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Madhavan Swaminathan - Publications

Affiliations: 
Georgia Institute of Technology, Atlanta, GA 
Area:
Electronics and Electrical Engineering, Computer Science
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129 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Yu H, Swaminathan M. A Bit-Time-Dependent Model of I/O Drivers for Overclocking Analysis Ieee Transactions On Very Large Scale Integration Systems. 28: 1630-1637. DOI: 10.1109/Tvlsi.2020.2994060  0.337
2020 Yu H, Michalka T, Larbi M, Swaminathan M. Behavioral Modeling of Tunable I/O Drivers With Preemphasis Including Power Supply Noise Ieee Transactions On Very Large Scale Integration Systems. 28: 233-242. DOI: 10.1109/Tvlsi.2019.2936815  0.419
2020 Chekuri VCK, Kar M, Singh A, Davis AK, Bellaredj MLF, Swaminathan M, Mukhopadhyay S. An Inductive Voltage Regulator with Overdrive Tracking across Input Voltage in Cascoded Power Stage Ieee Transactions On Circuits and Systems Ii-Express Briefs. 1-1. DOI: 10.1109/Tcsii.2020.2981129  0.306
2020 Oh H, Swaminathan M, May GS, Bakir MS. Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1337-1347. DOI: 10.1109/Tcpmt.2020.3006784  0.358
2020 Larbi M, Trinchero R, Canavero FG, Besnier P, Swaminathan M. Analysis of Parameter Variability in an Integrated Wireless Power Transfer System via Partial Least Squares Regression Ieee Transactions On Components, Packaging and Manufacturing Technology. 1-1. DOI: 10.1109/Tcpmt.2020.3002226  0.351
2020 Zhou Y, Sivapurapu S, Swaminathan M, Sitaraman SK. Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1088-1100. DOI: 10.1109/Tcpmt.2020.2995532  0.354
2020 Watanabe AO, Ito H, Markondeya RP, Tummala RR, Swaminathan M. Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 870-877. DOI: 10.1109/Tcpmt.2020.2982294  0.394
2020 Zhang R, Liu F, Kathaperumal M, Swaminathan M, Tummala RR. Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 393-399. DOI: 10.1109/Tcpmt.2020.2973548  0.314
2020 Lee M, Singh A, Torun HM, Kim J, Lim SK, Swaminathan M, Mukhopadhyay S. Automated I/O Library Generation for Interposer-Based System-in-Package Integration of Multiple Heterogeneous Dies Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 111-122. DOI: 10.1109/Tcpmt.2019.2953659  0.367
2020 Bellaredj MLF, Davis AK, Kohl P, Swaminathan M. Magnetic Core Solenoid Power Inductors on Organic Substrate for System-in-Package Integrated High-Frequency Voltage Regulators Ieee Journal of Emerging and Selected Topics in Power Electronics. 8: 2682-2695. DOI: 10.1109/Jestpe.2019.2914215  0.399
2019 Mukhopadhyay S, Long Y, Mudassar BA, Nair CS, DeProspo BH, Torun HM, Kathaperumal M, Smet V, Kim D, Yalamanchili S, Swaminathan M. Heterogeneous integration for artificial intelligence: Challenges and opportunities Journal of Reproduction and Development. 63. DOI: 10.1147/Jrd.2019.2947373  0.3
2019 Torun HM, Swaminathan M. High-Dimensional Global Optimization Method for High-Frequency Electronic Design Ieee Transactions On Microwave Theory and Techniques. 67: 2128-2142. DOI: 10.1109/Tmtt.2019.2915298  0.358
2019 Bellaredj MLF, Davis AK, Kohl P, Swaminathan M, Sandler S. Design, Fabrication, and Characterization of Package Embedded Solenoidal Magnetic Core Inductors for High-Efficiency System-In-Package Integrated Voltage Regulators Ieee Transactions On Magnetics. 55: 1-7. DOI: 10.1109/Tmag.2019.2901780  0.397
2019 Pardue CA, Torun HM, Bellaredj MLF, Swaminathan M. RF Near-Field Coupling System Using Reverse PDN and Considering Electromagnetic Effects Ieee Transactions On Electromagnetic Compatibility. 61: 1904-1912. DOI: 10.1109/Temc.2018.2881247  0.431
