid B, Kim J, Kim SM, Lee J, Minkowycz WJ, Qu W, et al. Professor Issam Mudawar on his 60th birthday International Journal of Heat and Mass Transfer. DOI: 10.1016/j.ijheatmasstransfer.2015.05.059  1
2015 Dunham MT, Barako MT, LeBlanc S, Asheghi M, Chen B, Goodson KE. Power density optimization for micro thermoelectric generators Energy. 93: 2006-2017. DOI: 10.1016/j.energy.2015.10.032  1
2014 Jeyasingh R, Fong SW, Lee J, Li Z, Chang KW, Mantegazza D, Asheghi M, Goodson KE, Wong HS. Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano Letters. 14: 3419-26. PMID 24798660 DOI: 10.1021/nl500940z  1
2014 Barako MT, Gao Y, Won Y, Marconnet AM, Asheghi M, Goodson KE. Reactive metal bonding of carbon nanotube arrays for thermal interface applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1906-1913. DOI: 10.1109/TCPMT.2014.2369371  1
2014 Tyhach M, Altman D, Bernstein S, Korenstein R, Cho J, Goodson KE, Francis D, Faili F, Ejeckam F, Kim S, Graham S. S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates Lester Eastman Conference 2014 - High Performance Devices, Lec 2014. DOI: 10.1109/LEC.2014.6951557  1
2014 Vasquez Guzman PA, Sood A, Mleczko MJ, Wang B, Wong Philip HS, Nishi Y, Asheghi M, Goodson KE. Cross plane thermal conductance of graphene-metal interfaces Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1385-1389. DOI: 10.1109/ITHERM.2014.6892441  1
2014 Altman D, Tyhach M, McClymonds J, Kim S, Graham S, Cho J, Goodson K, Francis D, Faili F, Ejeckam F, Bernstein S. Analysis and characterization of thermal transport in GaN HEMTs on Diamond substrates Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1199-1205. DOI: 10.1109/ITHERM.2014.6892416  1
2014 Sood A, Cho J, Hobart KD, Feygelson T, Pate B, Asheghi M, Goodson KE. Anisotropic and nonhomogeneous thermal conduction in 1 μm thick CVD diamond Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1192-1198. DOI: 10.1109/ITHERM.2014.6892415  1
2014 Cho J, Chu KK, Chao PC, McGray C, Asheghi M, Goodson KE. Thermal conduction normal to thin silicon nitride films on diamond and GaN Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1186-1191. DOI: 10.1109/ITHERM.2014.6892414  1
2014 Lingamneni S, Asheghi M, Goodson KE. A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 870-875. DOI: 10.1109/ITHERM.2014.6892372  1
2014 Sood A, Eryilmaz SB, Jeyasingh R, Cho J, Asheghi M, Wong HSP, Goodson KE. Thermal characterization of nanostructured superlattices of TiN/TaN: Applications as electrodes in phase change memory Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 765-770. DOI: 10.1109/ITHERM.2014.6892358  1
2014 Dusseault TJ, Gires J, Barako MT, Won Y, Agonafer DD, Asheghi M, Santiago JG, Goodson KE. Inverse opals for fluid delivery in electronics cooling systems Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 750-755. DOI: 10.1109/ITHERM.2014.6892356  1
2014 Fong SW, Jeyasingh R, Asheghi M, Goodson KE, Wong HSP. Characterization of phase-change layer thermal properties using a micro-thermal stage Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 744-749. DOI: 10.1109/ITHERM.2014.6892355  1
2014 Barako MT, Weisse JM, Roy S, Kodama T, Dusseault TJ, Motoyama M, Asheghi M, Prinz FB, Zheng X, Goodson KE. Thermal conduction in nanoporous copper inverse opal films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 736-743. DOI: 10.1109/ITHERM.2014.6892354  1
2014 Park W, Marconnet AM, Kodama T, Park J, Sinclair R, Asheghi M, Goodson KE. Phonon thermal conduction in periodically porous silicon nanobeams Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 637-640. DOI: 10.1109/ITHERM.2014.6892341  1
2014 Won Y, Barako MT, Agonafer DD, Asheghi M, Goodson KE. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 326-332. DOI: 10.1109/ITHERM.2014.6892299  1
2014 Agonafer DD, Lopez K, Won Y, Palko J, Asheghi M, Santiago JG, Goodson KE. Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 306-316. DOI: 10.1109/ITHERM.2014.6892297  1
2014 Cho J, Won Y, Francis D, Asheghi M, Goodson KE. Thermal interface resistance measurements for GaN-on-diamond composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978583  1
2014 Agonafer DD, Palko J, Won Y, Lopez K, Dusseault T, Gires J, Asheghi M, Santiago JG, Goodson KE. Progress on phase separation microfluidics Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978575  1
2014 Won Y, Houshmand F, Agonafer D, Asheghi M, Goodson KE. Microfluidic heat exchangers for high power density GaN on SiC Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978568  1
2014 Cho J, Li Y, Hoke WE, Altman DH, Asheghi M, Goodson KE. Phonon scattering in strained transition layers for GaN heteroepitaxy Physical Review B - Condensed Matter and Materials Physics. 89. DOI: 10.1103/PhysRevB.89.115301  1
2014 Sood A, Rowlette JA, Caneau CG, Bozorg-Grayeli E, Asheghi M, Goodson KE. Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs Applied Physics Letters. 105. DOI: 10.1063/1.4892575  1
2014 Cahill DG, Braun PV, Chen G, Clarke DR, Fan S, Goodson KE, Keblinski P, King WP, Mahan GD, Majumdar A, Maris HJ, Phillpot SR, Pop E, Shi L. Nanoscale thermal transport. II. 2003-2012 Applied Physics Reviews. 1. DOI: 10.1063/1.4832615  1
