Eugene M. Chow, Ph.D. - Publications

Affiliations: 
2001 Stanford University, Palo Alto, CA 

33 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Maeda PY, Lu JP, Whiting GL, Biegelsen DK, Raychaudhuri S, Lujan R, Veres J, Chow EM, Gupta V, Nielson GN, Paap S. Micro chiplet printer for micro-scale photovoltaic system assembly 2015 Ieee 42nd Photovoltaic Specialist Conference, Pvsc 2015. DOI: 10.1109/PVSC.2015.7356280  1
2014 Lu JP, Thompson JD, Whiting GL, Biegelsen DK, Raychaudhuri S, Lujan R, Veres J, Lavery LL, Völkel AR, Chow EM. Open and closed loop manipulation of charged microchiplets in an electric field Applied Physics Letters. 105. DOI: 10.1063/1.4891957  1
2013 Cheng B, De Bruyker D, Chua C, Sahasrabuddhe K, Shubin I, Cunningham JE, Luo Y, Bohringer KF, Krishnamoorthy AV, Chow EM. Microspring characterization and flip-chip assembly reliability Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 187-196. DOI: 10.1109/TCPMT.2012.2213250  1
2013 Shubin I, Chow EM, Chow A, De Bruyker D, Thacker HD, Fujimoto K, Raj K, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects Proceedings - Electronic Components and Technology Conference. 329-333. DOI: 10.1109/ECTC.2013.6575591  1
2013 Ready S, Endicott F, Whiting GL, Ng TA, Chow EM, Lu J. 3D printed electronics International Conference On Digital Printing Technologies. 9-12.  1
2012 Shubin I, Chow EM, Chow A, Thacker HD, DebBruyker D, Fujimoto K, Raj K, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers Proceedings - Electronic Components and Technology Conference. 263-267. DOI: 10.1109/ECTC.2012.6248838  1
2012 Hantschel T, Chow EM. S-shaped double-spring structures for high stiffness and spring height Microelectronic Engineering. 97: 231-234. DOI: 10.1016/j.mee.2012.03.023  1
2011 Cheng B, Chow EM, De Bruyker D, Shubin I, Cunningham J, Chow A, Shi J, Böhringer KF. Current crowding study of a micro spring contact for flip chip packaging Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 360-363. DOI: 10.1109/MEMSYS.2011.5734436  1
2011 Cunningham JE, Krishnamoorthy AV, Ho R, Shubin I, Thacker H, Lexau J, Lee DC, Feng D, Chow E, Luo Y, Zheng X, Li G, Yao J, Pinguet T, Raj K, et al. Integration and packaging of a macrochip with silicon nanophotonic links Ieee Journal On Selected Topics in Quantum Electronics. 17: 546-558. DOI: 10.1109/JSTQE.2010.2091674  1
2010 Shubin I, Chow A, Cunningham J, Giere M, Nettleton N, Pinckney N, Shi J, Simons J, Hopkins R, Mitchell J, Douglas D, Chow EM, DeBruyker D, Cheng B, Anderson G. A package demonstration with solder free compliant flexible interconnects Proceedings - Electronic Components and Technology Conference. 1429-1435. DOI: 10.1109/ECTC.2010.5490813  1
2009 Chow EM, Fork DK, Chua CL, Van Schuylenbergh K, Hantschel T. Wafer-level packaging with soldered stress-engineered micro-springs Ieee Transactions On Advanced Packaging. 32: 372-378. DOI: 10.1109/TADVP.2008.2010507  1
2009 Shubin I, Chow EM, Cunningham J, De Bruyker D, Chua C, Cheng B, Knights JC, Sahasrabuddhe K, Luo Y, Chow A, Simons J, Krishnamoorthy AV, Hopkins R, Drost R, Ho R, et al. Novel packaging with Rematable spring interconnect chips for MCM Proceedings - Electronic Components and Technology Conference. 1053-1058. DOI: 10.1109/ECTC.2009.5074142  1
2009 Cheng B, Chow EM, DeBruyker D, Chua C, Sahasrabuddhe K, Shubin I, Cunningham J, Luo Y, Krishnamoorthy AV. Microspring characterization and flip chip assembly reliability Proceedings - 2009 International Symposium On Microelectronics, Imaps 2009. 492-499.  1
2006 Guo XE, Takai E, Jiang X, Xu Q, Whitesides GM, Yardley JT, Hung CT, Chow EM, Hantschel T, Costa KD. Intracellular calcium waves in bone cell networks under single cell nanoindentation. Molecular & Cellular Biomechanics : McB. 3: 95-107. PMID 17263256  1
2006 Chow EM, Chua C, Hantschel T, Van Schuylenbergh K, Fork DK. Pressure contact micro-springs in small pitch flip-chip packages Ieee Transactions On Components and Packaging Technologies. 29: 796-802. DOI: 10.1109/TCAPT.2006.885959  1
