| Year |
Citation |
Score |
| 2023 |
Nimbalkar P, Bhaskar P, Kathaperumal M, Swaminathan M, Tummala RR. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers. 15. PMID 37835944 DOI: 10.3390/polym15193895 |
0.302 |
|
| 2020 |
Dwarakanath S, Raj PM, Kondekar N, Losego MD, Tummala R. Vapor phase infiltration of aluminum oxide into benzocyclobutene-based polymer dielectrics to increase adhesion strength to thin film metal interconnects Journal of Vacuum Science & Technology A. 38: 033210. DOI: 10.1116/1.5141475 |
0.401 |
|
| 2020 |
Zhang R, Liu F, Kathaperumal M, Swaminathan M, Tummala RR. Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 393-399. DOI: 10.1109/Tcpmt.2020.2973548 |
0.307 |
|
| 2020 |
Gupte O, Murtagian G, Tummala R, Smet V. Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 828-835. DOI: 10.1109/Tcpmt.2019.2960382 |
0.355 |
|
| 2020 |
Sun T, Sharma H, Raj PM, Yoshihiro F, Hachiya S, Takemura K, Tummala R. Substrate-Embedded Low-Resistance Solenoid Inductors for Integrated Voltage Regulators Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 134-141. DOI: 10.1109/Tcpmt.2019.2956528 |
0.354 |
|
| 2020 |
Lee H, Smet V, Tummala R. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues Ieee Journal of Emerging and Selected Topics in Power Electronics. 8: 239-255. DOI: 10.1109/Jestpe.2019.2951801 |
0.34 |
|
| 2020 |
Wang Y, Watanabe AO, Ogura N, Raj PM, Tummala R. Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration Journal of Electronic Materials. 1-9. DOI: 10.1007/S11664-020-08399-X |
0.373 |
|
| 2019 |
Ogura N, Ravichandran S, Shi T, Watanabe A, Yamada S, Kathaperumal M, Tummala R. First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications International Symposium On Microelectronics. 2019: 000202-7. DOI: 10.4071/2380-4505-2019.1.000202 |
0.334 |
|
| 2019 |
Spurney RG, Sharma H, Raj PM, Tummala R, Lollis N, Weaver M, Romig M, Gandhi S, Brumm H. 3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1466-1472. DOI: 10.1109/Tcpmt.2019.2923698 |
0.387 |
|
| 2019 |
Sato Y, Imajyo N, Ishikawa K, Tummala R, Hori M. Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass Journal of Materials Science: Materials in Electronics. 30: 10183-10190. DOI: 10.1007/S10854-019-01354-5 |
0.389 |
|
| 2018 |
Ravichandran S, Yamada S, Ogawa T, Shi T, Liu F, Smet V, Sundaram V, Tummala R. Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications Journal of Microelectronics and Electronic Packaging. 16: 124-135. DOI: 10.4071/Imaps.930748 |
0.346 |
|
| 2018 |
Wu Z, Min J, Pulugurtha MR, Ravichandran S, Sundaram V, Tummala RR. 3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components Journal of Microelectronics and Electronic Packaging. 15: 107-116. DOI: 10.4071/IMAPS.656641 |
0.37 |
|
| 2018 |
Ali M, Liu F, Watanabe A, Raj PM, Sundaram V, Tentzeris MM, Tummala RR. First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications Ieee Microwave and Wireless Components Letters. 28: 1110-1112. DOI: 10.1109/Lmwc.2018.2876769 |
0.768 |
|
| 2018 |
Spurney RG, Sharma H, Pulugurtha MR, Tummala R, Lollis N, Weaver M, Gandhi S, Romig M, Brumm H. Ultra-High Density, Thin-Film Tantalum Capacitors with Improved Frequency Characteristics for MHz Switching Power Converters Journal of Electronic Materials. 47: 5632-5639. DOI: 10.1007/S11664-018-6466-4 |
0.46 |
|
| 2018 |
Watanabe AO, Raj PM, Wong D, Mullapudi R, Tummala R. Multilayered Electromagnetic Interference Shielding Structures for Suppressing Magnetic Field Coupling Journal of Electronic Materials. 47: 5243-5250. DOI: 10.1007/S11664-018-6387-2 |