2014 Yee SK, Leblanc S, Goodson KE, Dames C. Reply to the 'comment on "$ per W metrics for thermoelectric power generation: Beyond ZT"' by G. Nunes, Jr, Energy Environ. Sci., 2014, 7, DOI: 10.1039/C3EE43700K Energy and Environmental Science. 7: 3441-3442. DOI: 10.1039/c4ee01119h  1
2014 Leblanc S, Yee SK, Scullin ML, Dames C, Goodson KE. Material and manufacturing cost considerations for thermoelectrics Renewable and Sustainable Energy Reviews. 32: 313-327. DOI: 10.1016/j.rser.2013.12.030  1
2014 Lee J, Yoon YJ, Eaton JK, Goodson KE, Bai SJ. Analysis of oxide (Al2O3, CuO, and ZnO) and CNT nanoparticles disaggregation effect on the thermal conductivity and the viscosity of nanofluids International Journal of Precision Engineering and Manufacturing. 15: 703-710. DOI: 10.1007/s12541-014-0390-1  1
2013 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Impact of annealing on the thermoelectric properties Ge 2Sb2Te5 films Materials Research Society Symposium Proceedings. 1490: 223-228. DOI: 10.1557/opl.2012.1573  1
2013 Cho J, Chao PC, Asheghi M, Goodson KE. Conduction normal to polysilicon films on diamond Asme 2013 4th International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2013. DOI: 10.1115/MNHMT2013-22171  1
2013 Dunham MT, Barako MT, LeBlanc S, Asheghi-Roudheni M, Chen B, Goodson K. Modeling and optimization of small thermoelectric generators for low-power electronics Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 1. DOI: 10.1115/IPACK2013-73297  1
2013 Roy S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Towards thermal characterization of pico-liter volumes using the 3omega method Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 8. DOI: 10.1115/IMECE2013-66428  1
2013 Lingamneni S, Marconnet AM, Goodson KE. 3D packaging materials based on graphite nanoplatelet and aluminum nitride nanocomposites Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10. DOI: 10.1115/IMECE2013-66419  1
2013 Touzelbaev MN, Miler J, Yang Y, Refai-Ahmed G, Goodson KE. High-efficiency transient temperature calculations for applications in dynamic thermal management of electronic devices Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4024747  1
2013 Marconnet AM, Asheghi M, Goodson KE. From the Casimir limit to phononic crystals: 20 years of phonon transport studies using silicon-on-insulator technology Journal of Heat Transfer. 135. DOI: 10.1115/1.4023577  1
2013 Gao Y, Marconnet AM, Xiang R, Maruyama S, Goodson KE. Heat capacity, thermal conductivity, and interface resistance extraction for single-walled carbon nanotube films using frequency-domain thermoreflectance Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1524-1532. DOI: 10.1109/TCPMT.2013.2254175  1
2013 Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Improved thermal interfaces of GaN-Diamond composite substrates for HEMT applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 79-85. DOI: 10.1109/TCPMT.2012.2223818  1
2013 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Cooling limits for GaN HEMT technology Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2013.6659222  1
2013 Marconnet AM, Panzer MA, Goodson KE. Thermal conduction phenomena in carbon nanotubes and related nanostructured materials Reviews of Modern Physics. 85: 1295-1326. DOI: 10.1103/RevModPhys.85.1295  1
2013 Lee J, Bozorg-Grayeli E, Kim S, Asheghi M, Philip Wong HS, Goodson KE. Phonon and electron transport through Ge2Sb2Te 5 films and interfaces bounded by metals Applied Physics Letters. 102. DOI: 10.1063/1.4807141  1
2013 Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart K, Goodson KE. Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance Applied Physics Letters. 102. DOI: 10.1063/1.4796168  1
2013 Yee SK, Leblanc S, Goodson KE, Dames C. $ per W metrics for thermoelectric power generation: Beyond ZT Energy and Environmental Science. 6: 2561-2571. DOI: 10.1039/c3ee41504j  1
2013 Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module Journal of Electronic Materials. 42: 372-381. DOI: 10.1007/s11664-012-2366-1  1
2013 Sandhu R, Gambin V, Poust B, Smorchkova I, Lewis G, Elmadjian R, Li D, Geiger C, Heying B, Wojtowicz M, Oki A, Feygelson T, Hobart K, Pate B, Tabeling J, ... ... Goodson K, et al. GaN HEMT near junction heat removal 2013 International Conference On Compound Semiconductor Manufacturing Technology, Cs Mantech 2013. 175-178.  1
2012 Weisse JM, Marconnet AM, Kim DR, Rao PM, Panzer MA, Goodson KE, Zheng X. Thermal conductivity in porous silicon nanowire arrays. Nanoscale Research Letters. 7: 554. PMID 23039084 DOI: 10.1186/1556-276X-7-554  1
2012 Li Z, Tan S, Bozorg-Grayeli E, Kodama T, Asheghi M, Delgado G, Panzer M, Pokrovsky A, Wack D, Goodson KE. Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm. Nano Letters. 12: 3121-6. PMID 22563928 DOI: 10.1021/nl300996r  1
2012 Lee J, Asheghi M, Goodson KE. Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling. Nanotechnology. 23: 205201. PMID 22543873 DOI: 10.1088/0957-4484/23/20/205201  1
