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Yujun Wen, Ph.D. - Publications

Affiliations: 
2004 State University of New York, Buffalo, Buffalo, NY, United States 
Area:
Applied Mechanics, Electronics and Electrical Engineering, Materials Science Engineering
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3 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2003 Basaran C, Wen Y. Coarsening in BGA solder balls: Modeling and experimental evaluation Journal of Electronic Packaging, Transactions of the Asme. 125: 426-430. DOI: 10.1115/1.1602707  0.461
2003 Wen Y, Basaran C. Thermomechanical stress analysis of multi-layered electronic packaging Journal of Electronic Packaging, Transactions of the Asme. 125: 134-138. DOI: 10.1115/1.1535446  0.509
2003 Wen Y, Basaran C. Analysis of multi-layered microelectronic packaging under uniformly distributed loading International Journal of Solids and Structures. 40: 3331-3345. DOI: 10.1016/S0020-7683(03)00092-1  0.515
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