0.368 |
|
| 2018 |
Demir K, Sukumaran V, Sato Y, Amrani AE, Ramachandran K, Pucha R, Raj PM, Sundaram V, Tummala R. Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications Journal of Materials Science: Materials in Electronics. 29: 12669-12680. DOI: 10.1007/S10854-018-9384-6 |
0.786 |
|
| 2017 |
Sundaram V, Liu F, Nair C, Tummala R, Kubo A, Ando T, Best K, Shay C. Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics International Symposium On Microelectronics. 2017: 000689-000693. DOI: 10.4071/ISOM-2017-THP13_159 |
0.331 |
|
| 2017 |
Wu Z, Min J, Smet V, Raj Pulugurtha M, Sundaram V, Tummala RR. Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules Journal of Electronic Packaging. 139. DOI: 10.1115/1.4037221 |
0.308 |
|
| 2017 |
Sun T, Sharma H, Raj PM, Yoshihiro F, Hachiya S, Takemura K, Tummala R. Substrate Embedded Thin-Film Inductors With Magnetic Cores for Integrated Voltage Regulators Ieee Transactions On Magnetics. 53: 1-9. DOI: 10.1109/Tmag.2017.2710324 |
0.394 |
|
| 2017 |
Suzuki Y, Snyder E, Ji C, Walther S, Gupta A, Gottschalk C, Sundaram V, Tummala R. Microvia Formation in 5- $\mu \text{m}$ -Thick Dry-Film Dielectric by Ozone Etch Processes Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 2073-2078. DOI: 10.1109/Tcpmt.2017.2748799 |
0.417 |
|
| 2017 |
Singh B, Menezes G, McCann S, Jayaram V, Ray U, Sundaram V, Pulugurtha R, Smet V, Tummala R. Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 726-733. DOI: 10.1109/Tcpmt.2017.2684464 |
0.44 |
|
| 2017 |
Suzuki Y, Hichri H, Wei F, Sundaram V, Tummala R. Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}$ Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– $40~\mu \text{m}$ I/O Pitch Interposers Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 838-845. DOI: 10.1109/Tcpmt.2017.2676023 |
0.435 |
|
| 2017 |
Sawyer BMD, Suzuki Y, Furuya R, Nair C, Huang T, Smet V, Panayappan K, Sundaram V, Tummala R. Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 552-562. DOI: 10.1109/Tcpmt.2017.2659700 |
0.429 |
|
| 2017 |
Min J, Kim M, Sun T, Raj PM, Tummala R. RF inductors with sputtered nanomagnetic films on glass substrates Journal of Materials Science: Materials in Electronics. 28: 15184-15194. DOI: 10.1007/S10854-017-7396-2 |
0.419 |
|
| 2016 |
Sawyer B, Suzuki Y, Wu Z, Lu H, Sundaram V, Panayappan K, Tummala R. Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-μm Bump Pitch Journal of Microelectronics and Electronic Packaging. 13: 128-135. DOI: 10.4071/Imaps.504 |
0.399 |
|
| 2016 |
Dwarakanath S, Raj PM, Demir K, Smet V, Sundaram V, Tummala R. Electrodeposited Copper-Graphite Composites for Low-CTE-Integrated Thermal Structures Journal of Microelectronics and Electronic Packaging. 2016: 88-93. DOI: 10.4071/Imaps.435561 |
0.425 |
|
| 2016 |
Mishra D, Raj PM, Tishler J, Sun T, Shipton E, Tummala R. Multilayered Ferromagnetic Polymer Composite Structures for High-Density Power Inductors Ieee Transactions On Magnetics. 52: 1-5. DOI: 10.1109/Tmag.2016.2589925 |
0.387 |
|
| 2016 |
Kim Y, Cho J, Kim JJ, Kim K, Cho K, Kim S, Sitaraman S, Sundaram V, Raj PM, Tummala R, Kim J. Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2016.2587824 |
0.3 |
|
| 2016 |
McCann S, Singh B, Smet V, Sundaram V, Tummala RR, Sitaraman SK. Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects Ieee Transactions On Device and Materials Reliability. 16: 622-630. DOI: 10.1109/Tdmr.2016.2614246 |
0.776 |
|
| 2016 |