2012 Yoneoka S, Lee J, Liger M, Yama G, Kodama T, Gunji M, Provine J, Howe RT, Goodson KE, Kenny TW. Electrical and thermal conduction in atomic layer deposition nanobridges down to 7 nm thickness. Nano Letters. 12: 683-6. PMID 22224582 DOI: 10.1021/nl203548w  1
2012 Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx F, Goodson KE, Wong HSP. Effect of resistance drift on the activation energy for crystallization in phase change memory Japanese Journal of Applied Physics. 51. DOI: 10.1143/JJAP.51.02BD06  1
2012 Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 777-783. DOI: 10.1115/MNHMT2012-75129  1
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Thermoelectric characterization of Ge2Sb2Te 5 films for phase-change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 687-693. DOI: 10.1115/MNHMT2012-75092  1
2012 Li Z, Tan S, Kodama T, Bozorg-Grayeli E, Asheghi M, Goodson KE. Electron-phonon coupled two-dimensional heat transfer in nanoscale metal/dielectric multilayers Asme 2012 Heat Transfer Summer Conf. Collocated With the Asme 2012 Fluids Engineering Div. Summer Meeting and the Asme 2012 10th Int. Conf. On Nanochannels, Microchannels and Minichannels, Ht 2012. 1: 579-587. DOI: 10.1115/HT2012-58350  1
2012 Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase-change memory Ieee Transactions On Electron Devices. 59: 3561-3567. DOI: 10.1109/TED.2012.2219311  1
2012 Cho J, Bozorg-Grayeli E, Altman DH, Asheghi M, Goodson KE. Low thermal resistances at GaN-SiC interfaces for HEMT technology Ieee Electron Device Letters. 33: 378-380. DOI: 10.1109/LED.2011.2181481  1
2012 Lee J, Kim S, Marconnet A, In'T Zandt MAA, Asheghi M, Philip Wong HSP, Goodson KE. Thermoelectric characterization and power generation using a silicon-on-insulator substrate Journal of Microelectromechanical Systems. 21: 4-6. DOI: 10.1109/JMEMS.2011.2175704  1
2012 Hom L, Durieux A, Miler J, Asheghi M, Ramani K, Goodson KE. Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1412-1419. DOI: 10.1109/ITHERM.2012.6231585  1
2012 Barako MT, Gao Y, Marconnet AM, Asheghi M, Goodson KE. Solder-bonded carbon nanotube thermal interface materials Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1225-1233. DOI: 10.1109/ITHERM.2012.6231562  1
2012 Won Y, Gao Y, De Villoria RG, Wardle BL, Kenny TW, Goodson KE. Crust removal and effective modulus of aligned multi-walled carbon nanotube films Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1070-1076. DOI: 10.1109/ITHERM.2012.6231543  1
2012 Bozorg-Grayeli E, Li Z, Gambin V, Asheghi M, Goodson KE. Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1059-1064. DOI: 10.1109/ITHERM.2012.6231541  1
2012 Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Thermal characterization of GaN-on-diamond substrates for HEMT applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 435-439. DOI: 10.1109/ITHERM.2012.6231463  1
2012 Kodama T, Park W, Marconnet A, Lee J, Asheghi M, Goodson KE. In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 250-255. DOI: 10.1109/ITHERM.2012.6231437  1
2012 Aminfar A, Bozorg Grayeli E, Asheghi M, Goodson KE. Analysis of HEMT multilayered structures using a 2D finite volume model Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 224-234. DOI: 10.1109/ITHERM.2012.6231434  1
2012 Park W, Barako MT, Marconnet AM, Asheghi M, Goodson KE. Effect of thermal cycling on commercial thermoelectric modules Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 107-112. DOI: 10.1109/ITHERM.2012.6231420  1
2012 Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. A reliability study with infrared imaging of thermoelectric modules under thermal cycling Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 86-92. DOI: 10.1109/ITHERM.2012.6231417  1
2012 Marconnet AM, Motoyama M, Barako MT, Gao Y, Pozder S, Fowler B, Ramakrishna K, Mortland G, Asheghi M, Goodson KE. Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 15-19. DOI: 10.1109/ITHERM.2012.6231408  1
2012 Sandhu R, Gambin V, Poust B, Smorchkova I, Lewis G, Elmadjian R, Li D, Geiger C, Heying B, Wojtowicz M, Oki A, Feygelson T, Hobart K, Bozorg-Grayeli E, Goodson K. Diamond materials for GaN HEMT near junction heat removal Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2012.6340119  1
2012 Cho J, Li Y, Altman DH, Hoke WE, Asheghi M, Goodson KE. Temperature dependent thermal resistances at GaN-substrate interfaces in GaN composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2012.6340094  1
2012 Marconnet AM, Kodama T, Asheghi M, Goodson KE. Phonon conduction in periodically porous silicon nanobridges Nanoscale and Microscale Thermophysical Engineering. 16: 199-219. DOI: 10.1080/15567265.2012.732195  1
2012 Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics Journal of Applied Physics. 112. DOI: 10.1063/1.4759450  1
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Phase purity and the thermoelectric properties of Ge 2Sb 2Te 5 films down to 25 nm thickness Journal of Applied Physics. 112. DOI: 10.1063/1.4731252  1
2012 Leblanc S, Phadke S, Kodama T, Salleo A, Goodson KE. Electrothermal phenomena in zinc oxide nanowires and contacts Applied Physics Letters. 100. DOI: 10.1063/1.4703935  1
