Rob N. Candler, Ph.D. - Publications

Affiliations: 
2006 Stanford University, Palo Alto, CA 

76 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Hwang Y, Seo D, Roy M, Han E, Candler RN, Seo S. JMEMS Letters Capillary Flow in PDMS Cylindrical Microfluidic Channel Using 3-D Printed Mold Journal of Microelectromechanical Systems. DOI: 10.1109/JMEMS.2016.2521858  0.96
2016 Iyer SS, Candler RN. Mode- and Direction-Dependent Mechanical Energy Dissipation in Single-Crystal Resonators due to Anharmonic Phonon-Phonon Scattering Physical Review Applied. 5. DOI: 10.1103/PhysRevApplied.5.034002  0.96
2015 Sohn H, Nowakowski ME, Liang CY, Hockel JL, Wetzlar K, Keller S, McLellan BM, Marcus MA, Doran A, Young A, Kläui M, Carman GP, Bokor J, Candler RN. Electrically driven magnetic domain wall rotation in multiferroic heterostructures to manipulate suspended on-chip magnetic particles. Acs Nano. 9: 4814-26. PMID 25906195 DOI: 10.1021/nn5056332  0.96
2015 Ng E, Yang Y, Hong VA, Ahn CH, Heinz DB, Flader I, Chen Y, Everhart CLM, Kim B, Melamud R, Candler RN, Hopcroft MA, Salvia JC, Yoneoka S, Graham AB, et al. The long path from MEMS resonators to timing products Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 2015: 1-2. DOI: 10.1109/MEMSYS.2015.7050869  0.96
2015 Harrison J, Hwang Y, Paydar O, Wu J, Threlkeld E, Rosenzweig J, Musumeci P, Candler R. High-gradient microelectromechanical system quadrupole electromagnets for particle beam focusing and steering Physical Review Special Topics - Accelerators and Beams. 18. DOI: 10.1103/PhysRevSTAB.18.023501  0.96
2015 Hwang Y, Paydar OH, Candler RN. Pneumatic microfinger with balloon fins for linear motion using 3D printed molds Sensors and Actuators, a: Physical. 234: 65-71. DOI: 10.1016/j.sna.2015.08.008  0.96
2015 Hwang Y, Paydar OH, Candler RN. 3D printed molds for non-planar PDMS microfluidic channels Sensors and Actuators, a: Physical. 226: 137-142. DOI: 10.1016/j.sna.2015.02.028  0.96
2014 Harrison J, Paydar O, Hwang Y, Wu J, Threlkeld E, Musumeci P, Candler RN. Fabrication process for thick-film micromachined multi-pole electromagnets Journal of Microelectromechanical Systems. 23: 505-507. DOI: 10.1109/JMEMS.2014.2315763  0.96
2014 Lake JJ, Duwel AE, Candler RN. Particle swarm optimization for design of slotted MEMS resonators with low thermoelastic dissipation Journal of Microelectromechanical Systems. 23: 364-371. DOI: 10.1109/JMEMS.2013.2275999  0.96
2014 Hwang Y, Paydar OH, Ho M, Rosenzweig JB, Candler RN. Electrochemical macroporous silicon etching with current compensation Electronics Letters. 50: 1373-1375. DOI: 10.1049/el.2014.1662  0.96
2014 Harrison J, Joshi A, Hwang Y, Paydar O, Lake J, Musumeci P, Candler RN. Surface-micromachined electromagnets for 100 μm-scale undulators and focusing optics Physics Procedia. 52: 19-26. DOI: 10.1016/jphpro.2014.06.005  0.96
2014 Paydar OH, Paredes CN, Hwang Y, Paz J, Shah NB, Candler RN. Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings Sensors and Actuators, a: Physical. 205: 199-203. DOI: 10.1016/j.sna.2013.11.005  0.96
2013 Hwang Y, Sohn H, Phan A, Yaghi OM, Candler RN. Dielectrophoresis-assembled zeolitic imidazolate framework nanoparticle-coupled resonators for highly sensitive and selective gas detection. Nano Letters. 13: 5271-6. PMID 24099583 DOI: 10.1021/nl4027692  0.96
2013 Lake J, Ng E, Ahn CH, Hong V, Yang Y, Wong J, Candler R. Particle swarm optimization for design of MEMS resonators with low thermoelastic dissipation 2013 Transducers and Eurosensors Xxvii: the 17th International Conference On Solid-State Sensors, Actuators and Microsystems, Transducers and Eurosensors 2013. 1456-1459. DOI: 10.1109/Transducers.2013.6627054  0.96
2013 Hwang Y, Phan A, Galatsis K, Yaghi OM, Candler RN. Zeolitic imidazolate framework-coupled resonators for enhanced gas detection Journal of Micromechanics and Microengineering. 23. DOI: 10.1088/0960-1317/23/12/125027  0.96
