| Year |
Citation |
Score |
| 2020 |
Ross N, Asokan M, Kumar GIA, Caperton J, Alptekin J, Salunke AS, Chyan OM. Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments Microelectronics Reliability. 113: 113917. DOI: 10.1016/J.Microrel.2020.113917 |
0.47 |
|
| 2018 |
Lambert A, Issac G, Salunke A, Lu L, Chyan O. Optimization of Cupric Chloride Subtractive Etching for Cu High Density Interconnects International Symposium On Microelectronics. 2018: 000640-000646. DOI: 10.4071/2380-4505-2018.1.000640 |
0.339 |
|
| 2017 |
Lambert A, Asokan M, Issac G, Love C, Chyan O. Thin-film UV–vis spectroscopy as a chemically-sensitive monitoring tool for copper etching bath Journal of Industrial and Engineering Chemistry. 51: 44-48. DOI: 10.1016/J.Jiec.2017.03.004 |
0.437 |
|
| 2016 |
Yu KKH, Rimal S, Asokan M, Nalla PR, Koskey S, Pillai KSM, Chyan O, Singh KJ, Suri S. Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application Electrochimica Acta. 210: 512-519. DOI: 10.1016/J.Electacta.2016.05.189 |
0.755 |
|
| 2015 |
Mukherjee T, Berhe SA, Goswami A, Chyan O, Singh KJ, Brown I. UV-assisted modification and removal mechanism of a fluorocarbon polymer film on low-k dielectric trench structure. Acs Applied Materials & Interfaces. 7: 5051-5. PMID 25679964 DOI: 10.1021/Am508734B |
0.343 |
|
| 2014 |
Rimal S, Mukherjee T, Abdelghani J, Goswami A, Chyan O, Stillahn J, Chiba Y, Maekawa K. Erratum: Evaluation of Plasma Damage to Low-k Dielectric Trench Structures by Multiple Internal Reflection Infrared Spectroscopy [ECS Solid State Lett., 3, N1 (2014)] Ecs Solid State Letters. 3: X1-X1. DOI: 10.1149/2.009404Ssl |
0.742 |
|
| 2014 |
Rimal S, Mukherjee T, Abdelghani J, Goswami A, Chyan O, Stillahn J, Chiba Y, Maekawa K. Evaluation of plasma damage to low-k dielectric trench structures by multiple internal reflection infrared spectroscopy Ecs Solid State Letters. 3: N1-N4. DOI: 10.1149/2.001403Ssl |
0.768 |
|
| 2014 |
Goswami A, Koskey S, Mukherjee T, Chyan O. Study of pyrazole as copper corrosion inhibitor in alkaline post chemical mechanical polishing cleaning solution Ecs Journal of Solid State Science and Technology. 3: P293-P297. DOI: 10.1149/2.0011410Jss |
0.805 |
|
| 2013 |
Ross N, Shrestha K, Chyan O, Littler CL, Lopes VC, Syllaios AJ. Characterization of boron doped amorphous silicon films by multiple internal reflection infrared spectroscopy Materials Research Society Symposium Proceedings. 1536: 127-132. DOI: 10.1557/Opl.2013.752 |
0.305 |
|
| 2013 |
Mukherjee T, Rimal S, Koskey S, Chyan O, Singh KJ, Myers AM. Bonding structure of model fluorocarbon polymer residue determined by functional group specific chemical derivatization Ecs Solid State Letters. 2: N11-N14. DOI: 10.1149/2.008303Ssl |
0.758 |
|
| 2011 |
Yu KK, Thomas N, Venkataraman SS, Pillai KSM, Hurd TQ, Boggs K, Chyan O. Study of Cu bimetallic corrosion in CMP chemical environments using optical scanning and micropattern corrosion screening Ecs Transactions. 35: 173-184. DOI: 10.1149/1.3567749 |
0.803 |
|
| 2010 |
Basilio AM, Hsu YK, Tu WH, Yen CH, Hsu GM, Chyan O, Chyan Y, Hwang JS, Chen YT, Chen LC, Chen KH. Enhancement of the energy photoconversion efficiency through crystallographic etching of a c-plane GaN thin film Journal of Materials Chemistry. 20: 8118-8125. DOI: 10.1039/C0Jm00704H |
0.324 |
|
| 2010 |
Yu KKH, Pillai KSM, Nalla PR, Chyan O. Study of bimetallic corrosion related to Cu interconnects using micropattern corrosion screening method and Tafel plots Journal of Applied Electrochemistry. 40: 143-149. DOI: 10.1007/S10800-009-9990-3 |
0.816 |
|
| 2007 |
Fang W, Chyan O, Sun C, Wu C, Chen C, Chen K, Chen L, Huang J. Arrayed CNx NT-RuO2 nanocomposites directly grown on Ti-buffered Si substrate for supercapacitor applications Electrochemistry Communications. 9: 239-244. DOI: 10.1016/J.Elecom.2006.09.001 |
0.351 |
|
| 2006 |
Fang W, Sun C, Huang J, Chen L, Chyan O, Chen K, Papakonstantinou P. Enhanced Electrochemical Properties of Arrayed CN[sub x] Nanotubes Directly Grown on Ti-Buffered Silicon Substrates Electrochemical and Solid-State Letters. 9: A175. DOI: 10.1149/1.2166507 |