2019 Sivapurapu S, Swaminathan M, Chen R, Mehta C, Zhou Y, Bellaredj MLF, Jia X, Kohl PA, Huang T, Sitaraman SK. Multi-Physics Modeling and Characterization of Components on Flexible Substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1730-1740. DOI: 10.1109/Tcpmt.2019.2931452  0.353
2019 Li Y, Yu H, Jin H, Sarvey TE, Oh H, Bakir MS, Swaminathan M, Li E. Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1244-1252. DOI: 10.1109/Tcpmt.2019.2920974  0.322
2019 Pardue CA, Bellaredj MLF, Torun HM, Swaminathan M, Kohl P, Davis AK. RF Wireless Power Transfer Using Integrated Inductor Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 913-920. DOI: 10.1109/Tcpmt.2018.2881273  0.409
2019 Mueller S, Bellaredj MLF, Davis AK, Kohl PA, Swaminathan M. Design Exploration of Package-Embedded Inductors for High-Efficiency Integrated Voltage Regulators Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 96-106. DOI: 10.1109/Tcpmt.2018.2856882  0.375
2019 Ahadi Dolatsara M, Hejase JA, Becker WD, Swaminathan M. A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models Ieee Access. 7: 53629-53640. DOI: 10.1109/Access.2019.2908799  0.308
2019 Yu H, Chalamalasetty H, Swaminathan M. Modeling of Voltage-Controlled Oscillators Including I/O Behavior Using Augmented Neural Networks Ieee Access. 7: 38973-38982. DOI: 10.1109/Access.2019.2905136  0.383
2018 Torun HM, Swaminathan M, Davis AK, Bellaredj MLF. A Global Bayesian Optimization Algorithm and Its Application to Integrated System Design Ieee Transactions On Very Large Scale Integration Systems. 26: 792-802. DOI: 10.1109/Tvlsi.2017.2784783  0.331
2018 Pardue CA, Bellaredj MLF, Davis AK, Swaminathan M, Kohl P, Fujii T, Nakazawa S. Design and Characterization of Inductors for Self-Powered IoT Edge Devices Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 1263-1271. DOI: 10.1109/Tcpmt.2018.2803522  0.379
2018 Fu K, Zhao W, Wang G, Swaminathan M. A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D IC Ieee Microwave and Wireless Components Letters. 28: 768-770. DOI: 10.1109/Lmwc.2018.2854552  0.41
2018 Pardue CA, Davis AK, Bellaredj MLF, Amir MF, Mukhopadhyay S, Swaminathan M. Reverse Power Delivery Network for Wireless Power Transfer Ieee Microwave and Wireless Components Letters. 28: 624-626. DOI: 10.1109/Lmwc.2018.2838322  0.415
2018 Fu K, Zhao W, Wang D, Wang G, Swaminathan M, Yin W. A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs Ieee Access. 6: 75278-75292. DOI: 10.1109/Access.2018.2884036  0.397
2018 Fu K, Zhao W, Wang G, Swaminathan M. Modeling and Performance Analysis of Shielded Differential Annular Through-Silicon Via (SD-ATSV) for 3-D ICs Ieee Access. 6: 33238-33250. DOI: 10.1109/Access.2018.2846751  0.371
2018 Bellaredj MLF, Pardue CA, Kohl P, Swaminathan M. Fabrication of package embedded spiral inductors with two magnetic layers for flexible SIP point of load converters in Internet of Everything devices Microelectronic Engineering. 189: 18-27. DOI: 10.1016/J.Mee.2017.12.012  0.367
2017 Bellaredj MLF, Mueller S, Davis AK, Mano Y, Kohl PA, Swaminathan M. Fabrication, characterization and comparison of composite magnetic materials for high efficiency integrated voltage regulators with embedded magnetic core micro-inductors Journal of Physics D. 50: 455001. DOI: 10.1088/1361-6463/Aa8D11  0.312
2016 Yi M, Li S, Yu H, Khan W, Ulusoy C, Vera-Lopez A, Papapolymerou J, Swaminathan M. Surface Roughness Modeling of Substrate Integrated Waveguide in D-Band Ieee Transactions On Microwave Theory and Techniques. DOI: 10.1109/Tmtt.2016.2535290  0.369
2016 Astorino A, Swaminathan M, Antonini G. A New Approach for Magneto-Static Hysteresis Behavioral Modeling Ieee Transactions On Magnetics. 52: 1-14. DOI: 10.1109/Tmag.2016.2572660  0.373