2013 Iyer SS, Vedad-Ghavami R, Lee H, Liger M, Kavehpour HP, Candler RN. Nonlinear damping for vibration isolation of microsystems using shear thickening fluid Applied Physics Letters. 102. DOI: 10.1063/1.4812192  0.96
2013 Chung AJ, Wu CY, Co DE, Oka JC, Paydar OH, Candler R, Di Carlo D. Complex 3D shaped particle fabrication via inertial flow deformation and UV polymerization 17th International Conference On Miniaturized Systems For Chemistry and Life Sciences, Microtas 2013. 1: 687-689.  0.96
2012 Paydar OH, Wottawa CR, Fan RE, Dutson EP, Grundfest WS, Culjat MO, Candler RN. Fabrication of a thin-film capacitive force sensor array for tactile feedback in robotic surgery. Conference Proceedings : ... Annual International Conference of the Ieee Engineering in Medicine and Biology Society. Ieee Engineering in Medicine and Biology Society. Annual Conference. 2012: 2355-8. PMID 23366397 DOI: 10.1109/EMBC.2012.6346436  0.96
2012 Hwang Y, Candler RN. Fabrication process for integrating nanoparticles with released structures using photoresist replacement of sublimated p-dichlorobenzene for temporary support Journal of Microelectromechanical Systems. 21: 1282-1284. DOI: 10.1109/JMEMS.2012.2221160  0.96
2012 Hwang Y, Gao F, Hong AJ, Candler RN. Porous silicon resonators for improved vapor detection Journal of Microelectromechanical Systems. 21: 235-242. DOI: 10.1109/JMEMS.2011.2170819  0.96
2012 Harrison J, Joshi A, Lake J, Candler R, Musumeci P. Surface-micromachined magnetic undulator with period length between 10μm and 1 mm for advanced light sources Physical Review Special Topics - Accelerators and Beams. 15. DOI: 10.1103/PhysRevSTAB.15.070703  0.96
2012 Paydar OH, Paredes CN, Candler RN. Three dimensionally-printed (3DP) microfluidic devices Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. 217-220.  0.96
2012 Hwang Y, Phan A, Galatsis K, Yaghi OM, Candler RN. ZIF-coupled microresonator for highly sensitive and selective gas detection Proceedings of the 16th International Conference On Miniaturized Systems For Chemistry and Life Sciences, Microtas 2012. 231-233.  0.96
2012 Iyer S, Lee H, Liger M, Judy J, Candler R. Nonlinear damping for shock protection of MEMS devices using shear thickening fluid Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. 465-468.  0.96
2011 Kim J, Hong AJ, Kim SM, Shin KS, Song EB, Hwang Y, Xiu F, Galatsis K, Chui CO, Candler RN, Choi S, Moon JT, Wang KL. A stacked memory device on logic 3D technology for ultra-high-density data storage. Nanotechnology. 22: 254006. PMID 21572190 DOI: 10.1088/0957-4484/22/25/254006  0.96
2011 Candler R. Etiquette for engineers: Tips for getting a great letter of recommendation Ieee Potentials. 30: 14-16. DOI: 10.1109/MPOT.2011.940902  0.96
2011 Tsai KL, Ziaei-Moayyed M, Candler RN, Hu W, Brand V, Klejwa N, Wang SX, Howe RT. Magnetic, mechanical, and optical characterization of a magnetic nanoparticle-embedded polymer for microactuation Journal of Microelectromechanical Systems. 20: 65-72. DOI: 10.1109/JMEMS.2010.2093560  0.96
2011 Hwang Y, Kim S, Candler RN. Receptor-coated porous silicon resonators for enhanced sensitivity of vapor detection Proceedings of the Ieee International Frequency Control Symposium and Exposition. DOI: 10.1109/FCS.2011.5977841  0.96
2011 Kim SM, Song EB, Lee S, Seo S, Seo DH, Hwang Y, Candler R, Wang KL. Suspended few-layer graphene beam electromechanical switch with abrupt on-off characteristics and minimal leakage current Applied Physics Letters. 99. DOI: 10.1063/1.3610571  0.96
2010 Candler RN, Hwang Y, Gao F. Sensitivity enhancement of vapor sensors with porous silicon resonant structures Proceedings of Spie - the International Society For Optical Engineering. 7679. DOI: 10.1117/12.850390  0.96