0.342 |
|
| 2005 |
Arunagiri TN, Zhang Y, Chyan O, Kim MJ, Hurd TQ. Interfacial diffusion studies of Cu/(5 nm Ru)/Si structures physical vapor deposited vs electrochemically deposited Cu Journal of the Electrochemical Society. 152. DOI: 10.1149/1.2039939 |
0.811 |
|
| 2005 |
Arunagiri TN, Zhang Y, Chyan O, El-Bouanani M, Kim MJ, Chen KH, Wu CT, Chen LC. 5 nm ruthenium thin film as a directly plateable copper diffusion barrier Applied Physics Letters. 86: 1-3. DOI: 10.1063/1.1867560 |
0.82 |
|
| 2005 |
Nalla P, Huang SH, Zhang Y, Chyan O, Richmond MG, Bouanani ME. Photochemically induced metallization of surface silicon using dinuclear metal carbonyl compounds. Anchoring of ruthenium to a Si(111) surface through covalent Ru-Si bond formation Chemistry of Materials. 17: 5951-5956. DOI: 10.1021/Cm0506757 |
0.754 |
|
| 2005 |
Sun C, Chen L, Su M, Hong L, Chyan O, Hsu C, Chen K, Chang T, Chang L. Ultrafine Platinum Nanoparticles Uniformly Dispersed on Arrayed CNx Nanotubes with High Electrochemical Activity Chemistry of Materials. 17: 3749-3753. DOI: 10.1021/Cm050107R |
0.367 |
|
| 2005 |
Arunagiri T, Golden TD, Chyan O. Study of palladium metal particle deposition on the conductive diamond surface by XRD, XPS and electrochemistry Materials Chemistry and Physics. 92: 152-158. DOI: 10.1016/J.Matchemphys.2005.01.005 |
0.753 |
|
| 2004 |
Zhang Y, Huang L, Arunagiri TN, Ojeda O, Flores S, Chyan O, Wallace RM. Underpotential deposition of copper on electrochemically prepared conductive ruthenium oxide surface Electrochemical and Solid-State Letters. 7. DOI: 10.1149/1.1784051 |
0.831 |
|
| 2004 |
Chan R, Arunagiri TN, Zhang Y, Chyan O, Wallace RM, Kim MJ, Hurd TQ. Diffusion studies of copper on ruthenium thin film a plateable copper diffusion barrier Electrochemical and Solid-State Letters. 7. DOI: 10.1149/1.1757113 |
0.797 |
|
| 2003 |
Cheng C, Arunagiri T, Chyan O. Electrodeposition of Silver and Copper/Silver Multilayer on Ruthenium Substrate as a Potential New Metal Interconnect for Integrated Circuits Volume 2, Issue 1. 2. DOI: 10.33697/ajur.2003.010 |
0.366 |
|
| 2003 |
Chyan O, Arunagiri TN, Ponnuswamy T. Electrodeposition of copper thin on ruthenium. A potential diffusion barrier for Cu interconnects Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1565138 |
0.78 |
|
| 2002 |
Ponnuswamy T, Chyan O. Detection of Ni2+ by a dimethylglyoxime probe using attenuated total-reflection infrared spectroscopy. Analytical Sciences : the International Journal of the Japan Society For Analytical Chemistry. 18: 449-53. PMID 11999521 DOI: 10.2116/Analsci.18.449 |
0.774 |
|
| 2001 |
Ponnuswamy T, Chen JJ, Xu F, Chyan O. Monitoring metal ion contamination onset in hydrofluoric acid using silicon-diamond and dual silicon sensing electrode assembly. The Analyst. 126: 877-80. PMID 11445955 DOI: 10.1039/B009841H |
0.745 |
|
| 2000 |
Gao J, Arunagiri T, Chen J, Goodwill P, Chyan O, Perez J, Golden D. Preparation and Characterization of Metal Nanoparticles on a Diamond Surface Chemistry of Materials. 12: 3495-3500. DOI: 10.1021/Cm000465O |
0.789 |
|
| 1996 |
Chyan O, Chen J, Wu J, Chien S, Liu M. Discrete Metal Deposition on Hydrogen Terminated Silicon Surfaces: Kinetics, Morphologies and Sensor Applications Mrs Proceedings. 451. DOI: 10.1557/PROC-451-267 |
0.381 |
|
| 1995 |
Chyan O, Chen J, Liu M, Richmond MG, Yang K. High Surface Area Electrode Materials by Derect Metallization of Porous Substrates Mrs Proceedings. 393. DOI: 10.1557/Proc-393-265 |
0.357 |
|
| 1987 |
Jones ETT, Chyan OM, Wrighton MS. Preparation and Characterization of Molecule-Based Transistors with a 50 Nanometer Source-Drain Separation Using Shadow Deposition Techniques: Towards Faster, More Sensitive Molecule-Based Devices. Journal of the American Chemical Society. 109: 5526-5528. DOI: 10.1021/Ja00252A039 |
0.517 |
|
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