2015 Piersanti S, Paulis Fd, Orlandi A, Swaminathan M, Ricchiuti V. Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects Ieee Transactions On Electromagnetic Compatibility. 57: 1216-1225. DOI: 10.1109/Temc.2015.2414477  0.355
2015 Xie B, Swaminathan M, Han KJ. FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2405014  0.584
2015 Park SJ, Natu N, Swaminathan M. Analysis, Design, and Prototyping of Temperature Resilient Clock Distribution Networks for 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 1669-1678. DOI: 10.1109/Tcpmt.2015.2482947  0.385
2015 Han K, Swaminathan M, Pulugurtha R, Sharma H, Tummala R, Rawlings BM, Nair V. RF Characterization of Magnetodielectric Material Using Cavity Perturbation Technique Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2465383  0.304
2015 Telikepalli S, Swaminathan M, Keezer D. A Simple Technique for Power Distribution With Better Characteristics Than Electromagnetic Bandgap Structures Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 797-805. DOI: 10.1109/Tcpmt.2015.2432837  0.441
2015 Sicard E, Jianfei W, Shen R, Li E, Liu E, Kim J, Cho J, Swaminathan M. Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I Ieee Electromagnetic Compatibility Magazine. 5: 65-74. DOI: 10.1109/Memc.2015.7407186  0.408
2014 Han KJ, Swaminathan M, Jeong J. Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2014.2372771  0.596
2014 Xie B, Swaminathan M. FDFD Modeling of Signal Paths With TSVs in Silicon Interposer Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 708-717. DOI: 10.1109/Tcpmt.2013.2297154  0.391
2014 Xie J, Swaminathan M. Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 588-601. DOI: 10.1109/Tcpmt.2013.2286403  0.332
2014 Xie J, Swaminathan M. System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 66-76. DOI: 10.1109/Tcpmt.2013.2286158  0.332
2014 Choi JY, Swaminathan M. Modeling of Power/Ground Planes Using Triangular Elements Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 291-302. DOI: 10.1109/Tcpmt.2013.2277659  0.436
2014 Raj PM, Sharma H, Reddy GP, Altunyurt N, Swaminathan M, Tummala R, Nair V. Cobalt-polymer nanocomposite dielectrics for miniaturized antennas Journal of Electronic Materials. 43: 1097-1106. DOI: 10.1007/S11664-014-3025-5  0.782
2013 Yi M, Ha M, Qian Z, Aydiner A, Swaminathan M. Skin-Effect-Incorporated Transient Simulation Using the Laguerre-FDTD Scheme Ieee Transactions On Microwave Theory and Techniques. 61: 4029-4039. DOI: 10.1109/Tmtt.2013.2287475  0.357
2013 Huh SL, Swaminathan M, Keezer D. Pseudo-balanced signaling using power transmission lines for parallel I/O links Ieee Transactions On Electromagnetic Compatibility. 55: 315-327. DOI: 10.1109/Temc.2012.2220854  0.797
2013 Goyal A, Swaminathan M, Chatterjee A. One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 236-246. DOI: 10.1109/Tcpmt.2012.2226582  0.565
2013 Orlandi A, Swaminathan M, Han KJ. Book review: Design and modeling for 3D ICs and interposers Ieee Electromagnetic Compatibility Magazine. 2: 48-49. DOI: 10.1109/Memc.2013.6714696  0.548
2013 Yang D, Xie J, Swaminathan M, Wei X, Li E. A Rigorous Model for Through-Silicon Vias With Ohmic Contact in Silicon Interposer Ieee Microwave and Wireless Components Letters. 23: 385-387. DOI: 10.1109/Lmwc.2013.2270459  0.331
2013 Xie J, Xie B, Swaminathan M. Electrical–thermal modeling of through-silicon via (TSV) arrays in interposer International Journal of Numerical Modelling-Electronic Networks Devices and Fields. 26: 545-559. DOI: 10.1002/Jnm.1859  0.342
