Bowen Cheng, Ph.D. - Publications
Affiliations: | 2011 | University of Washington, Seattle, Seattle, WA |
Area:
Electronics and Electrical EngineeringYear | Citation | Score | |||
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2013 | Cheng B, De Bruyker D, Chua C, Sahasrabuddhe K, Shubin I, Cunningham JE, Luo Y, Bohringer KF, Krishnamoorthy AV, Chow EM. Microspring characterization and flip-chip assembly reliability Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 187-196. DOI: 10.1109/Tcpmt.2012.2213250 | 0.501 | |||
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