McCann S, Sato Y, Sundaram V, Tummala RR, Sitaraman SK. Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates Ieee Transactions On Device and Materials Reliability. 16: 43-49. DOI: 10.1109/Tdmr.2015.2507978 |
0.776 |
|
| 2016 |
Gandhi S, Pulugurtha MR, Sharma H, Chakraborti P, Tummala RR. High-k Thin-Film Capacitors with Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2016.2606434 |
0.334 |
|
| 2016 |
Chakraborti P, Sharma H, Pulugurtha MR, Rataj KP, Schnitter C, Neuhart N, Jain S, Gandhi S, Tummala RR. Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors With Low-Leakage Currents and High-Operating Frequencies Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2016.2602213 |
0.379 |
|
| 2016 |
Shi T, Chou B, Huang TC, Ogawa T, Sato Y, Matsuura H, Kawamoto S, Sundaram V, Panayappan K, Smet V, Tummala R. Design, Demonstration and Characterization of Ultra-Thin Low-Warpage Glass BGA Packages for Smart Mobile Application Processor Proceedings - Electronic Components and Technology Conference. 2016: 1465-1470. DOI: 10.1109/ECTC.2016.372 |
0.321 |
|
| 2016 |
Singh B, Huang TC, Kawamoto S, Sundaram V, Pulugurtha R, Smet V, Tummala R. Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys Proceedings - Electronic Components and Technology Conference. 2016: 1377-1385. DOI: 10.1109/ECTC.2016.351 |
0.342 |
|
| 2016 |
Lu H, Wei F, Furuya R, Kubo A, Liu F, Sundaram V, Tummala R. Advances in Panel Scalable Planarization and High Throughput Differential Seed Layer Etching Processes for Multilayer RDL at 20 Micron I/O Pitch for 2.5D Glass Interposers Proceedings - Electronic Components and Technology Conference. 2016: 2210-2215. DOI: 10.1109/ECTC.2016.327 |
0.353 |
|
| 2016 |
Cho S, Sundaram V, Tummala R, Joshi Y. Multi-scale thermal modeling of glass interposer for mobile electronics application International Journal of Numerical Methods For Heat & Fluid Flow. 26: 1157-1171. DOI: 10.1108/Hff-09-2015-0378 |
0.352 |
|
| 2016 |
Mishra D, Raj PM, Tummala R. Design, fabrication and characterization of thin power inductors with multilayered ferromagnetic-polymer composite structures Microelectronic Engineering. 160: 34-38. DOI: 10.1016/J.Mee.2016.02.071 |
0.413 |
|
| 2016 |
Gandhi S, Xiang S, Kumar M, Sharma H, Chakraborti P, Raj PM, Tummala R. Dielectric–electrode interactions in glass and silicon-compatible thin-film (Ba,Sr)TiO3 capacitors Journal of Materials Science: Materials in Electronics. 1-6. DOI: 10.1007/S10854-016-5563-5 |
0.378 |
|
| 2016 |
Murali KP, Markondeya Raj P, Sharma H, Tummala R. CoY hexaferrite-PEEK composites for integrated and miniaturized RF components Journal of Materials Science: Materials in Electronics. 1-8. DOI: 10.1007/S10854-016-4657-4 |
0.405 |
|
| 2015 |
Sawyer B, Suzuki Y, Wu Z, Lu H, Sundaram V, Panayappan K, Tummala R. Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers International Symposium On Microelectronics. 2015: 000379-000385. DOI: 10.4071/ISOM-2015-WP24 |
0.343 |
|
| 2015 |
Qin X, Raj PM, Smet V, Tummala R. Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 1709-1719. DOI: 10.1109/Tcpmt.2015.2482962 |
0.444 |
|
| 2015 |
Han K, Swaminathan M, Pulugurtha R, Sharma H, Tummala R, Rawlings BM, Nair V. RF Characterization of Magnetodielectric Material Using Cavity Perturbation Technique Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2465383 |
0.335 |
|
| 2015 |
Suzuki Y, Furuya R, Sundaram V, Tummala RR. Demonstration of 10- $\mu $ m Microvias in Thin Dry-Film Polymer Dielectrics for High-Density Interposers Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 194-200. DOI: 10.1109/TCPMT.2014.2382339 |