2012 Goyal A, Swaminathan M, Chatterjee A, Howard DC, Cressler JD. A New Self-Healing Methodology for RF Amplifier Circuits Based on Oscillation Principles Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 20: 1835-1848. DOI: 10.1109/Tvlsi.2011.2163953  0.536
2012 Huh SL, Swaminathan M. A design technique for embedded electromagnetic band gap structure in load board applications Ieee Transactions On Electromagnetic Compatibility. 54: 443-456. DOI: 10.1109/Temc.2011.2162337  0.806
2012 Sankaran N, Huh S, Min S, Swaminathan M, Tummala R. Suppression of vertical electromagnetic coupling in multilayer packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 418-429. DOI: 10.1109/Tcpmt.2011.2163936  0.748
2012 Raj PM, Sharma H, Mishra D, Murali KP, Han K, Swaminathan M, Tummala RR. Nanomagnetics for High-Performance, Miniaturized Power, and RF Components [Nanopackaging] Ieee Nanotechnology Magazine. 6: 18-23. DOI: 10.1109/Mnano.2012.2203878  0.345
2011 Huh SL, Swaminathan M, Keezer D. Constant current power transmission line-based power delivery network for single-ended signaling Ieee Transactions On Electromagnetic Compatibility. 53: 1050-1064. DOI: 10.1109/Temc.2011.2159980  0.795
2011 Rao PH, Swaminathan M. A Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low Radiation Ieee Transactions On Electromagnetic Compatibility. 53: 996-1004. DOI: 10.1109/Temc.2011.2156408  0.404
2011 Choi JY, Swaminathan M. Decoupling Capacitor Placement in Power Delivery Networks Using MFEM Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1651-1661. DOI: 10.1109/Tcpmt.2011.2165954  0.396
2011 Hwang S, Min S, Swaminathan M, Sundaram V, Tummala R. Thin-Film High-Rejection Filter Integration in Low-Loss Organic Substrate Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1160-1170. DOI: 10.1109/Tcpmt.2011.2142398  0.634
2011 Bandyopadhyay T, Han KJ, Chung D, Chatterjee R, Swaminathan M, Tummala R. Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 893-903. DOI: 10.1109/Tcpmt.2011.2120607  0.703
2011 Xie J, Swaminathan M. Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 234-246. DOI: 10.1109/Tcpmt.2010.2101770  0.313
2011 Li X, Mao J, Swaminathan M. Transient Analysis of CMOS-Gate-Driven $RLGC$ Interconnects Based on FDTD Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 30: 574-583. DOI: 10.1109/Tcad.2010.2095650  0.443
2011 Swaminathan M, Sundaram V, Papapolymerou J, Raj PM. Polymers for RF apps Ieee Microwave Magazine. 12: 62-77. DOI: 10.1109/Mmm.2011.942701  0.32
2011 Sridharan V, Swaminathan M, Bandyopadhyay T. Enhancing signal and power integrity using double sided silicon interposer Ieee Microwave and Wireless Components Letters. 21: 598-600. DOI: 10.1109/Lmwc.2011.2169239  0.6
2011 Ha M, Swaminathan M. A laguerre-FDTD formulation for frequency-dependent dispersive materials Ieee Microwave and Wireless Components Letters. 21: 225-227. DOI: 10.1109/Lmwc.2011.2119296  0.618
2011 Sankaran N, Swaminathan M, Tummala R. Synthesis of electromagnetic band gap structures using stepped impedance resonators Microwave and Optical Technology Letters. 53: 2378-2382. DOI: 10.1002/Mop.26249  0.639
2010 Narayanan TV, Swaminathan M. Preconditioned Second-Order Multi-Point Passive Model Reduction for Electromagnetic Simulations Ieee Transactions On Microwave Theory and Techniques. 58: 2856-2866. DOI: 10.1109/Tmtt.2010.2078370  0.334
2010 Swaminathan M, Chung D, Grivet-Talocia S, Bharath K, Laddha V, Xie J. Designing and modeling for power integrity Ieee Transactions On Electromagnetic Compatibility. 52: 288-310. DOI: 10.1109/Temc.2010.2045382  0.728
2010 Goyal A, Swaminathan M, Chatterjee A. Low-Frequency and Low-Cost Test Methodology for Integrated RF Substrates Ieee Transactions On Advanced Packaging. 33: 669-680. DOI: 10.1109/Tadvp.2010.2052923  0.556
