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Alan Lee, Ph.D. - Publications

Affiliations: 
2005 Stanford University, Palo Alto, CA 
Area:
materials science
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2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Lee A, Litteken CS, Dauskardt RH, Nix WD. Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method Acta Materialia. 53: 609-616. DOI: 10.1016/J.Actamat.2004.10.014  0.42
2004 Lee A, Clemens BM, Nix WD. Stress induced delamination methods for the study of adhesion of Pt thin films to Si Acta Materialia. 52: 2081-2093. DOI: 10.1016/J.Actamat.2004.01.003  0.418
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