0.305 |
|
| 2015 |
Sharma H, Jain S, Raj PM, Murali KP, Tummala R. Magnetic and Dielectric Property Studies in Fe- and NiFe-Based Polymer Nanocomposites Journal of Electronic Materials. DOI: 10.1007/S11664-015-3801-X |
0.332 |
|
| 2015 |
Ramachandran K, Pruyn TL, Huang T, Wang Y, Singh PM, Jud Ready W, Gerhardt RA, Sundaram V, Tummala R. Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy Journal of Materials Science: Materials in Electronics. 26: 2563-2570. DOI: 10.1007/S10854-015-2723-Y |
0.315 |
|
| 2015 |
Chakraborti P, Sharma H, Pulugurtha MR, Tummala R. XPS depth profiling and leakage properties of anodized titania dielectrics and their application in high-density capacitors Journal of Materials Science. DOI: 10.1007/S10853-015-9320-6 |
0.457 |
|
| 2014 |
Sundaram V, Tong J, Demir K, Huang T, Shorey A, Pollard S, Tummala R. High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer International Symposium On Microelectronics. 2014: 000402-000408. DOI: 10.4071/ISOM-WA16 |
0.342 |
|
| 2014 |
Chen Q, Liu X, Sundaram V, Sitaraman SK, Tummala RR. Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications Ieee Transactions On Device and Materials Reliability. 14: 1041-1048. DOI: 10.1109/Tdmr.2014.2361125 |
0.784 |
|
| 2014 |
Qin X, Kumbhat N, Raj PM, Sundaram V, Tummala R. Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 796-806. DOI: 10.1109/Tcpmt.2013.2296780 |
0.434 |
|
| 2014 |
Raj PM, Sharma H, Reddy GP, Altunyurt N, Swaminathan M, Tummala R, Nair V. Cobalt-polymer nanocomposite dielectrics for miniaturized antennas Journal of Electronic Materials. 43: 1097-1106. DOI: 10.1007/S11664-014-3025-5 |
0.386 |
|
| 2014 |
Ramachandran K, Ready WJ, Raj PM, Sundaram V, Tummala R. Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates Journal of Materials Science: Materials in Electronics. 25: 1687-1695. DOI: 10.1007/S10854-014-1784-7 |
0.344 |
|
| 2013 |
Sato Y, Chou B, Sukumaran V, Min J, Ono M, Karoui C, Dosseul F, Nopper C, Swaminathan M, Sundaram V, Tummala R. RF Device Integration on Glass Interposer toward 3D-IPAC Packages International Symposium On Microelectronics. 2013: 000825-000830. DOI: 10.4071/ISOM-2013-THP22 |
0.302 |
|
| 2013 |
Raj PM, Gangidi PR, Nataraj N, Kumbhat N, Jha GC, Tummala R, Brese N. Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 989-996. DOI: 10.1109/Tcpmt.2013.2249583 |
0.353 |
|
| 2013 |
Khan SA, Choudhury A, Kumbhat N, Pulugurtha MR, Sundaram V, Meyer-Berg G, Tummala R. Multichip Embedding Technology Using Fine-Pitch Cu–Cu Interconnections Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 197-204. DOI: 10.1109/Tcpmt.2012.2235528 |
0.397 |
|
| 2013 |
Wang Y, Xiang S, Pulugurtha MR, Sharma H, Williams B, Tummala R. All-Solution Thin-film Capacitors and Their Deposition in Trench and Through-Via Structures Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 688-695. DOI: 10.1109/Tcpmt.2012.2227963 |
0.42 |
|
| 2013 |
Ramachandran K, Liu F, Sundaram V, Tummala R. Conductive Anodic Filament Reliability of Small and Fine-Pitch Through Vias in Halogen-Free Organic Packaging Substrate Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 282-288. DOI: 10.1109/Tcpmt.2012.2227743 |
0.409 |
|
| 2013 |
Chakraborti P, Sharma H, Raj PM, Tummala R. Ultra-thin, self-healing decoupling capacitors on thin glass interposers using high surface area electrodes Proceedings - Electronic Components and Technology Conference. 1043-1047. DOI: 10.1109/ECTC.2013.6575701 |
0.31 |
|
| 2013 |