2010 Han KJ, Swaminathan M, Bandyopadhyay T. Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions Ieee Transactions On Advanced Packaging. 33: 804-817. DOI: 10.1109/Tadvp.2010.2050769  0.686
2010 Choi J, Govind V, Swaminathan M, Bharath K. Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN) Ieee Transactions On Advanced Packaging. 33: 2-12. DOI: 10.1109/Tadvp.2009.2033705  0.811
2010 Hwang S, Min S, Swaminathan M, Venkatakrishnan V, Chan H, Liu F, Sundaram V, Kennedy S, Baars D, Lacroix B, Li Y, Papapolymerou J. Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz Ieee Transactions On Advanced Packaging. 33: 180-188. DOI: 10.1109/Tadvp.2009.2023413  0.361
2010 Goyal A, Swaminathan M, Chatterjee A. Low-Cost Specification Based Testing of RF Amplifier Circuits using Oscillation Principles Journal of Electronic Testing. 26: 13-24. DOI: 10.1007/S10836-009-5126-2  0.567
2009 Goyal A, Swaminathan M. A low-cost test method for embedded RF passive circuits using two-tone input signals 2009 Ieee 10th Annual Wireless and Microwave Technology Conference, Wamicon 2009. DOI: 10.1109/WAMICON.2009.5207273  0.487
2009 Srinivasan K, Yadav P, Engin AE, Swaminathan M, Ha M. Fast EM/Circuit Transient Simulation Using Laguerre Equivalent Circuit (SLeEC) Ieee Transactions On Electromagnetic Compatibility. 51: 756-762. DOI: 10.1109/Temc.2009.2024158  0.746
2009 Han KJ, Swaminathan M. Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 28: 846-859. DOI: 10.1109/Tcad.2009.2016642  0.58
2009 Ha M, Srinivasan K, Swaminathan M. Transient chip-package cosimulation of multiscale structures using the laguerre-FDTD scheme Ieee Transactions On Advanced Packaging. 32: 816-830. DOI: 10.1109/Tadvp.2009.2020518  0.76
2009 Altunyurt N, Rieske R, Swaminathan M, Sundaram V. Conformal antennas on liquid crystalline polymer based rigid-flex substrates integrated with the front-end module Ieee Transactions On Advanced Packaging. 32: 797-808. DOI: 10.1109/Tadvp.2009.2020517  0.793
2009 Kim TH, Swaminathan M, Engin AE, Yang BJ. Electromagnetic Band Gap Synthesis Using Genetic Algorithms for Mixed Signal Applications Ieee Transactions On Advanced Packaging. 32: 13-25. DOI: 10.1109/Tadvp.2008.2005841  0.361
2009 Yang BJ, Swaminathan M. Simple Equivalent Circuit Model of a Stripline in Inhomogeneous Dielectric Media Ieee Microwave and Wireless Components Letters. 19: 771-773. DOI: 10.1109/Lmwc.2009.2033494  0.374
2008 Lalgudi SN, Engin E, Casinovi G, Swaminathan M. Accurate transient simulation of interconnects characterized by band-limited data with propagation delay enforcement in a modified nodal analysis framework Ieee Transactions On Electromagnetic Compatibility. 50: 715-729. DOI: 10.1109/Temc.2008.924394  0.789
2008 Lalgudi SN, Swaminathan M. Analytical stability condition of the latency insertion method for nonuniform GLC circuits Ieee Transactions On Circuits and Systems Ii: Express Briefs. 55: 937-941. DOI: 10.1109/Tcsii.2008.924378  0.795
2008 Lalgudi SN, Swaminathan M, Kretchmer Y. On-chip power-grid simulation using latency insertion method Ieee Transactions On Circuits and Systems I: Regular Papers. 55: 914-931. DOI: 10.1109/Tcsi.2008.918223  0.811
2008 Muthana P, Srinivasan K, Engin AE, Swaminathan M, Tummala R, Sundaram V, Wiedenman B, Amey DI, Dietz KH, Banerji S. Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors Ieee Transactions On Advanced Packaging. 31: 234-245. DOI: 10.1109/Tadvp.2008.920651  0.777
2008 Han KJ, Takeuchi H, Swaminathan M. Eye-pattern design for high-peed differential links using extended passive equalization Ieee Transactions On Advanced Packaging. 31: 246-257. DOI: 10.1109/Tadvp.2008.915849  0.55
