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Michael W. Lane, Ph.D. - Publications

Affiliations: 
2000 Stanford University, Palo Alto, CA 
Area:
Materials Science Engineering
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30 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Kwan M, Braccini M, Jain A, Lane MW, Ramanath G. Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface Scripta Materialia. 121: 42-44. DOI: 10.1016/J.Scriptamat.2016.04.034  0.367
2013 Chow PK, Cardona Quintero Y, O'Brien P, Hubert Mutin P, Lane M, Ramprasad R, Ramanath G. Gold-titania interface toughening and thermal conductance enhancement using an organophosphonate nanolayer Applied Physics Letters. 102. DOI: 10.1063/1.4807436  0.435
2011 Jain A, Singh B, Garg S, Ravishankar N, Lane M, Ramanath G. Atomistic fracture energy partitioning at a metal-ceramic interface using a nanomolecular monolayer Physical Review B - Condensed Matter and Materials Physics. 83. DOI: 10.1103/Physrevb.83.035412  0.429
2011 Vijayashankar D, Zhu H, Garg S, Teki R, Ramprasad R, Lane MW, Ramanath G. Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces Applied Physics Letters. 99. DOI: 10.1063/1.3622304  0.462
2011 Garg S, Teki R, Lane MW, Ramanath G. Factorial toughening at microcorrugated metal-ceramic interfaces Applied Physics Letters. 99. DOI: 10.1063/1.3618670  0.473
2010 Garg S, Jain A, Karthik C, Singh B, Teki R, Smentkowski VS, Lane MW, Ramanath G. Metal-dielectric interface toughening by molecular nanolayer decomposition Journal of Applied Physics. 108. DOI: 10.1063/1.3437648  0.459
2010 Garg S, Singh B, Teki R, Lane MW, Ramanath G. Hydrophobic fluoroalkylsilane nanolayers for inhibiting copper diffusion into silica Applied Physics Letters. 96. DOI: 10.1063/1.3374453  0.338
2009 Gandhi DD, Singh B, Singh AP, Moore R, Simonyi E, Lane MW, Ramanath G. Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper Journal of Applied Physics. 106. DOI: 10.1063/1.3183933  0.444
2009 Singh AP, Gandhi DD, Singh B, Simonyi E, Liniger EG, Nitta SV, Lane MW, Ramanath G. Pore orientation and silylation effects on mesoporous silica film properties Applied Physics Letters. 94. DOI: 10.1063/1.3081388  0.354
2008 Grill A, Edelstein D, Lane M, Patel V, Gates S, Restaino D, Molis S. Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps Journal of Applied Physics. 103. DOI: 10.1063/1.2844483  0.423
2007 Gandhi DD, Lane M, Zhou Y, Singh AP, Nayak S, Tisch U, Eizenberg M, Ramanath G. Annealing-induced interfacial toughening using a molecular nanolayer. Nature. 447: 299-302. PMID 17507979 DOI: 10.1038/Nature05826  0.452
2007 Gandhi DD, Singh AP, Lane M, Eizenberg M, Ramanath G. Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers Journal of Applied Physics. 101: 84505. DOI: 10.1063/1.2717135  0.403
2007 Liu XH, Lane MW, Shaw TM, Simonyi E. Delamination in patterned films International Journal of Solids and Structures. 44: 1706-1718. DOI: 10.1016/J.Ijsolstr.2006.07.023  0.385
2006 Simonyi E, Lane M, Liniger E, Grill A. Comparison of the Fracture Behavior of Brittle ILD Films used in the BEOL in Dry and Wet Environment using Nanoindentation Mrs Proceedings. 914. DOI: 10.1557/Proc-0914-F04-11  0.353
2005 Ganesan PG, Cui G, Vijayamohanan K, Lane M, Ramanath G. Effects of amine- and pyridine-terminated molecular nanolayers on adhesion at Cu–SiO2 interfaces Journal of Vacuum Science & Technology B. 23: 327-331. DOI: 10.1116/1.1856467  0.382
2005 Lloyd JR, Lane MW, Liniger EG, Hu CK, Shaw TM, Rosenberg R. Electromigration and adhesion Ieee Transactions On Device and Materials Reliability. 5: 113-118. DOI: 10.1109/Tdmr.2005.846308  0.319
2004 Lane MW, Liu XH, Shaw TM. Environmental effects on cracking and delamination of dielectric films Ieee Transactions On Device and Materials Reliability. 4: 142-147. DOI: 10.1109/Tdmr.2004.829123  0.446
2003 Lane MW, Murray CE, McFeely FR, Vereecken PM, Rosenberg R. Liner materials for direct electrodeposition of Cu Applied Physics Letters. 83: 2330-2332. DOI: 10.1063/1.1610256  0.363
2003 Ramanath G, Cui G, Ganesan PG, Guo X, Ellis AV, Stukowski M, Vijayamohanan K, Doppelt P, Lane M. Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits Applied Physics Letters. 83: 383-385. DOI: 10.1063/1.1591232  0.365
2003 Lane MW, Liniger EG, Lloyd JR. Relationship between interfacial adhesion and electromigration in Cu metallization Journal of Applied Physics. 93: 1417-1421. DOI: 10.1063/1.1532942  0.389
2001 Cui G, Lane M, Vijayamohanan K, Ramanath G. Interfacial Adhesion of Cu to Self-Assembled Monolayers on SiO 2 Mrs Proceedings. 695. DOI: 10.1557/Proc-695-L7.7.1  0.323
2001 Lane MW, Snodgrass JM, Dauskardt RH. Environmental Effects on Interfacial Adhesion Microelectronics Reliability. 41: 1615-1624. DOI: 10.1016/S0026-2714(01)00150-0  0.613
2001 Lane MW, Snodgrass JM, Dauskardt RH. Invited paper environmental effects on interfacial adhesion Microelectronics Reliability. 41: 1615-1624.  0.651
2000 Lane M, Dauskardt RH, Vainchtein A, Gao H. Plasticity contributions to interface adhesion in thin-film interconnect structures Journal of Materials Research. 15: 2758-2769. DOI: 10.1557/Jmr.2000.0395  0.6
2000 Lane M, Dauskardt RH, Krishna N, Hashim I. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers Journal of Materials Research. 15: 203-211. DOI: 10.1557/Jmr.2000.0033  0.577
1999 Lane M, Dauskardt R, Krishna N, Hashim I. Effect of Nitrogen Content on Interfacial Adhesion of the Ta/SiO 2 Interface Mrs Proceedings. 564: 281. DOI: 10.1557/Proc-564-281  0.485
1999 Lane M, Dauskardt R, Ma Q, Fujimoto H, Krishna N. Subcritical Debonding of Multilayer Interconnect Structures: Temperature and Humidity Effects Mrs Proceedings. 563. DOI: 10.1557/Proc-563-251  0.404
1998 Lane M, Ni W, Dauskardt RH, Ma Q, Fujimoto H, Krishna N. Debonding of Interfaces in Multilayer Interconnect Structures Mrs Proceedings. 514. DOI: 10.1557/Proc-514-141  0.367
1998 Dauskardt RH, Lane M, Ma Q, Krishna N. Adhesion and debonding of multi-layer thin film structures Engineering Fracture Mechanics. 61: 141-162. DOI: 10.1016/S0013-7944(98)00052-6  0.596
1997 Lane M, Ni W, Dauskardt R, Ma Q, Fujimoto H, Krishna N. Effects of Interface Nonplanarity on the Interface Fracture Energy of the TiN/SiO2System Mrs Proceedings. 505. DOI: 10.1557/Proc-505-357  0.459
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