2012 Won Y, Lee J, Asheghi M, Kenny TW, Goodson KE. Phase and thickness dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness Applied Physics Letters. 100. DOI: 10.1063/1.3699227  1
2012 Marconnet A, Panzer M, Yerci S, Minissale S, Wang X, Zhang X, Dal Negro L, Goodson KE. Thermal conductivity and photoluminescence of light-emitting silicon nitride films Applied Physics Letters. 100. DOI: 10.1063/1.3682508  1
2012 Gao Y, Kodama T, Won Y, Dogbe S, Pan L, Goodson KE. Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films Carbon. 50: 3789-3798. DOI: 10.1016/j.carbon.2012.04.004  1
2012 Won Y, Gao Y, Panzer MA, Dogbe S, Pan L, Kenny TW, Goodson KE. Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators Carbon. 50: 347-355. DOI: 10.1016/j.carbon.2011.08.009  1
2011 Marconnet AM, Yamamoto N, Panzer MA, Wardle BL, Goodson KE. Thermal conduction in aligned carbon nanotube-polymer nanocomposites with high packing density. Acs Nano. 5: 4818-25. PMID 21598962 DOI: 10.1021/nn200847u  1
2011 Kim S, Lee B, Asheghi M, Hurkx F, Reifenberg JP, Goodson KE, Wong HSP. Resistance and threshold switching voltage drift behavior in phase-change memory and their temperature dependence at microsecond time scales studied using a micro-thermal stage Ieee Transactions On Electron Devices. 58: 584-592. DOI: 10.1109/TED.2010.2095502  1
2011 Bozorg-Grayeli E, Reifenberg JP, Panzer MA, Rowlette JA, Goodson KE. Temperature-dependent thermal properties of phase-change memory electrode materials Ieee Electron Device Letters. 32: 1281-1283. DOI: 10.1109/LED.2011.2158796  1
2011 Li Z, Lee J, Reifenberg JP, Asheghi M, Jeyasingh RGD, Wong HSP, Goodson KE. Grain boundaries, phase impurities, and anisotropic thermal conduction in phase-change memory Ieee Electron Device Letters. 32: 961-963. DOI: 10.1109/LED.2011.2150193  1
2011 Lee J, Kim S, Jeyasingh R, Asheghi M, Wong HSP, Goodson KE. Microthermal stage for electrothermal characterization of phase-change memory Ieee Electron Device Letters. 32: 952-954. DOI: 10.1109/LED.2011.2144952  1
2011 Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. High temperature thermal properties of thin tantalum nitride films Applied Physics Letters. 99. DOI: 10.1063/1.3672098  1
2011 Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx GAM, Goodson KE, Philip Wong HS. Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage Journal of Applied Physics. 110. DOI: 10.1063/1.3667295  1
2011 Lee J, Li Z, Reifenberg JP, Lee S, Sinclair R, Asheghi M, Goodson KE. Thermal conductivity anisotropy and grain structure in Ge 2Sb2Te5 films Journal of Applied Physics. 109. DOI: 10.1063/1.3573505  1
2011 Jain A, Goodson KE. Thermal microdevices for biological and biomedical applications Journal of Thermal Biology. 36: 209-218. DOI: 10.1016/j.jtherbio.2011.02.006  1
2011 Steinbrenner JE, Lee ES, Hidrovo CH, Eaton JK, Goodson KE. Impact of channel geometry on two-phase flow in fuel cell microchannels Journal of Power Sources. 196: 5012-5020. DOI: 10.1016/j.jpowsour.2011.02.032  1
2011 Won Y, Wang EN, Goodson KE, Kenny TW. 3-D visualization of flow in microscale jet impingement systems International Journal of Thermal Sciences. 50: 325-331. DOI: 10.1016/j.ijthermalsci.2010.08.005  1
2011 David MP, Steinbrenner JE, Miler J, Goodson KE. Adiabatic and diabatic two-phase venting flow in a microchannel International Journal of Multiphase Flow. 37: 1135-1146. DOI: 10.1016/j.ijmultiphaseflow.2011.06.013  1
2011 David MP, Miler J, Steinbrenner JE, Yang Y, Touzelbaev M, Goodson KE. Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger International Journal of Heat and Mass Transfer. 54: 5504-5516. DOI: 10.1016/j.ijheatmasstransfer.2011.07.040  1
2011 Gharagozloo PE, Goodson KE. Temperature-dependent aggregation and diffusion in nanofluids International Journal of Heat and Mass Transfer. 54: 797-806. DOI: 10.1016/j.ijheatmasstransfer.2010.06.058  1
2011 Lee J, Reifenberg JP, Asheghi M, Goodson KE. High temperature thermal characterization of Ge 2Sb 2Te 5for phase change memory Asme/Jsme 2011 8th Thermal Engineering Joint Conference, Ajtec 2011 1
2011 Yamamoto N, Marconnet AM, Duong HM, Goodson KE, Wardle BL. Non-linear thermal conductivity enhancement in nanocomposites with aligned-CNT implementation Iccm International Conferences On Composite Materials 1
2011 Parikh SE, Sheppard S, Goodson KE. Characterizing responses to open-ended questions in heat transfer based on everyday situations Asee Annual Conference and Exposition, Conference Proceedings 1
2010 Rogacs A, Steinbrenner JE, Rowlette JA, Weisse JM, Zheng XL, Goodson KE. Characterization of the wettability of thin nanostructured films in the presence of evaporation. Journal of Colloid and Interface Science. 349: 354-60. PMID 20579656 DOI: 10.1016/j.jcis.2010.05.063  1
2010 Panzer MA, Duong HM, Okawa J, Shiomi J, Wardle BL, Maruyama S, Goodson KE. Temperature-dependent phonon conduction and nanotube engagement in metalized single wall carbon nanotube films. Nano Letters. 10: 2395-400. PMID 20503983 DOI: 10.1021/nl100443x  1