2008 Goyal A, Swaminathan M. A low cost method for testing integrated RF substrates Ieee Mtt-S International Microwave Symposium Digest. 387-390. DOI: 10.1109/MWSYM.2008.4633184  0.525
2008 Goyal A, Swaminathan M. A low-cost test approach for embedded RF passive circuits 2008 Ieee 14th International Mixed-Signals, Sensors, and Systems Test Workshop, Ims3tw. DOI: 10.1109/IMS3TW.2008.4581599  0.47
2008 Goyal A, Swaminathan M. A low-cost approach for testing embedded RF Passive circuits based on oscillation principle 2008 Electrical Design of Advanced Packaging and Systems Symposium, Ieee Edaps 2008 - Proceedings. 194-197. DOI: 10.1109/EDAPS.2008.4736033  0.492
2008 Goyal A, Swaminathan M. Low-cost one-port approach for testing integrated RF substrates Proceedings of the Asian Test Symposium. 49-54. DOI: 10.1109/ATS.2008.56  0.488
2007 Kacker K, Sokol T, Yun W, Swaminathan M, Sitaraman SK. A heterogeneous array of off-chip interconnects for optimum mechanical and electrical performance Journal of Electronic Packaging, Transactions of the Asme. 129: 460-468. DOI: 10.1115/1.2804096  0.647
2007 Spencer TJ, Joseph PJ, Kim TH, Swaminathan M, Kohl PA. Air-Gap Transmission Lines on Organic Substrates for Low-Loss Interconnects Ieee Transactions On Microwave Theory and Techniques. 55: 1919-1925. DOI: 10.1109/Tmtt.2007.904326  0.365
2007 Engin AE, Bharath K, Swaminathan M. Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes Ieee Transactions On Electromagnetic Compatibility. 49: 441-447. DOI: 10.1109/Temc.2007.893331  0.711
2007 Raj PM, Balaraman D, Govind V, Abothu IR, Wan L, Gerhardt R, Swaminathan M, Tummala R. Processing and dielectric properties of nanocomposite thin film "supercapacitors" for high-frequency embedded decoupling Ieee Transactions On Components and Packaging Technologies. 30: 569-578. DOI: 10.1109/Tcapt.2007.901736  0.687
2007 Yun W, Sundaram V, Swaminathan M. High-Q embedded passives on large panel multilayer liquid crystalline polymer-based substrate Ieee Transactions On Advanced Packaging. 30: 580-591. DOI: 10.1109/Tadvp.2007.901640  0.648
2007 Muthana P, Engin AE, Swaminathan M, Tummala R, Sundaram V, Wiedenman B, Amey D, Dietz KH, Banerji S. Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package Ieee Transactions On Advanced Packaging. 30: 809-822. DOI: 10.1109/Tadvp.2007.901548  0.788
2007 Kim W, Swaminathan M. Characterization of Co-Planar Silicon Transmission Lines With and Without Slow-Wave Effect Ieee Transactions On Advanced Packaging. 30: 526-532. DOI: 10.1109/Tadvp.2007.898623  0.468
2007 Choi J, Kam DG, Chung D, Srinivasan K, Govind V, Kim J, Swaminathan M. Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications Ieee Transactions On Advanced Packaging. 30: 180-190. DOI: 10.1109/Tadvp.2007.896921  0.8
2007 Swaminathan M, Engin AE. Modeling of signal and power integrity in system on package applications Ieee International Symposium On Electromagnetic Compatibility. DOI: 10.1109/ISEMC.2007.189  0.355
2006 Bavisi A, Dalmia S, Swaminathan M, White G, Sundaram V. Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate Ieee Transactions On Advanced Packaging. 29: 390-402. DOI: 10.1109/Tadvp.2005.853550  0.791
2006 Mutnury B, Swaminathan M, Libous JP. Macromodeling of nonlinear digital I/O drivers Ieee Transactions On Advanced Packaging. 29: 102-113. DOI: 10.1109/Tadvp.2005.848396  0.714
2006 Toyota Y, Engin AE, Kim TH, Swaminathan M. Stopband Analysis Using Dispersion Diagram for Two-Dimensional Electromagnetic Bandgap Structures in Printed Circuit Boards Ieee Microwave and Wireless Components Letters. 16: 645-647. DOI: 10.1109/Lmwc.2006.885587  0.408