Liu X, Chen Q, Sundaram V, Tummala RR, Sitaraman SK. Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test Microelectronics Reliability. 53: 70-78. DOI: 10.1016/J.Microrel.2012.06.140 |
0.77 |
|
| 2013 |
Ramachandran K, Liu F, Raj PM, Sundaram V, Tummala R. Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates Journal of Electronic Materials. 42: 348-354. DOI: 10.1007/S11664-012-2274-4 |
0.364 |
|
| 2012 |
Sukumaran V, Bandyopadhyay T, Sundaram V, Tummala R. Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1426-1433. DOI: 10.1109/Tcpmt.2012.2204392 |
0.394 |
|
| 2012 |
Kumbhat N, Choudhury A, Mehrotra G, Raj PM, Sundaram V, Tummala R. Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1434-1441. DOI: 10.1109/Tcpmt.2012.2192120 |
0.378 |
|
| 2012 |
Lee BW, Sundaram V, Kennedy S, Baars D, Tummala R. Novel chip-last method for embedded actives in organic packaging substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 63-70. DOI: 10.1109/Tcpmt.2011.2167013 |
0.399 |
|
| 2012 |
Sharma H, Sethi K, Raj PM, Gerhardt RA, Tummala R. Mechanistic interaction study of thin oxide dielectric with conducting organic electrode Materials Chemistry and Physics. 134: 508-513. DOI: 10.1016/J.Matchemphys.2012.03.024 |
0.384 |
|
| 2012 |
Raj PM, Xiang S, Kumar M, Abothu IR, Hwang J, Liu Y, Yamamoto H, Tummala R. Leakage current suppression in solution-deposited barium titanate films on copper foils Journal of Materials Science: Materials in Electronics. 23: 901-908. DOI: 10.1007/S10854-011-0518-3 |
0.432 |
|
| 2012 |
Sharma H, Sethi K, Raj PM, Tummala R. Fabrication and characterization of novel silicon-compatible high-density capacitors Journal of Materials Science: Materials in Electronics. 23: 528-535. DOI: 10.1007/S10854-011-0431-9 |
0.451 |
|
| 2011 |
Hwang S, Min S, Swaminathan M, Sundaram V, Tummala R. Thin-Film High-Rejection Filter Integration in Low-Loss Organic Substrate Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1160-1170. DOI: 10.1109/Tcpmt.2011.2142398 |
0.406 |
|
| 2011 |
Bandyopadhyay T, Han KJ, Chung D, Chatterjee R, Swaminathan M, Tummala R. Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 893-903. DOI: 10.1109/Tcpmt.2011.2120607 |
0.337 |
|
| 2011 |
Raj PM, Lee B, Balaraman D, Tummala RR. Leakage current analysis of hydrothermal BaTiO3 thin films Journal of Electroceramics. 27: 169-175. DOI: 10.1007/S10832-011-9662-7 |
0.794 |
|
| 2010 |
Kumbhat N, Liu F, Sundaram V, Sridharan V, Choudhury A, Chan H, Tummala R. Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits International Symposium On Microelectronics. 2010: 000537-000542. DOI: 10.4071/ISOM-2010-WP1-PAPER1 |
0.331 |
|
| 2010 |
Liu F, Sridharan V, Bandyopadhyay T, Sundaram V, Tummala R, Kojima K, Shiga N, Jimbo T. Next Generation High Dk, Low Df Organic Laminate for RF Modules and High Frequency Applications International Symposium On Microelectronics. 2010: 000836-000841. DOI: 10.4071/ISOM-2010-THA3-PAPER2 |
0.328 |
|
| 2010 |
Ramachandran K, Liu F, Kumbhat N, Lee B, Sundaram V, Tummala R, Wilson M. Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D Packaging International Symposium On Microelectronics. 2010: 000829-000835. DOI: 10.4071/ISOM-2010-THA3-PAPER1 |
0.317 |
|
| 2010 |
Kumar M, Xiang S, Raj PM, Abothu IR, Hwang J, Yamamoto H, Tummala R. Electrical Reliability of Solgel Barium Titanate Films on Copper Foils for Organic Package Integration Mrs Proceedings. 1247. DOI: 10.1557/Proc-1247-C07-04 |
0.397 |
|
| 2010 |
Raj PM, Lee B, Balaraman D, Kang N, Lance MJ, Meyer H, Tummala RR. Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors Journal of the American Ceramic Society. 93: 2764-2770. DOI: 10.1111/J.1551-2916.2010.03775.X |