2010 Hu X, Pan LS, Gu G, Goodson KE. Superior thermal interfaces made by metallically anchored carbon nanotube arrays Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 597-603. DOI: 10.1115/InterPACK2009-89375  1
2010 Miler JL, Flynn R, Refai-Ahmed G, Touzelbaev M, David M, Steinbrenner J, Goodson KE. Effects of transient heating on two-phase flow response in microchannel heat exchangers Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 563-569. DOI: 10.1115/InterPACK2009-89325  1
2010 Won YJ, Lee JH, Wang EN, Goodson KE, Kenny TW. An optimization design for a MEMS fabricated jet impingement cooling device Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 491-496. DOI: 10.1115/InterPACK2009-89257  1
2010 David MP, Steinbrenner J, Miler J, Goodson KE. Visualization and analysis of venting from a single microchannel two-phase copper heat exchanger Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 437-444. DOI: 10.1115/InterPACK2009-89192  1
2010 Li Z, Lee J, Reifenberg JP, Asheghi M, Philip Wong HS, Goodson KE. IN-plane thermal conduction and conductivity anisotropy in Ge 2Sb2Te5 films for phase change memory Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10: 651-658. DOI: 10.1115/IMECE2010-40459  1
2010 Miler JL, Refai-Ahmed G, Touzelbaev MN, David MP, Steinbrenner JE, Goodson KE. Reduced-order fluidic model for flow instabilities in two-phase microfluidic heat exchangers Asme 2010 8th International Conference On Nanochannels, Microchannels, and Minichannels Collocated With 3rd Joint Us-European Fluids Engineering Summer Meeting, Icnmm2010. 155-161. DOI: 10.1115/FEDSM-ICNMM2010-30878  1
2010 Lee J, Gharagozloo PE, Kolade B, Eaton JK, Goodson KE. Nanofluid convection in microtubes Journal of Heat Transfer. 132: 1-5. DOI: 10.1115/1.4001637  1
2010 Reifenberg JP, Chang KW, Panzer MA, Kim S, Rowlette JA, Asheghi M, Wong HSP, Goodson KE. Thermal boundary resistance measurements for phase-change memory devices Ieee Electron Device Letters. 31: 56-58. DOI: 10.1109/LED.2009.2035139  1
2010 Wong HSP, Raoux S, Kim S, Liang J, Reifenberg JP, Rajendran B, Asheghi M, Goodson KE. Phase change memory Proceedings of the Ieee. 98: 2201-2227. DOI: 10.1109/JPROC.2010.2070050  1
2010 Lee J, Reifenberg JP, Bozorg-Grayeli E, Hom L, Li Z, Kim S, Asheghi M, Wong HSP, Goodson KE. Decoupled thermal resistances of phase change material and their impact on PCM devices 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501412  1
2010 Bozorg-Grayeli E, Reifenberg JP, Chang KW, Panzer M, Goodson KE. Thermal conductivity and boundary resistance measurements of GeSbTe and electrode materials using nanosecond thermoreflectance 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501263  1
2010 Fang C, Steinbrenner JE, Wang FM, Goodson KE. Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels Journal of Micromechanics and Microengineering. 20. DOI: 10.1088/0960-1317/20/4/045018  1
2010 Gharagozloo PE, Goodson KE. Aggregate fractal dimensions and thermal conduction in nanofluids Journal of Applied Physics. 108. DOI: 10.1063/1.3481423  1
2010 Fang C, David M, Wang Fm, Goodson KE. Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation International Journal of Multiphase Flow. 36: 608-619. DOI: 10.1016/j.ijmultiphaseflow.2010.04.005  1
2010 Gao Y, Marconnet AM, Panzer MA, Leblanc S, Dogbe S, Ezzahri Y, Shakouri A, Goodson KE. Nanostructured interfaces for thermoelectrics Journal of Electronic Materials. 39: 1456-1462. DOI: 10.1007/s11664-010-1256-7  1
2009 Kodama T, Jain A, Goodson KE. Heat conduction through a DNA-gold composite. Nano Letters. 9: 2005-9. PMID 19435380 DOI: 10.1021/nl900272m  1
2009 LeBlanc SA, Gao Y, Goodson KE. Thermoelectric heat recovery from a tankless water heating system Asme International Mechanical Engineering Congress and Exposition, Proceedings. 8: 131-137. DOI: 10.1115/IMECE2008-68860  1
2009 Steinbrenner JE, Fang C, Eon SL, Hidrovo CH, Wang FM, Goodson KE. Flow regime evolution in long, serpentine microchannels with a porous carbon paper wall Asme International Mechanical Engineering Congress and Exposition, Proceedings. 10: 773-781. DOI: 10.1115/IMECE2008-68447  1
2009 Marconnet AM, David MP, Rogacs A, Flynn RD, Goodson KE. Temperature-dependent permeability of microporous membranes for vapor venting heat exchangers Asme International Mechanical Engineering Congress and Exposition, Proceedings. 10: 1005-1012. DOI: 10.1115/IMECE2008-67934  1
2009 Fogg DW, Goodson KE. Bubble-induced water hammer and cavitation in microchannel flow boiling Journal of Heat Transfer. 131: 1-12. DOI: 10.1115/1.3216381  1
2009 Kolade B, Goodson KE, Eaton JK. Convective performance of nanofluids in a laminar thermally developing tube flow Journal of Heat Transfer. 131: 1-8. DOI: 10.1115/1.3013831  1
2009 Pettes AM, Hodes MS, Goodson KE. Optimized thermoelectric refrigeration in the presence of thermal boundary resistance Ieee Transactions On Advanced Packaging. 32: 423-430. DOI: 10.1109/TADVP.2008.924221  1