2010 Yoneoka S, Roper CS, Candler RN, Chandorkar SA, Graham AB, Provine J, Maboudian R, Howe RT, Kenny TW. Characterization of encapsulated micromechanical resonators sealed and coated with polycrystalline SiC Journal of Microelectromechanical Systems. 19: 357-366. DOI: 10.1109/JMEMS.2010.2040460  0.96
2010 Bahl G, Melamud R, Kim B, Chandorkar SA, Salvia JC, Hopcroft MA, Elata D, Hennessy RG, Candler RN, Howe RT, Kenny TW. Model and observations of dielectric charge in thermally oxidized silicon resonators Journal of Microelectromechanical Systems. 19: 162-174. DOI: 10.1109/JMEMS.2009.2036274  0.96
2010 Candler R. Encapsulation by Film Deposition Handbook of Silicon Based Mems Materials and Technologies. 569-574. DOI: 10.1016/B978-0-8155-1594-4.00038-3  0.96
2009 Chiou JA, Lee YC, Kurabayashi K, Candler RN. Foreword special section on packaging for micro/nano-scale systems Ieee Transactions On Advanced Packaging. 32: 399-401. DOI: 10.1109/TADVP.2009.2021387  0.96
2009 Roper CS, Candler R, Yoneoka S, Kenny T, Howe RT, Maboudian R. Simultaneous wafer-scale vacuum encapsulation and microstructure cladding with LPCVD polycrystalline 3C-SiC Transducers 2009 - 15th International Conference On Solid-State Sensors, Actuators and Microsystems. 1031-1034. DOI: 10.1109/SENSOR.2009.5285964  0.96
2009 Weinberg M, Candler R, Chandorkar S, Varsanik J, Kenny T, Duwel A. Energy loss in MEMS resonators and the impact on inertial and RF devices Transducers 2009 - 15th International Conference On Solid-State Sensors, Actuators and Microsystems. 688-695. DOI: 10.1109/SENSOR.2009.5285418  0.96
2009 Yoneoka S, Bahl G, Salvia J, Chen KL, Graham AB, Lee HK, Yama G, Candler RN, Kenny TW. Acceleration compensation of MEMS resonators using electrostatic tuning Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 805-808. DOI: 10.1109/MEMSYS.2009.4805505  0.96
2009 Chandorkar SA, Candler RN, Duwel A, Melamud R, Agarwal M, Goodson KE, Kenny TW. Multimode thermoelastic dissipation Journal of Applied Physics. 105. DOI: 10.1063/1.3072682  0.96
2009 Kim B, Candler RN, Melamud R, Hopcroft MA, Yoneoka S, Lee HK, Agarwal M, Chandorkar SA, Yama G, Kenny TW. Hermeticity and diffusion investigation in polysilicon film encapsulation for microelectromechanical systems Journal of Applied Physics. 105. DOI: 10.1063/1.3054366  0.96
2008 Kim B, Candler RN, Melamud R, Yoneoka S, Hyung KL, Yama G, Kenny TW. Identification and management of diffusion pathways in polysilicon encapsulation for MEMS devices Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 104-107. DOI: 10.1109/MEMSYS.2008.4443603  0.96
2008 Chandorkar SA, Agarwal M, Melamud R, Candler RN, Goodson KE, Kenny TW. Limits of quality factor in bulk-mode micromechanical resonators Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 74-77. DOI: 10.1109/MEMSYS.2008.4443596  0.96
2008 Kim B, Hopcroft MA, Candler RN, Jha CM, Agarwal M, Melamud R, Chandorkar SA, Yama G, Kenny TW. Temperature dependence of quality factor in MEMS resonators Journal of Microelectromechanical Systems. 17: 755-766. DOI: 10.1109/JMEMS.2008.924253  0.96
2008 Jha CM, Hopcroft MA, Chandorkar SA, Salvia JC, Agarwal M, Candler RN, Melamud R, Kim B, Kenny TW. Thermal isolation of encapsulated MEMS resonators Journal of Microelectromechanical Systems. 17: 175-184. DOI: 10.1109/JMEMS.2007.904332  0.96
2008 Agarwal M, Chandorkar SA, Mehta H, Candler RN, Kim B, Hopcroft MA, Melamud R, Jha CM, Bahl G, Yama G, Kenny TW, Murmann B. A study of electrostatic force nonlinearities in resonant microstructures Applied Physics Letters. 92. DOI: 10.1063/1.2834707  0.96
2007 Park WT, O'Connor KN, Chen KL, Mallon JR, Maetani T, Dalal P, Candler RN, Ayanoor-Vitikkate V, Roberson JB, Puria S, Kenny TW. Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids. Biomedical Microdevices. 9: 939-49. PMID 17574533 DOI: 10.1007/s10544-007-9072-4  0.96