2006 Wong WS, Chow EM, Lujan R, Geluz-Aguilar V, Chabinyc ML. Fine-feature patterning of self-aligned polymeric thin-film transistors fabricated by digital lithography and electroplating Applied Physics Letters. 89. DOI: 10.1063/1.2360237  1
2006 Chow EM, Lu JP, Ho J, Shih C, De Bruyker D, Rosa M, Peeters E. High voltage thin film transistors integrated with MEMS Sensors and Actuators, a: Physical. 130: 297-301. DOI: 10.1016/j.sna.2005.10.028  1
2005 Fork DK, Chow EM, Chua CL, Hantschel T, Van Schuylenbergh K, Jagerson T, Wong L, Geluz V. Chip on glass bonding using stressedMetal™ technology Digest of Technical Papers - Sid International Symposium. 36: 534-537. DOI: 10.1889/1.2036493  1
2005 Chow EM, Chua C, Hantschel T, Van Schuylenbergh K, Fork DK. Solder-free pressure contact micro-springs in high-density flip-chip packages Proceedings - Electronic Components and Technology Conference. 2: 1119-1126.  1
2003 Chow EM, Hantschel T, Klein K, Fork DK, Chua CL, Wong L, Van Schuylenbergh K. Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 1: 408-411. DOI: 10.1109/SENSOR.2003.1215340  1
2003 Hantschel T, Chow EM, Rudolph D, Shih C, Wong L, Fork DK. Stressed-metal NiZr probes for atomic force microscopy Microelectronic Engineering. 67: 803-809. DOI: 10.1016/S0167-9317(03)00142-4  1
2003 Hantschel T, Chow EM, Wong L. Stressed-metal probes for atomic force microscopy on biological samples Microscopy and Microanalysis. 9: 1232-1233.  1
2003 Chow EM, Klein K, Fork DK, Hantschel T, Chua CL, Wong L, Van Schuylenbergh K. Intermittency study of a stressed-metal micro-spring sliding electrical contact Proceedings - Electronic Components and Technology Conference. 1714-1717.  1
2002 Chow EM, Chandrasekaran V, Partridge A, Nishida T, Sheplak M, Quate CF, Kenny TW. Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates Journal of Microelectromechanical Systems. 11: 631-640. DOI: 10.1109/JMEMS.2002.805206  1
2002 Hantschel T, Chow EM, Rudolph D, Fork DK. Stressed metal probes for atomic force microscopy Applied Physics Letters. 81: 3070-3072. DOI: 10.1063/1.1514830  1
2002 Chow EM, Yaralioglu GG, Quate CF, Kenny TW. Characterization of a two-dimensional cantilever array with through-wafer electrical interconnects Applied Physics Letters. 80: 664-666. DOI: 10.1063/1.1435804  1
2001 Chandrasekaran V, Chow EM, Kenny TW, Nishida T, Sheplak M. Through-wafer electrical interconnects for MEMS sensors Asme International Mechanical Engineering Congress and Exposition, Proceedings. 2: 2893-2898.  1
2000 Yasumura KY, Stowe TD, Chow EM, Pfafman T, Kenny TW, Stipe BC, Rugar D. Quality factors in micron- and submicron-thick cantilevers Journal of Microelectromechanical Systems. 9: 117-125. DOI: 10.1109/84.825786  1
2000 Partridge A, Reynolds JK, Chui BW, Chow EM, Fitzgerald AM, Zhang L, Maluf NI, Kenny TW. High-performance planar piezoresistive accelerometer Journal of Microelectromechanical Systems. 9: 58-66. DOI: 10.1109/84.825778  1
2000 Rudnitsky RG, Chow EM, Kenny TW. Rapid biochemical detection and differentiation with magnetic force microscope cantilever arrays Sensors and Actuators, a: Physical. 83: 256-262. DOI: 10.1016/S0924-4247(99)00393-3  1
2000 Chow EM, Soh HT, Lee HC, Adams JD, Minne SC, Yaralioglu G, Atalar A, Quate CF, Kenny TW. Integration of through-wafer interconnects with a two-dimensional cantilever array Sensors and Actuators, a: Physical. 83: 118-123. DOI: 10.1016/S0924-4247(99)00381-7  1
2000 Cheng CH, Chow EM, Jin X, Ergun S, Khuri-Yakub BT. An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays Proceedings of the Ieee Ultrasonics Symposium. 2: 1179-1182.  1
1998 Harley JA, Chow EM, Kenny TW. Design of resonant beam transducers: An axial force probe for atomic force microscopy American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) Dsc. 66: 247-252.  1
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