2009 Lee J, Reifenberg JP, Li Z, Hom L, Asheghi M, Kim S, Wong HSP, Goodson KE. Measurement of anisotropy in the thermal conductivity of Ge 2Sb2Te5 films Proceedings - 2009 10th Non-Volatile Memory Technology Symposium, Nvmts 2009. 52-57. DOI: 10.1109/NVMT.2009.5429777  1
2009 Panzer MA, Shandalov M, Rowlette JA, Oshima Y, Chen YW, McIntyre PC, Goodson KE. Thermal properties of ultrathin hafnium oxide gate dielectric films Ieee Electron Device Letters. 30: 1269-1271. DOI: 10.1109/LED.2009.2032937  1
2009 Rowlette JA, Kekatpure RD, Panzer MA, Brongersma ML, Goodson KE. Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films Physical Review B - Condensed Matter and Materials Physics. 80. DOI: 10.1103/PhysRevB.80.045314  1
2009 Buongiorno J, Venerus DC, Prabhat N, McKrell T, Townsend J, Christianson R, Tolmachev YV, Keblinski P, Hu LW, Alvarado JL, Bang IC, Bishnoi SW, Bonetti M, Botz F, Cecere A, ... ... Goodson KE, et al. A benchmark study on the thermal conductivity of nanofluids Journal of Applied Physics. 106. DOI: 10.1063/1.3245330  1
2009 Chandorkar SA, Candler RN, Duwel A, Melamud R, Agarwal M, Goodson KE, Kenny TW. Multimode thermoelastic dissipation Journal of Applied Physics. 105. DOI: 10.1063/1.3072682  1
2009 Jain A, Ness K, Goodson KE. Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform Sensors and Actuators, B: Chemical. 143: 286-294. DOI: 10.1016/j.snb.2009.08.035  1
2008 David MP, Khurana T, Hidrovo C, Pruitt BL, Goodson KE. Vapor-venting, micromachined heat exchanger for electronics cooling Asme International Mechanical Engineering Congress and Exposition, Proceedings. 8: 951-960. DOI: 10.1115/IMECE2007-42553  1
2008 David MP, Marconnet A, Goodson KE. Hydrodynamic and thermal performance of a vapor-venting microchannel copper heat exchanger Proceedings of the 6th International Conference On Nanochannels, Microchannels, and Minichannels, Icnmm2008. 1363-1370. DOI: 10.1115/ICNMM2008-62269  1
2008 Jain A, Goodson KE. Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3ω method Journal of Heat Transfer. 130. DOI: 10.1115/1.2945904  1
2008 Panzer MA, Zhang G, Mann D, Hu X, Pop E, Dai H, Goodson KE. Thermal properties of metal-coated vertically aligned single-wall nanotube arrays Journal of Heat Transfer. 130. DOI: 10.1115/1.2885159  1
2008 Rowlette JA, Goodson KE. Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs Ieee Transactions On Electron Devices. 55: 220-232. DOI: 10.1109/TED.2007.911043  1
2008 Chandorkar SA, Agarwal M, Melamud R, Candler RN, Goodson KE, Kenny TW. Limits of quality factor in bulk-mode micromechanical resonators Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 74-77. DOI: 10.1109/MEMSYS.2008.4443596  1
2008 Reifenberg JP, Kencke DL, Goodson KE. The impact of thermal boundary resistance in phase-change memory devices Ieee Electron Device Letters. 29: 1112-1114. DOI: 10.1109/LED.2008.2003012  1
2008 Gharagozloo PE, Eaton JK, Goodson KE. Diffusion, aggregation, and the thermal conductivity of nanofluids Applied Physics Letters. 93. DOI: 10.1063/1.2977868  1
2008 Panzer MA, Goodson KE. Thermal resistance between low-dimensional nanostructures and semi-infinite media Journal of Applied Physics. 103. DOI: 10.1063/1.2903519  1
2008 Hu XJ, Jain A, Goodson KE. Investigation of the natural convection boundary condition in microfabricated structures International Journal of Thermal Sciences. 47: 820-824. DOI: 10.1016/j.ijthermalsci.2007.07.011  1
2008 Oh DW, Jain A, Eaton JK, Goodson KE, Lee JS. Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3ω method International Journal of Heat and Fluid Flow. 29: 1456-1461. DOI: 10.1016/j.ijheatfluidflow.2008.04.007  1
2007 Goodson KE. Materials science. Ordering up the minimum thermal conductivity of solids. Science (New York, N.Y.). 315: 342-3. PMID 17234938 DOI: 10.1126/science.1138067  1
2007 Kodama T, Jain A, Goodson KE. Nonmetallic conduction property of a DNA templated gold nanowire 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 999-1005. DOI: 10.1115/IPACK2007-33422  1
2007 Gharagozloo PE, Goodson KE, Eaton JK. Impact of thermodiffusion on temperature fields in stationary nanofluids 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 993-998. DOI: 10.1115/IPACK2007-33293  1
2007 Kim DR, Koo JM, Fang C, Steinbrenner JE, Lee ES, Wang FM, Hidrovo CH, Eaton JK, Goodson KE. Compact model of slug flow in microchannels Proceedings of the 5th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2007. 321-330. DOI: 10.1115/ICNMM2007-30146  1
2007 Lee J, Flynn RD, Goodson KE, Eaton JK. Convective heat transfer of nanofluids (DI water-AL2O 3) in micro-channels 2007 Proceedings of the Asme/Jsme Thermal Engineering Summer Heat Transfer Conference - Ht 2007. 1: 843-850. DOI: 10.1115/HT2007-32630  1
2007 King WP, Goodson KE. Thermomechanical formation of nanoscale polymer indents with a heated silicon tip Journal of Heat Transfer. 129: 1600-1604. DOI: 10.1115/1.2764088  1
2007 Hu XJ, Panzer MA, Goodson KE. Infrared microscopy thermal characterization of opposing carbon nanotube arrays Journal of Heat Transfer. 129: 91-93. DOI: 10.1115/1.2401202  1
