| Year |
Citation |
Score |
| 2016 |
Boehme L, Landau U. Rapid screening of plating additives for bottom-up metallization of nano-scale features Journal of Applied Electrochemistry. 46: 39-46. DOI: 10.1007/S10800-015-0873-5 |
0.364 |
|
| 2013 |
Joi A, Akolkar R, Landau U. Additives for bottom-up copper plating from an alkaline complexed electrolyte Journal of the Electrochemical Society. 160. DOI: 10.1149/2.001312Jes |
0.641 |
|
| 2013 |
Joi A, Akolkar R, Landau U. Pulse plating of copper germanide Applied Physics Letters. 102. DOI: 10.1063/1.4801470 |
0.656 |
|
| 2011 |
Adolf J, Landau U. Predictive analytical fill model of interconnect metallization providing optimal additives concentrations Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3593038 |
0.326 |
|
| 2010 |
Agarwal AS, Landau U, Payer JH. Modeling the current distribution in thin electrolyte films with applications to crevice corrosion Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3250868 |
0.477 |
|
| 2009 |
Mendez J, Akolkar R, Landau U. Polyether suppressors enabling copper metallization of high aspect ratio interconnects Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3211849 |
0.629 |
|
| 2009 |
Akolkar R, Landau U. Mechanistic analysis of the bottom-up fill in copper interconnect metallization Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3156640 |
0.654 |
|
| 2009 |
Adolf JD, Akolkar R, Landau U. Novel high molecular weight levelers extending gap fill to smaller features Ecs Transactions. 16: 1-10. DOI: 10.1149/1.3115644 |
0.607 |
|
| 2008 |
Sporer RW, Landau U, Kuo HHH, Wang YM. A process for etching modulated profiles Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2956135 |
0.304 |
|
| 2008 |
Agarwal AS, Landau U, Payer JH. Modeling particulates effects on the cathode current capacity in crevice corrosion Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2890418 |
0.451 |
|
| 2008 |
Agarwal AS, Landau U, Payer JH. Current distribution on a cathode covered by a thin film electrolyte in crevice corrosion - An analytical model Ecs Transactions. 11: 11-31. DOI: 10.1149/1.2888472 |
0.37 |
|
| 2008 |
Mendez J, Akolkar R, Andryushchenko T, Landau U. A mechanistic model for copper electropolishing in phosphoric acid Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2801396 |
0.682 |
|
| 2006 |
Purushothaman BK, Landau U. Rapid charging of lithium-ion batteries using pulsed currents Journal of the Electrochemical Society. 153: A533-A542. DOI: 10.1149/1.2161580 |
0.327 |
|
| 2005 |
Purushothaman BK, Morrison PW, Landau U. Reducing mass-transport limitations by application of special pulsed current modes Journal of the Electrochemical Society. 152: J33-J39. DOI: 10.1149/1.1861172 |
0.339 |
|
| 2004 |
Akolkar R, Landau U. A time-dependent transport-kinetics model for additive interactions in copper interconnect metallization Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1799431 |
0.642 |
|
| 2004 |
Akolkar R, Landau U, Kuo H, Wang YM. Modeling of the current distribution in aluminum anodization Journal of Applied Electrochemistry. 34: 807-813. DOI: 10.1023/B:Jach.0000035611.87036.36 |
0.688 |
|
| 2004 |
Fulop T, Bekele C, Landau U, Angus J, Kash K. Electrodeposition of polycrystalline InSb from aqueous electrolytes Thin Solid Films. 449: 1-5. DOI: 10.1016/S0040-6090(03)01383-X |
0.559 |
|
| 2004 |
Akolkar R, Landau U. Analysis of the 'bottom-up' fill during copper metallization of semiconductor interconnects Proceedings - Electrochemical Society. 117-131. |
0.621 |
|
| 1999 |
Martin HB, Smith BA, Angus JC, Landau U, Anderson AB. Boron-doped diamond films for electrochemical applications Materials Research Society Symposium - Proceedings. 555: 217-226. DOI: 10.1557/Proc-555-217 |
0.737 |
|
| 1999 |
Martin HB, Argoitia A, Angus JC, Landau U. Voltammetry studies of single-crystal and polycrystalline diamond electrodes Journal of the Electrochemical Society. 146: 2959-2964. DOI: 10.1149/1.1392035 |
0.742 |
|
| 1999 |