0.795 |
|
| 2010 |
Liu F, Sundaram V, Min S, Sridharan V, Chan H, Kumbhat N, Lee BW, Tummala R, Baars D, Kennedy S, Paul S. Chip-last embedded actives and passives in thin organic package for 1-110 GHz multi-band applications Proceedings - Electronic Components and Technology Conference. 758-763. DOI: 10.1109/ECTC.2010.5490757 |
0.353 |
|
| 2009 |
Tummala R, Wong CP, Raj PM. Nanopackaging research at Georgia Tech Ieee Nanotechnology Magazine. 3: 20-25. DOI: 10.1109/Mnano.2009.934864 |
0.322 |
|
| 2009 |
Liu F, Sundaram V, Chan H, Krishnan G, Shang J, Dobrick J, Neill J, Baars D, Kennedy S, Tummala R. Ultra-high density, thin core and low loss organic system-on-package (SOP) substrate technology for mobile applications Proceedings - Electronic Components and Technology Conference. 612-617. DOI: 10.1109/ECTC.2009.5074076 |
0.373 |
|
| 2008 |
Liu J, Fei P, Song J, Wang X, Lao C, Tummala R, Wang ZL. Carrier density and Schottky barrier on the performance of DC nanogenerator. Nano Letters. 8: 328-32. PMID 18085814 DOI: 10.1021/Nl0728470 |
0.31 |
|
| 2008 |
Wang F, Liu F, Chang G, Yao MQ, Adibi A, Tummala R. A Real-Time Precision Characterization Technique for Low-Loss Optical Polymeric Waveguide and Lightwave Circuits Journal of Microelectronics and Electronic Packaging. 5: 26-30. DOI: 10.4071/1551-4897-5.1.26 |
0.381 |
|
| 2008 |
Krishnan G, Fuhan L, Sundaram V, Pucha R, Kennedy S, Baars D, Dobrick J, Guo D, Neill J, Paul S, Tummala R. High performance organic dielectrics and high density substrates for next generation system on a package (SOP) technology Proceedings - Electronic Components and Technology Conference. 2101-2104. DOI: 10.1109/ECTC.2008.4550275 |
0.337 |
|
| 2008 |
Raj PM, Hwang JH, Jung HM, Kumar M, Jha G, Coulter K, Wellinghoff S, Iyer M, Tummala R. Low temperature (<100°C) deposited pyrochlore films with high capacitance (200 nF/cm2), low loss (∼0.003) and low TCF (<100 ppm/C) for integrating RF components Proceedings - Electronic Components and Technology Conference. 688-693. DOI: 10.1109/ECTC.2008.4550047 |
0.364 |
|
| 2008 |
Liu J, Fei P, Zhou J, Tummala R, Wang ZL. Toward high output-power nanogenerator Applied Physics Letters. 92. DOI: 10.1063/1.2918840 |
0.303 |
|
| 2008 |
Hwang J, Raj PM, Abothu IR, Yoon C, Iyer M, Jung H, Hong J, Tummala R. Temperature dependence of the dielectric properties of polymer composite based RF capacitors Microelectronic Engineering. 85: 553-558. DOI: 10.1016/J.Mee.2007.10.004 |
0.358 |
|
| 2008 |
Haj-Ali R, Kim HK, Koh SW, Saxena A, Tummala R. Nonlinear constitutive models from nanoindentation tests using artificial neural networks International Journal of Plasticity. 24: 371-396. DOI: 10.1016/J.Ijplas.2007.02.001 |
0.66 |
|
| 2007 |
Liu F, Wang F, Chang G, Tummala R, Adibi A. Capped Optical Polymeric Waveguide Journal of Optical Communications. 28. DOI: 10.1515/Joc.2007.28.2.127 |
0.325 |
|
| 2007 |
Raj PM, Balaraman D, Abothu IR, Yoon C, Kang N, Tummala R. Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via Low-Cost Solution Processing Ieee Transactions On Components and Packaging Technologies. 30: 585-594. DOI: 10.1109/Tcapt.2007.901737 |
0.807 |
|
| 2007 |
Raj PM, Balaraman D, Govind V, Abothu IR, Wan L, Gerhardt R, Swaminathan M, Tummala R. Processing and dielectric properties of nanocomposite thin film "supercapacitors" for high-frequency embedded decoupling Ieee Transactions On Components and Packaging Technologies. 30: 569-578. DOI: 10.1109/Tcapt.2007.901736 |