2006 Bavisi A, Swaminathan M, Sundaram V, Dalmia S, White G. A novel miniaturized feedback LC oscillator for UMTS-type applications in 3D stacked liquid crystalline polymer technology International Journal of Rf and Microwave Computer-Aided Engineering. 16: 227-237. DOI: 10.1002/Mmce.20146  0.788
2005 Choi J, Swaminathan M, Do N, Master R. Modeling of power supply noise in large chips using the circuit-based finite-difference time-domain method Ieee Transactions On Electromagnetic Compatibility. 47: 424-439. DOI: 10.1109/Temc.2005.851719  0.461
2005 Kim W, Swaminathan M. Simulation of lossy package transmission lines using extracted data from one-port TDR measurements and nonphysical RLGC models Ieee Transactions On Advanced Packaging. 28: 736-744. DOI: 10.1109/Tadvp.2005.849563  0.462
2004 Min S, Swaminathan M. Construction of broadband passive macromodels from frequency data for simulation of distributed interconnect networks Ieee Transactions On Electromagnetic Compatibility. 46: 544-558. DOI: 10.1109/Temc.2004.837683  0.382
2004 Swaminathan M, Kim J, Novak I, Libous JP. Power distribution networks for system-on-package: status and challenges Ieee Transactions On Advanced Packaging. 27: 286-300. DOI: 10.1109/Tadvp.2004.831897  0.385
2004 Matoglu E, Pham N, de Araujo DN, Cases M, Swaminathan M. Statistical signal integrity analysis and diagnosis methodology for high-speed systems Ieee Transactions On Advanced Packaging. 27: 611-629. DOI: 10.1109/Tadvp.2004.831856  0.726
2004 Tummala RR, Swaminathan M, Tentzeris MM, Laskar J, Chang G, Sitaraman S, Keezer D, Guidotti D, Huang Z, Lim K, Wan L, Bhattacharya SK, Sundaram V, Liu F, Raj PM. The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade Ieee Transactions On Advanced Packaging. 27: 250-267. DOI: 10.1109/Tadvp.2004.830353  0.422
2004 Tay AAO, Iyer MK, Tummala RR, Kripesh V, Wong EH, Swaminathan M, Wong CP, Rotaru MD, Doraiswami R, Ang SS, Kang ET. Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package Ieee Transactions On Advanced Packaging. 27: 413-425. DOI: 10.1109/Tadvp.2004.830351  0.347
2004 Balaraman D, Raj PM, Wan L, Abothu IR, Bhattacharya S, Dalmia S, Lance MJ, Swaminathan M, Sacks MD, Tummala RR. BaTiO3 films by low-temperature hydrothermal techniques for next generation packaging applications Journal of Electroceramics. 13: 95-100. DOI: 10.1007/S10832-004-5082-2  0.754
2003 Choi J, Min S, Kim J, Swaminathan M, Beyene W, Yuan X. Modeling and analysis of power distribution networks for Gigabit applications Ieee Transactions On Mobile Computing. 2: 299-313. DOI: 10.1109/Tmc.2003.1255645  0.751
2003 Pannala S, Swaminathan M. Extraction of S-parameters from time domain reflectometry and transmission measurements using rational functions International Journal of Rf and Microwave Computer-Aided Engineering. 13: 74-85. DOI: 10.1002/Mmce.10064  0.348
2002 Na N, Choi J, Swaminathan M, Libous JP, O'Connor DP. Modeling and simulation of core switching noise for ASICs Ieee Transactions On Advanced Packaging. 25: 4-11. DOI: 10.1109/Tadvp.2002.1017678  0.735
2001 Sundaram V, Dalmia S, Hobbs J, Bhattacharya S, Swaminathan M, White G, Tummala R. Recent Advances in SOP Integration The Japan Society of Applied Physics. 2001: 50-52. DOI: 10.7567/Ssdm.2001.B-2-1  0.754
2001 Kim J, Swaminathan M. Modeling of irregular shaped power distribution planes using transmission matrix method Ieee Transactions On Advanced Packaging. 24: 334-346. DOI: 10.1109/6040.938301  0.434
2001 Mao J, Srinivasan J, Choi J, Swaminathan M, Do N. Modeling of field penetration through planes in multilayered packages Ieee Transactions On Advanced Packaging. 24: 326-333. DOI: 10.1109/6040.938300  0.702