Angus JC, Martin HB, Landau U, Evstefeeva YE, Miller B, Vinokur N. Conducting Diamond Electrodes: Applications in Electrochemistry New Diamond and Frontier Carbon Technology. 9: 175-187. |
0.684 |
|
| 1996 |
Argoitia A, Martin HB, Rozak EJ, Landau U, Angus JC. Electrochemical studies of boron-doped diamond electrodes Materials Research Society Symposium - Proceedings. 416: 349-354. DOI: 10.1557/Proc-416-349 |
0.746 |
|
| 1996 |
Martin HB, Argoitia A, Landau U, Anderson AB, Angus JC. Hydrogen and oxygen evolution on boron-doped diamond electrodes Journal of the Electrochemical Society. 143. DOI: 10.1149/1.1836901 |
0.737 |
|
| 1995 |
Weng D, Landau U. Direct Electroplating on Nonconductors Journal of the Electrochemical Society. 142: 2598-2604. DOI: 10.1149/1.2050060 |
0.33 |
|
| 1994 |
Savinell R, Yeager E, Tryk D, Landau U, Wainright J, Weng D, Lux K, Litt M, Rogers C. Polymer electrolyte for operation at temperatures up to 200°C Journal of the Electrochemical Society. 141: L46-L48. DOI: 10.1149/1.2054875 |
0.302 |
|
| 1992 |
Yang MC, Landau U, Angus JC. Electrodeposition of GaAs from Aqueous Electrolytes Journal of the Electrochemical Society. 139: 3480-3488. DOI: 10.1149/1.2069103 |
0.64 |
|
| 1991 |
Lanzi O, Landau U. Effect of Sinter Fracture and Ohmic Resistance on Capacity Retention in the Nickel Oxide Electrode Journal of the Electrochemical Society. 138: 2527-2538. DOI: 10.1149/1.2086012 |
0.437 |
|
| 1991 |
Zeller RL, Landau U. Electrodeposition of Ductile Ni-P Amorphous Alloys Using Periodic-Reverse Current Journal of the Electrochemical Society. 138: 1010-1017. DOI: 10.1149/1.2085707 |
0.334 |
|
| 1990 |
Lanzi O, Landau U. Terminal Effect at a Resistive Electrode under Tafel Kinetics Journal of the Electrochemical Society. 137: 1139-1143. DOI: 10.1149/1.2086616 |
0.441 |
|
| 1990 |
Roha D, Landau U. Mass Transport of Leveling Agents in Plating: Steady-State Model for Blocking Additives Journal of the Electrochemical Society. 137: 824-834. DOI: 10.1149/1.2086563 |
0.373 |
|
| 1990 |
Lanzi O, Landau U. Effect of Pore Structure on Current and Potential Distributions in a Porous Electrode Journal of the Electrochemical Society. 137: 585-593. DOI: 10.1149/1.2086511 |
0.432 |
|
| 1990 |
Menon MM, Landau U. Modeling of Cells with Multiple Electrode Reactions Thickness and Composition Variations in Alloy Plating Journal of the Electrochemical Society. 137: 445-452. DOI: 10.1149/1.2086460 |
0.424 |
|
| 1989 |
Lanzi OL, Reid JD, Landau U, Galasco RT. Effect of Local Kinetic Variations on Through-Hole Plating Journal of the Electrochemical Society. 136: 368-374. DOI: 10.1149/1.2096637 |
0.347 |
|
| 1988 |
Lanzi O, Landau U. Analysis of Mass Transport and Ohmic Limitations in Through-Hole Plating Journal of the Electrochemical Society. 135: 1922-1930. DOI: 10.1149/1.2096180 |
0.398 |
|
| 1988 |
Landau U, Weinberg NL, Gileadi E. THREE-ELECTRODE MEASUREMENTS IN INDUSTRIAL CELLS Journal of the Electrochemical Society. 135: 396-403. DOI: 10.1149/1.2095623 |
0.354 |
|
| 1987 |
Menon MM, Landau U. Modeling of Electrochemical Cells Including Diffusion, Migration, and Unsteady-State Effects Journal of the Electrochemical Society. 134: 2248-2253. DOI: 10.1149/1.2100860 |
0.391 |
|
| 1986 |
Angus JC, Landau U, Liao SH, Yang MC. Controlled Electroplating through Gelatin Films Journal of the Electrochemical Society. 133: 1152-1160. DOI: 10.1002/Chin.198640334 |
0.622 |
|
| 1983 |
Landau U, Shyu JH. ROUGHNESS EVOLUTION AND DENDRITIC GROWTH IN ZINC ELECTRODEPOSITION FROM HALIDE ELECTROLYTES Electric Power Research Institute (Report) Epri Em. |
0.32 |
|
| 1982 |
Landau U, Cahan BD, Oren Y, Shyu JH, Chen CT, Selman JR, Lee J, Gopikanth ML, Symons PC. ZINC ELECTRODEPOSITION AND DENDRITIC GROWTH FROM ZINC HALIDE ELECTROLYTES Electric Power Research Institute (Report) Epri Em. |
0.346 |
|
| 1980 |
Gregory TD, Feke DL, Angus JC, Brosilow CB, Landau U. Electrolysis of liquid hydrogen sulphide Journal of Applied Electrochemistry. 10: 405-408. DOI: 10.1007/Bf00617216 |
0.576 |
|
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