0.794 |
|
| 2007 |
Muthana P, Engin AE, Swaminathan M, Tummala R, Sundaram V, Wiedenman B, Amey D, Dietz KH, Banerji S. Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package Ieee Transactions On Advanced Packaging. 30: 809-822. DOI: 10.1109/Tadvp.2007.901548 |
0.349 |
|
| 2007 |
Bhattacharya SK, Varadarajan MG, Chahal P, Jha GC, Tummala RR. A novel electroless process for embedding a thin film resistor on the benzocyclobutene dielectric Journal of Electronic Materials. 36: 242-244. DOI: 10.1007/S11664-006-0058-4 |
0.608 |
|
| 2007 |
Raj PM, Abothu IR, Abdolvand R, Ayazi F, Tummala R. Integrating solution-derived 3D PZT structures on Si mems platform for RF and biomedical applications Proceedings of the International Symposium and Exhibition On Advanced Packaging Materials Processes, Properties and Interfaces. 2007: 122. |
0.336 |
|
| 2006 |
Lao CS, Liu J, Gao P, Zhang L, Davidovic D, Tummala R, Wang ZL. ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across au electrodes. Nano Letters. 6: 263-6. PMID 16464047 DOI: 10.1021/Nl052239P |
0.329 |
|
| 2006 |
Bhattacharya S, Varadarajan M, Chahal P, Lee KJ, Bhattacharjee A, Tummala RR, Sitaraman S, Papapolymerou J, Tentzeris M, Laskar J. SOP embedded thin film resistors on high and low loss thick film dielectrics Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1999-2004. |
0.636 |
|
| 2005 |
Bansal S, Saxena AM, Hartwig T, Tummala RR. Mechanical Properties of ECAE Nanocrystalline Copper and Nickel Journal of Metastable and Nanocrystalline Materials. 23: 183-186. DOI: 10.4028/Www.Scientific.Net/Jmnm.23.183 |
0.582 |
|
| 2005 |
Liu F, Wang F, Moynihan M, Sicard B, Chiarotto N, Adibi A, Yu J, Chang G, Tummala R. Evaluations of Optical Polymer for System-On-Package Frontiers in Optics. DOI: 10.1364/Fio.2005.Ftub2 |
0.326 |
|
| 2004 |
Shinotani K-, Raj PM, Seo M, Bansal S, Sakurai H, Bhattacharya SK, Tummala R. Evaluation of alternative materials for system-on-package (SOP) substrates Ieee Transactions On Components and Packaging Technologies. 27: 694-701. DOI: 10.1109/Tcapt.2004.838906 |
0.675 |
|
| 2004 |
Sundaram V, Tummala RR, Liu F, Kohl PA, Li J, Bidstrup-Allen SA, Fukuoka Y. Next-generation microvia and global wiring technologies for SOP Ieee Transactions On Advanced Packaging. 27: 315-325. DOI: 10.1109/Tadvp.2004.831890 |
0.338 |
|
| 2004 |
Chang G, Guidotti D, Liu F, Chang Y, Huang Z, Sundaram V, Balaraman D, Hegde S, Tummala RR. Chip-to-chip optoelectronics SOP on organic boards or packages Ieee Transactions On Advanced Packaging. 27: 386-397. DOI: 10.1109/Tadvp.2004.831880 |
0.787 |
|
| 2004 |
Bhattacharya SK, Raj PM, Balaraman D, Windlass H, Tummala RR. Process development for PWB compatible embedded capacitors Circuit World. 30: 31-35. DOI: 10.1108/03056120410496360 |
0.802 |
|
| 2004 |
Tummala RR, Raj PM, Atmur S, Bansal S, Banerji S, Liu F, Bhattacharya S, Sundaram V, Shinotani K, White G. Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging Journal of Electroceramics. 13: 417-422. DOI: 10.1007/S10832-004-5135-6 |
0.592 |
|
| 2004 |
Balaraman D, Raj PM, Wan L, Abothu IR, Bhattacharya S, Dalmia S, Lance MJ, Swaminathan M, Sacks MD, Tummala RR. BaTiO3 films by low-temperature hydrothermal techniques for next generation packaging applications Journal of Electroceramics. 13: 95-100. DOI: 10.1007/S10832-004-5082-2 |
0.789 |
|
| 2004 |