2007 Kim B, Hopcroft M, Jha CM, Melamud R, Chandorkar S, Agarwal M, Chen KL, Park WT, Candler R, Yama G, Partridge A, Lutz M, Kenny TW. Using MEMS to build the device and the package Transducers and Eurosensors '07 - 4th International Conference On Solid-State Sensors, Actuators and Microsystems. 331-334. DOI: 10.1109/SENSOR.2007.4300135  0.96
2007 Kim B, Melamud R, Hopcroft MA, Chandorkar SA, Bahl G, Messana M, Candler RN, Yama G, Kenny T. Si-SiO2 composite MEMS resonators in CMOS compatible wafer-scale thin-film encapsulation Proceedings of the Ieee International Frequency Control Symposium and Exposition. 1214-1219. DOI: 10.1109/FREQ.2007.4319270  0.96
2007 Agarwal M, Park KK, Candler RN, Kim B, Hopcroft MA, Chandorkar SA, Jha CM, Melamud R, Kenny TW, Murmann B. Nonlinear characterization of electrostatic MEMS resonators Proceedings of the Ieee International Frequency Control Symposium and Exposition. 209-212. DOI: 10.1109/FREQ.2006.275380  0.96
2007 Agarwal M, Mehta H, Candler RN, Chandorkar SA, Kim B, Hopcroft MA, Melamud R, Bahl G, Yama G, Kenny TW, Murmann B. Scaling of amplitude-frequency-dependence nonlinearities in electrostatically transduced microresonators Journal of Applied Physics. 102. DOI: 10.1063/1.2785018  0.96
2007 Hopcroft MA, Kim B, Chandorkar S, Melamud R, Agarwal M, Jha CM, Bahl G, Salvia J, Mehta H, Lee HK, Candler RN, Kenny TW. Using the temperature dependence of resonator quality factor as a thermometer Applied Physics Letters. 91. DOI: 10.1063/1.2753758  0.96
2007 Agarwal M, Park KK, Chandorkar SA, Candler RN, Kim B, Hopcroft MA, Melamud R, Kenny TW, Murmann B. Acceleration sensitivity in beam-type electrostatic microresonators Applied Physics Letters. 90. DOI: 10.1063/1.2426884  0.96
2007 Kim B, Candler RN, Hopcroft MA, Agarwal M, Park WT, Kenny TW. Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators Sensors and Actuators, a: Physical. 136: 125-131. DOI: 10.1016/j.sna.2006.10.040  0.96
2007 Chandorkar SA, Mehta H, Agarwal M, Hopcroft MA, Jha CM, Candler RN, Yama G, Bahl G, Kim B, Melamud R, Goodson KE, Kenny TW. Non-isothermal micromechanical resonators Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 211-214.  0.96
2007 Agarwal M, Mehta H, Candler RN, Chandorkar SA, Kim B, Hopcroft MA, Melamud R, Bahl G, Yama G, Kenny TW, Murmann B. Impact of miniaturization on the current handling of electrostatic MEMS resonators Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 783-786.  0.96
2006 Jha CM, Hopcroft MA, Agarwal M, Chandorkar SA, Candler RN, Subramanian V, Melamud R, Bhat S, Kim B, Park KK, Kenny TW. In-chip device-layer thermal isolation of MEMS resonator for lower power budget American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) Mems. DOI: 10.1115/IMECE2006-15176  0.96
2006 Candler RN, Hopcroft MA, Kim B, Park WT, Melamud R, Agarwal M, Yama G, Partridge A, Lutz M, Kenny TW. Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators Journal of Microelectromechanical Systems. 15: 1446-1456. DOI: 10.1109/JMEMS.2006.883586  0.96
2006 Duwel A, Candler RN, Kenny TW, Varghese M. Engineering MEMS resonators with low thermoelastic damping Journal of Microelectromechanical Systems. 15: 1437-1445. DOI: 10.1109/JMEMS.2006.883573  0.96
2006 Candler RN, Duwel A, Varghese M, Chandorkar SA, Hopcroft MA, Park WT, Kim B, Yama G, Partridge A, Lutz M, Kenny TW. Impact of geometry on thermoelastic dissipation in micromechanical resonant beams Journal of Microelectromechanical Systems. 15: 927-934. DOI: 10.1109/JMEMS.2006.879374  0.96
2006 Park WT, Partridge A, Candler RN, Ayanoor-Vitikkate V, Yama G, Lutz M, Kenny TW. Encapsulated submillimeter piezoresistive accelerometers Journal of Microelectromechanical Systems. 15: 507-514. DOI: 10.1109/JMEMS.2006.876648  0.96
2006 Agarwal M, Chandorkar SA, Candler RN, Kim B, Hopcroft MA, Melamud R, Jha CM, Kenny TW, Murmann B. Optimal drive condition for nonlinearity reduction in electrostatic microresonators Applied Physics Letters. 89. DOI: 10.1063/1.2388886  0.96
