Kyuchul Chong, Ph.D. - Publications
Affiliations: | 2005 | University of California, Los Angeles, Los Angeles, CA |
Area:
Materials Science Engineering, Electronics and Electrical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2011 | Zhang X, Xu C, Chong K, Tu KN, Xie YH. Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits. Materials (Basel, Switzerland). 4: 952-962. PMID 28879960 DOI: 10.3390/Ma4060952 | 0.592 | |||
2005 | Chong K, Zhang X, Tu K, Huang D, Chang M, Xie Y. Three-Dimensional Substrate Impedance Engineering Based on<tex>$hbox p ^-$</tex>/<tex>$hbox p ^+$</tex>Si Substrate for Mixed-Signal System-on-Chip (SoC) Ieee Transactions On Electron Devices. 52: 2440-2446. DOI: 10.1109/Ted.2005.857190 | 0.613 | |||
2005 | Chong K, Xie YH. Low capacitance and high isolation bond pad for high-frequency RFICs Ieee Electron Device Letters. 26: 746-748. DOI: 10.1109/Led.2005.854399 | 0.539 | |||
2005 | Chong K, Xie YH. High-performance on-chip transformers Ieee Electron Device Letters. 26: 557-559. DOI: 10.1109/Led.2005.851817 | 0.537 | |||
2005 | Chong K, Xie Y, Yu K, Huang D, Chang M-F. High-performance inductors integrated on porous silicon Ieee Electron Device Letters. 26: 93-95. DOI: 10.1109/Led.2004.840546 | 0.552 | |||
2003 | Kim HS, Chong K, Xie YH, Jenkins KA. The Importance of Distributed Grounding in Combination with Porous Si Trenches for the Reduction of RF Crosstalk Through p- Si Substrate Ieee Electron Device Letters. 24: 640-642. DOI: 10.1109/Led.2003.818071 | 0.597 | |||
2003 | Kim H, Chong K, Xie Y. Study of the cross-sectional profile in selective formation of porous silicon Applied Physics Letters. 83: 2710-2712. DOI: 10.1063/1.1613995 | 0.566 | |||
2003 | Kim H, Chong K, Xie Y. The promising role of porous Si in mixed-signal integrated circuit technology Physica Status Solidi (a). 197: 269-274. DOI: 10.1002/Pssa.200306514 | 0.581 | |||
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