2000 Na N, Choi J, Chun S, Swaminathan M, Srinivasan J. Modeling and transient simulation of planes in electronic packages Ieee Transactions On Advanced Packaging. 23: 340-352. DOI: 10.1109/6040.861546  0.794
1999 Pannala S, Haridass A, Swaminathan M. Parameter extraction and electrical characterization of high density connector using time domain measurements Ieee Transactions On Advanced Packaging. 22: 32-39. DOI: 10.1109/6040.746540  0.319
1998 Choi KL, Na N, Swaminathan M. Characterization of embedded passives using macromodels in LTCC technology Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 21: 258-268. DOI: 10.1109/96.704936  0.637
1997 Kim B, Swaminathan M, Chatterjee A, Schimmel D. A novel test technique for MCM substrates Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 20: 2-12. DOI: 10.1109/96.554413  0.32
1996 Bathey K, Swaminathan M, Smith LD, Cockerill TJ. Noise computation in single chip packages Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 19: 350-360. DOI: 10.1109/96.496039  0.37
1995 Sarfaraz A, Swaminathan M, Crocker J, Bhatia H, Nealon M. Electrical design of an MCM package for a multi-processor digital system Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 18: 127-143. DOI: 10.1109/96.365499  0.418
1995 Roy T, Sarkar TK, Swaminathan M. Surface integral formulation for calculating conductor and dielectric losses of various transmission structures Ieee Transactions On Microwave Theory and Techniques. 43: 176-185. DOI: 10.1109/22.362993  0.518
1995 Swaminathan M, Sarkar TK. A survey of various computer architectures for solution of large matrix equations International Journal of Numerical Modelling-Electronic Networks Devices and Fields. 8: 153-168. DOI: 10.1002/Jnm.1660080303  0.469
1994 Deutsch A, Swaminathan M, Ree M-, Surovic CW, Arjavalingam G, Prasad K, McHerron DC, McAllister M, Kopcsay GV, Giri AP, Perfecto E, White GE. Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 17: 486-492. DOI: 10.1109/96.338713  0.349
1994 Petre P, Swaminathan M, Zombory L, Sarkar TK, Jose KA. Volume/surface formulation for analyzing scattering from coated periodic strips Ieee Transactions On Antennas and Propagation. 42: 119-122. DOI: 10.1109/8.272312  0.466
1993 Petre P, Swaminathan M, Veszely G, Sarkar TK. Integral equation solution for analyzing scattering from one-dimensional periodic coated strips Ieee Transactions On Antennas and Propagation. 41: 1069-1080. DOI: 10.1109/8.244648  0.48
1993 Swaminathan M, Sarkar TK, Petre P. Computation of hybrid modes in waveguides based on a surface integral formulation International Journal of Microwave and Millimeter-Wave Computer-Aided Engineering. 3: 287-311. DOI: 10.1002/Mmce.4570030315  0.52
1992 Swaminathan M, Sarkar TK, Adams AT. Computation of TM and TE Modes in Waveguides Based on a Surface Integral Formulation Ieee Transactions On Microwave Theory and Techniques. 40: 285-297. DOI: 10.1109/22.120101  0.497
1990 Mrozowski M, Okoniewski M, Swaminathan M, Arvas E, Sarkar TK, Djordjevic AR. Comments on "Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation" [with reply] Ieee Transactions On Microwave Theory and Techniques. 38: 1761-1762. DOI: 10.1109/22.60030  0.477
1990 Swaminathan M, Arvas E, Sarkar TK, Djordjevic AR. Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation Ieee Transactions On Microwave Theory and Techniques. 38: 154-159. DOI: 10.1109/22.46425  0.467
1989 Swaminathan M, Sarkar TK. Parallel computation of electromagnetic scattering from arbitrary structures Ieee Transactions On Magnetics. 25: 2890-2891. DOI: 10.1109/20.34315  0.494
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