2007 Pettes AM, Melamud R, Higuchi S, Goodson KE. Impact of contact resistances on the low-dimensional scaling of thermoelectric energy conversion devices International Conference On Thermoelectrics, Ict, Proceedings. 283-289. DOI: 10.1109/ICT.2007.4569480  1
2007 Reifenberg JP, Panzer MA, Kim S, Gibby AM, Zhang Y, Wong S, Wong HSP, Pop E, Goodson KE. Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films Applied Physics Letters. 91. DOI: 10.1063/1.2784169  1
2007 Pop E, Mann DA, Goodson KE, Dai H. Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates Journal of Applied Physics. 101. DOI: 10.1063/1.2717855  1
2007 Steinbrenner JE, Hidrovo CH, Wang FM, Vigneron S, Lee ES, Kramer TA, Cheng CH, Eaton JK, Goodson KE. Measurement and modeling of liquid film thickness evolution in stratified two-phase microchannel flows Applied Thermal Engineering. 27: 1722-1727. DOI: 10.1016/j.applthermaleng.2006.07.020  1
2007 Wang FM, Steinbrenner JE, Hidrovo CH, Kramer TA, Lee ES, Vigneron S, Cheng CH, Eaton JK, Goodson KE. Investigation of two-phase transport phenomena in microchannels using a microfabricated experimental structure Applied Thermal Engineering. 27: 1728-1733. DOI: 10.1016/j.applthermaleng.2006.07.014  1
2007 Chandorkar SA, Mehta H, Agarwal M, Hopcroft MA, Jha CM, Candler RN, Yama G, Bahl G, Kim B, Melamud R, Goodson KE, Kenny TW. Non-isothermal micromechanical resonators Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 211-214.  1
2006 Kenny TW, Goodson KE, Santiago JG, Wang E, Koo JMO, Jiang L, Pop E, Sinha S, Zhang L, Fogg D, Yao S, Flynn R, Chang CH, Hidrovo CH. Advanced cooling technologies for microprocessors International Journal of High Speed Electronics and Systems. 16: 301-313. DOI: 10.1142/S0129156406003655  1
2006 Flynn RD, Fogg DW, Koo JM, Cheng CH, Goodson KE. Boiling flow interaction between two parallel microchannels American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-14696  1
2006 Fogg DW, Cheng CH, Goodson KE. Bubble departure and convection in large aspect ratio microchannels American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-14382  1
2006 Fogg DW, Goodson KE. Design considerations for the effects ofliquid compressibility in microchannel flow boiling American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-14380  1
2006 Oh DW, Jain A, Eaton JK, Goodson KE, Lee JS. Thermal conductivity measurement of aluminum oxide nanofluids using the 3-omega method American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-14196  1
2006 Hu XJ, Padilla AA, Xu J, Fisher TS, Goodson KE. 3-omega measurements of vertically oriented carbon nanotubes on silicon Journal of Heat Transfer. 128: 1109-1113. DOI: 10.1115/1.2352778  1
2006 Sinha S, Pop E, Dutton RW, Goodson KE. Non-equilibrium phonon distributions in sub-100 nm silicon transistors Journal of Heat Transfer. 128: 638-647. DOI: 10.1115/1.2194041  1
2006 Pop E, Goodson KE. Thermal phenomena in nanoscale transistors Journal of Electronic Packaging, Transactions of the Asme. 128: 102-108. DOI: 10.1115/1.2188950  1
2006 Pop E, Sinha S, Goodson KE. Heat generation and transport in nanometer-scale transistors Proceedings of the Ieee. 94: 1587-1601. DOI: 10.1109/JPROC.2006.879794  1
2006 Panzer M, Zhang G, Mann D, Hu X, Pop E, Dai H, Goodson KE. Thermal properties of metal-coated vertically-aligned single wall nanotube films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 1306-1313. DOI: 10.1109/ITHERM.2006.1645496  1
2006 Hidrovo CH, Kramer TA, Wang EN, Vigneron S, Steinbrenner JE, Koo JM, Wang FM, Fogg DW, Flynn RD, Lee ES, Cheng CH, Kenny TW, Eaton JK, Goodson KE. Two-phase microfluidics for semiconductor circuits and fuel cells Heat Transfer Engineering. 27: 53-63. DOI: 10.1080/01457630500523816  1
2006 Sinha S, Goodson KE. Thermal conduction in sub-100 nm transistors Microelectronics Journal. 37: 1148-1157. DOI: 10.1016/j.mejo.2005.07.015  1
2006 Wang EN, Devasenathipathy S, Lin H, Hidrovo CH, Santiago JG, Goodson KE, Kenny TW. A hybrid method for bubble geometry reconstruction in two-phase microchannels Experiments in Fluids. 40: 847-858. DOI: 10.1007/s00348-006-0123-z  1
2006 Fogg DW, Goodson KE. The effects of liquid compressibility on the nucleation and growth of bubbles in forced convective flow boiling within microchannels Proceedings of the 4th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2006. 2006: 115-124.  1
2005 Hu X, Panzer M, Goodson KE. Thermal characterization of two opposing carbon nanotube arrays using diffraction-limited infrared microscopy American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 376: 835-839. DOI: 10.1115/IMECE2005-83005  1
2005 Jain A, Goodson KE. Measurement of thermophysical properties of thin film shape memory alloys using the 3-omega method American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) Mems. 7: 537-541. DOI: 10.1115/IMECE2005-81902  1
2005 Lee ES, Hidrovo CH, Steinbrenner JE, Wang FM, Vigneron S, Goodson KE, Eaton JK. Flow structures and frictional characteristics on two-phase flow in microchannels in PEM fuel cells Proceedings of the American Society of Mechanical Engineers Fluids Engineering Division Summer Conference. 1: 899-906. DOI: 10.1115/FEDSM2005-77369  1