2006 Hopcroft MA, Agarwal M, Park KK, Kim B, Jha CM, Candler RN, Yama G, Murmann B, Kenny TW. Temperature compensation of a MEMS resonator using quality factor as a thermometer Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 2006: 222-225.  0.96
2006 Agarwal M, Park KK, Hopcroft M, Chandorkar S, Candler RN, Kim B, Melamud R, Yama G, Murmann B, Kenny TW. Effects of mechanical vibrations and bias voltage noise on phase noise of MEMS resonator based oscillators Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 2006: 154-157.  0.96
2005 Candler RN, Park WT, Hopcroft M, Kim B, Kenny TW. Hydrogen diffusion and pressure control of encapsulated mems resonators Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 1: 920-923. DOI: 10.1109/SENSOR.2005.1496568  0.96
2005 Candler RN, Hopcroft M, Low CW, Chandorkar S, Kim B, Varghese M, Duwel A, Kenny TW. Impact of slot location on thermoelastic dissipation in micromechanical resonators Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 1: 597-600. DOI: 10.1109/SENSOR.2005.1496488  0.96
2005 Melamud R, Hopcroft M, Jha C, Kim B, Chandorkar S, Candler R, Kenny TW. Effects of stress on the temperature coefficient of frequency in double clamped resonators Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 1: 392-395. DOI: 10.1109/SENSOR.2005.1496438  0.96
2005 Candler R. Stuff most students never ask about grad school Ieee Potentials. 24: 4-10. DOI: 10.1109/MP.2005.1502497  0.96
2005 Kim B, Candler RN, Hopcroft M, Agarwal M, Park WT, Kenny TW. Frequency stability of wafer-scale encapsulated MEMS resonators Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 2: 1965-1968.  0.96
2005 Park WT, O'Connor KN, Mallon JR, Maetani T, Candler RN, Ayanoor-Vitikkate V, Roberson JB, Puria S, Kenny TW. Sub-mm encapsulated accelerometers: A fully implantable sensor for cochlear implants Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 1: 109-112.  0.96
2005 Park WT, Candler RN, Ayanoor-Vitikkate V, Lutz M, Partridge A, Yama G, Kenny TW. Fully encapsulated sub-millimeter accelerometers Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 347-350.  0.96
2005 Agarwal M, Park K, Candler R, Hopcroft M, Jha C, Melamud R, Kim B, Murmann B, Kenny TW. Non-linearity cancellation in MEMS resonators for improved power-handling Technical Digest - International Electron Devices Meeting, Iedm. 2005: 286-289.  0.96
2004 Kim B, Candler RN, Hopcroft M, Agarwal M, Park WT, Li JT, Kenny T. Investigation of MEMS resonator characteristics during long-term and wide temperature variation operation American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) Mems. 413-416. DOI: 10.1115/IMECE2004-61727  0.96
2003 Candler RN, Park WT, Li H, Yama G, Partridge A, Lutz M, Kenny TW. Single Wafer Encapsulation of MEMS Devices Ieee Transactions On Advanced Packaging. 26: 227-232. DOI: 10.1109/TADVP.2003.818062  0.96
2003 Park WT, Candler RN, Kronmueller S, Lutz M, Partridge A, Yama G, Kenny TW. Wafer-scale film encapsulation of micromachined accelerometers Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 2: 1903-1906. DOI: 10.1109/SENSOR.2003.1217163  0.72
2003 Candler RN, Li H, Lutz M, Park WT, Partridge A, Yama G, Kenny TW. Investigation of energy loss mechanisms in micromechanical resonators Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 1: 332-335. DOI: 10.1109/SENSOR.2003.1215320  0.72
2003 Park WT, Cho J, Li H, Kenny TW, Candler RN, Li HJ, Partridge A, Yama G, Lutz M. Wafer scale encapsulation of MEMS devices Advances in Electronic Packaging. 1: 209-212.  0.96
2002 Kenny TW, Candler RN, Li HJ, Park WT, Cho J, Li H, Partridge A, Yama G, Lutz M. An integrated wafer-scale packaging process for MEMS American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 51-54. DOI: 10.1115/IMECE2002-39270  0.96
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