Aggarwal AO, Naeli K, Raj PM, Ayazi F, Bhattacharya S, Tummala RR. MEMS composite structures for tunable capacitors and IC-package nano interconnects Proceedings - Electronic Components and Technology Conference. 1: 835-842. |
0.318 |
|
| 2003 |
Windlass H, Raj PM, Balaraman D, Bhattacharya SK, Tummala RR. Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications Ieee Transactions On Advanced Packaging. 26: 10-16. DOI: 10.1109/Tadvp.2003.811369 |
0.804 |
|
| 2003 |
Sundaram V, Liu F, Aggarwal AO, Hosseini SM, Mekala S, White GE, Tummala RR, Swaminathan M, Kim W, Madhavan R, Lo G, Iyer MK, Vaidyanathan K, Wong EH, Rajoo R, et al. Ultra-high density board technology for sub-100 μm pitch nano-wafer level packaging Proceedings of 5th Electronics Packaging Technology Conference, Eptc 2003. 125-129. DOI: 10.1109/EPTC.2003.1271502 |
0.308 |
|
| 2002 |
Liu F, Lu J, Sundaram V, Sutter D, White G, Baldwin DF, Tummala RR. Reliability assessment of microvias in HDI printed circuit boards Ieee Transactions On Components and Packaging Technologies. 25: 254-259. DOI: 10.1109/Tcapt.2002.1010014 |
0.789 |
|
| 2002 |
Hobbs JM, Dalmia S, Sundaram V, Wan L, Kim W, White GE, Swaminathan M, Tummala RR. Development and characterization of embedded thin-film capacitors for mixed signal applications on fully organic system-on-package technology Proceedings - Rawcon 2002: 2002 Ieee Radio and Wireless Conference. 201-204. DOI: 10.1109/RAWCON.2002.1030152 |
0.367 |
|
| 2002 |
Lim K, Pinel S, Davis M, Sutono A, Lee C, Heo D, Obatoynbo A, Laskar J, Tantzeris EM, Tummala R. RF-system-on-package (SOP) for wireless communications Ieee Microwave Magazine. 3: 88-99. DOI: 10.1109/Mmw.2002.990700 |
0.35 |
|
| 2002 |
Brownlee K, Bhattacharya S, Shinotani KI, Wong CP, Tummala R. Liquid crystal polymers (LCP) for high performance SOP applications 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. 249-253. DOI: 10.1109/ISAPM.2002.990395 |
0.361 |
|
| 2001 |
Sundaram V, Dalmia S, Hobbs J, Bhattacharya S, Swaminathan M, White G, Tummala R. Recent Advances in SOP Integration The Japan Society of Applied Physics. 2001: 50-52. DOI: 10.7567/Ssdm.2001.B-2-1 |
0.705 |
|
| 2001 |
Bhattacharya SK, Tummala RR. Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives Journal of Electronic Packaging. 124: 1-6. DOI: 10.1115/1.1400751 |
0.405 |
|
| 1998 |
Chahal P, Tummala RR, Allen MG, Swaminathan M. A novel integrated decoupling capacitor for MCM-L technology Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 21: 184-192. DOI: 10.1109/96.673707 |
0.61 |
|
| 1997 |
Bhattacharya S, Tummala RR, Chahal P, White G. Integration of polymer/ceramic thin film capacitor on PWB Proceedings of the International Symposium and Exhibition On Advanced Packaging Materials Processes, Properties and Interfaces. 68-70. |
0.6 |
|
| 1997 |
Chahal P, Haridass A, Pham A, Tummala RR, Allen MG, Swaminathan M, Laskar J. Integration of thin film passive circuits using high/low dielectric constant materials Proceedings - Electronic Components and Technology Conference. 739-744. |
0.624 |
|
| 1992 |
Tummala RR, Knickerbocker JU, Knickerbocker SH, Herron LW, Nufer RW, Master RN, Neisser MO, Kellner BM, Perry CH, Humenik JN, Redmond TF. High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution Ibm Journal of Research and Development. 36: 889-904. DOI: 10.1147/rd.365.0889 |
0.32 |
|
| 1992 |
Tummala R, Ahmed S. Overview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module Ieee Transactions On Components, Hybrids, and Manufacturing Technology. 15: 426-431. DOI: 10.1109/33.159869 |
0.305 |
|
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