2005 Koo JM, Im S, Jiang L, Goodson KE. Integrated microchannel cooling for three-dimensional electronic circuit architectures Journal of Heat Transfer. 127: 49-58. DOI: 10.1115/1.1839582  1
2005 Im S, Srivastava N, Banerjee K, Goodson KE. Scaling analysis of multilevel interconnect temperatures for high-performance ICs Ieee Transactions On Electron Devices. 52: 2710-2719. DOI: 10.1109/TED.2005.859612  1
2005 Jain A, Ness KD, Fishman HA, Goodson KE. Investigation of temperature gradient effects on neurite outgrowh in nerve cells using a microfabricated heater structure 2005 3rd Ieee/Embs Special Topic Conference On Microtechnology in Medicine and Biology. 2005: 398-399. DOI: 10.1109/MMB.2005.1548487  1
2005 Pop E, Dutton RW, Goodson KE. Monte Carlo simulation of Joule heating in bulk and strained silicon Applied Physics Letters. 86: 1-3. DOI: 10.1063/1.1870106  1
2005 Sinha S, Schelling PK, Phillpot SR, Goodson KE. Scattering of g -process longitudinal optical phonons at hotspots in silicon Journal of Applied Physics. 97. DOI: 10.1063/1.1831549  1
2005 Schelling PK, Shi L, Goodson KE. Managing heat for electronics Materials Today. 8: 30-35. DOI: 10.1016/S1369-7021(05)70935-4  1
2005 Zhang L, Wang EN, Goodson KE, Kenny TW. Phase change phenomena in silicon microchannels International Journal of Heat and Mass Transfer. 48: 1572-1582. DOI: 10.1016/j.ijheatmasstransfer.2004.09.048  1
2005 Hu X, Padilla AA, Xu J, Fisher TS, Goodson KE. Thermal characterization of vertically-oriented carbon nanotubes on silicon Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 292-297.  1
2005 Im S, Srivastava N, Banerjee K, Goodson KE. Thermal scaling analysis of multilevel Cu/Low-k interconnect structures in deep nanometer scale technologies 2005 Proceedings - 22nd International Vlsi Multilevel Interconnection Conference, Vmic 2005. 525-530.  1
2005 Singaravelu SAG, Hu X, Goodson KE. Bond line thickness of thermal interface materials with carbon nanotubes Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 379-384.  1
2005 Pop E, Rowlette JA, Dutton RW, Goodson KE. Joule heating under quasi-ballistic transport conditions in bulk and strained silicon devices International Conference On Simulation of Semiconductor Processes and Devices, Sispad. 2005: 307-310.  1
2005 Flynn RD, Kramer TA, Koo JM, Cheng CH, Fogg DW, Wang EN, Goodson KE. Convective boiling in silicon microchannels with localized heating and thermometry Proceedings of the 3rd International Conference On Microchannels and Minichannels, 2005. 125-130.  1
2005 Ness KD, Mariella RP, Long GW, Goodson KE, Belgrader P. DNA purification of biothreat agents using a micropillar chip Proceedings of the 3rd International Conference On Microchannels and Minichannels, 2005. 769-778.  1
2005 Hidrovo CH, Wang FM, Steinbrenner JE, Lee ES, Vigneron S, Cheng CH, Eaton JK, Goodson KE. Water slug detachment in two-phase hydrophobic microchannel flows Proceedings of the 3rd International Conference On Microchannels and Minichannels, 2005. 709-715.  1
2004 Asheghi M, Liu W, Goodson KE. Effect of phonon dispersion on transport properties of single-crystalline dielectrics American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 4: 113-123. DOI: 10.1115/IMECE2004-62244  1
2004 Sinha S, Pop E, Goodson KE. A split-flux model for phonon transport near hotspots American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 4: 75-85. DOI: 10.1115/IMECE2004-61949  1
2004 Hidrovo CH, Wang FM, Lee ES, Vigneron S, Steinbrenner JE, Paidipati JV, Kramer TA, Eaton JK, Goodson KE. Experimental investigation and visualization of two-phase flow and water transport in microchannels American Society of Mechanical Engineers, Fluids Engineering Division (Publication) Fed. 260: 205-212. DOI: 10.1115/IMECE2004-61401  1
2004 Wang EN, Zhang L, Jiang L, Koo JM, Maveety JG, Sanchez EA, Goodson KE, Kenny TW. Correction to "Micromachined Jets for Liquid Impingement Cooling of VLSI Chips" Journal of Microelectromechanical Systems. 13: 1072. DOI: 10.1109/JMEMS.2004.840851  1
2004 Wang EN, Zhang L, Jiang L, Koo JM, Maveety JG, Sanchez EA, Goodson KE, Kenny TW. Micromachined jets for liquid impingement cooling of VLSI chips Journal of Microelectromechanical Systems. 13: 833-842. DOI: 10.1109/JMEMS.2004.835768  1
2004 Pop E, Dutton RW, Goodson KE. Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion Journal of Applied Physics. 96: 4998-5005. DOI: 10.1063/1.1788838  1
2004 Sinha S, Schelling PK, Phillpot SR, Goodson KE. Atomistic simulations of G-type phonons in silicon devices Proceedings of the Asme Heat Transfer/Fluids Engineering Summer Conference 2004, Ht/Fed 2004. 4: 433-439.  1
2001 Fletcher DA, Goodson KE, Kino GS. Focusing in microlenses close to a wavelength in diameter. Optics Letters. 26: 399-401. PMID 18040333  1
1992 Flik MI, Zhang ZM, Goodson KE, Siegal MP, Phillips JM. Electron scattering rate in epitaxial YBa2Cu3O7 superconducting films. Physical Review. B, Condensed Matter. 46: 5606-5614. PMID 10004349 DOI: 10.1103/PhysRevB.46.5606  1
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